公开(公告)号：US07928435B2

公开(公告)日：2011-04-19

申请号：US12453144

申请日：2009-04-30

申请人： Sung-Yong Park ,  Tae-Je Cho ,  Tae-Hun Kim ,  Jong-Kook Kim ,  Byeong-Yeon Cho

发明人： Sung-Yong Park ,  Tae-Je Cho ,  Tae-Hun Kim ,  Jong-Kook Kim ,  Byeong-Yeon Cho

IPC分类号： H01L23/58

CPC分类号： H01L25/0657 ,  G01R31/31723 ,  G01R31/31813 ,  H01L22/32 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/49 ,  H01L2225/0651 ,  H01L2225/06572 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2224/45099 ,  H01L2924/00012

摘要： An interposer chip may include an insulating substrate, conductive patterns, and a test pattern. The conductive patterns may be formed on the insulating substrate. Further, the conductive patterns may be electrically connected to conductive wires. The test pattern may be connected to the conductive patterns. A test current for testing an electrical connection between the conductive patterns and the conductive wires may flow through the test pattern. Thus, the interposer chip may have the test pattern connected to the conductive patterns, so that the test current may flow to the test pattern through the conductive wires and the conductive patterns. As a result, an electrical connection between the conductive wires and the conductive patterns may be identified based on the test current supplied to the test pattern.

摘要翻译： 插入器芯片可以包括绝缘基板，导电图案和测试图案。 导电图案可以形成在绝缘基板上。 此外，导电图案可以电连接到导电线。 测试图案可以连接到导电图案。 用于测试导电图案和导线之间的电连接的测试电流可以流过测试图案。 因此，插入器芯片可以具有连接到导电图案的测试图案，使得测试电流可以通过导线和导电图案流到测试图案。 结果，可以基于提供给测试图案的测试电流来识别导线和导电图案之间的电连接。

公开(公告)号：US20090272974A1

公开(公告)日：2009-11-05

申请号：US12453144

申请日：2009-04-30

申请人： Sung-Yong Park ,  Tae-Je Cho ,  Tae-Hun Kim ,  Jong-Kook Kim ,  Byeong-Yeon Cho

发明人： Sung-Yong Park ,  Tae-Je Cho ,  Tae-Hun Kim ,  Jong-Kook Kim ,  Byeong-Yeon Cho

IPC分类号： H01L23/58 ,  H05K1/16

CPC分类号： H01L25/0657 ,  G01R31/31723 ,  G01R31/31813 ,  H01L22/32 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/49 ,  H01L2225/0651 ,  H01L2225/06572 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2224/45099 ,  H01L2924/00012

摘要： An interposer chip may include an insulating substrate, conductive patterns, and a test pattern. The conductive patterns may be formed on the insulating substrate. Further, the conductive patterns may be electrically connected to conductive wires. The test pattern may be connected to the conductive patterns. A test current for testing an electrical connection between the conductive patterns and the conductive wires may flow through the test pattern. Thus, the interposer chip may have the test pattern connected to the conductive patterns, so that the test current may flow to the test pattern through the conductive wires and the conductive patterns. As a result, an electrical connection between the conductive wires and the conductive patterns may be identified based on the test current supplied to the test pattern.

摘要翻译： 插入器芯片可以包括绝缘基板，导电图案和测试图案。 导电图案可以形成在绝缘基板上。 此外，导电图案可以电连接到导电线。 测试图案可以连接到导电图案。 用于测试导电图案和导线之间的电连接的测试电流可以流过测试图案。 因此，插入器芯片可以具有连接到导电图案的测试图案，使得测试电流可以通过导线和导电图案流到测试图案。 结果，可以基于提供给测试图案的测试电流来识别导线和导电图案之间的电连接。

公开(公告)号：US20090317947A1

公开(公告)日：2009-12-24

申请号：US12461640

申请日：2009-08-19

申请人： Heung-kyu Kwon ,  Tae-Hun Kim ,  Sung-Yong Park

发明人： Heung-kyu Kwon ,  Tae-Hun Kim ,  Sung-Yong Park

IPC分类号： H01L21/60

CPC分类号： H01L23/49816 ,  H01L21/4871 ,  H01L23/3128 ,  H01L23/36 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package may include a heat sink. The heat sink may be disposed above and spaced apart from a substrate, which may support a semiconductor chip. The heat sink may have a hole. A liquid molding compound may be provided through the hole of the heat sink to form an encapsulant. The encapsulant may seal the semiconductor chip, leaving an upper portion of the heat sink exposed. A tape supporting the heat sink may be provided on the substrate. The tape may be removed after the encapsulant is provided.

摘要翻译： 半导体封装可以包括散热器。 散热器可以布置在可以支撑半导体芯片的衬底的上方并与之隔开。 散热器可能有一个孔。 可以通过散热器的孔提供液体模塑料以形成密封剂。 密封剂可以密封半导体芯片，留下散热器的上部。 可以在基板上设置支撑散热器的带。 在提供密封剂之后可以去除胶带。

公开(公告)号：US20070152350A1

公开(公告)日：2007-07-05

申请号：US11539133

申请日：2006-10-05

申请人： Tae-Hun Kim ,  Hak-Kyoon Byun ,  Sung-Yong Park ,  Heung-Kyu Kwon

发明人： Tae-Hun Kim ,  Hak-Kyoon Byun ,  Sung-Yong Park ,  Heung-Kyu Kwon

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H05K3/3436 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/562 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K2201/09781 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/4554

摘要： A wiring substrate having variously sized ball pads, a semiconductor package including the wiring substrate, and a stack package using the semiconductor package, to improve board level reliability (BLR) of a semiconductor package or stack package mounted on a mother board are shown. Outer ball pads are formed to have relatively greater surface areas at the corners of the semiconductor package as compared to those at other areas and are formed to have the greatest surface area within a designable range. Additionally, occurrence of cracks may be inhibited at junctions of other solder balls by forming dummy solder pads at the outermost corners among the outer ball pads formed proximate to the corners of the wiring substrate. Stress arising during a board level reliability test is absorbed without product failure at junctions between the dummy solder pads and dummy solder balls.

摘要翻译： 示出了具有各种尺寸的球垫的布线基板，包括布线基板的半导体封装和使用半导体封装的堆叠封装，以提高安装在母板上的半导体封装或堆叠封装的电路板级可靠性（BLR）。 与其他区域相比，外球垫形成为在半导体封装的角部处具有相对较大的表面积，并且形成为具有可设计范围内的最大表面积。 此外，通过在靠近布线基板的角部形成的外球垫中的最外角处形成虚拟焊盘，可以抑制其它焊球的接合处的裂缝的发生。 在电路板级可靠性测试中产生的应力在虚拟焊盘和虚拟焊球之间的接合处被吸收而没有产品故障。

公开(公告)号：US07795743B2

公开(公告)日：2010-09-14

申请号：US11539133

申请日：2006-10-05

申请人： Tae-Hun Kim ,  Hak-Kyoon Byun ,  Sung-Yong Park ,  Heung-Kyu Kwon

发明人： Tae-Hun Kim ,  Hak-Kyoon Byun ,  Sung-Yong Park ,  Heung-Kyu Kwon

IPC分类号： H01L23/48

CPC分类号： H05K3/3436 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/562 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K2201/09781 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/4554

摘要： A wiring substrate having variously sized ball pads, a semiconductor package including the wiring substrate, and a stack package using the semiconductor package, to improve board level reliability (BLR) of a semiconductor package or stack package mounted on a mother board are shown. Outer ball pads are formed to have relatively greater surface areas at the corners of the semiconductor package as compared to those at other areas and are formed to have the greatest surface area within a designable range. Additionally, occurrence of cracks may be inhibited at junctions of other solder balls by forming dummy solder pads at the outermost corners among the outer ball pads formed proximate to the corners of the wiring substrate. Stress arising during a board level reliability test is absorbed without product failure at junctions between the dummy solder pads and dummy solder balls.

摘要翻译： 示出了具有各种尺寸的球垫的布线基板，包括布线基板的半导体封装和使用半导体封装的堆叠封装，以提高安装在母板上的半导体封装或堆叠封装的电路板级可靠性（BLR）。 与其他区域相比，外球垫形成为在半导体封装的角部处具有相对较大的表面积，并且形成为具有可设计范围内的最大表面积。 此外，通过在靠近布线基板的角部形成的外球垫中的最外角处形成虚拟焊盘，可以抑制其它焊球的接合处的裂缝的发生。 在电路板级可靠性测试中产生的应力在虚拟焊盘和虚拟焊球之间的接合处被吸收而没有产品故障。

公开(公告)号：US20070114677A1

公开(公告)日：2007-05-24

申请号：US11434143

申请日：2006-05-16

申请人： Heung-Kyu Kwon ,  Tae-Hun Kim ,  Sung-Yong Park

发明人： Heung-Kyu Kwon ,  Tae-Hun Kim ,  Sung-Yong Park

IPC分类号： H01L23/28

CPC分类号： H01L23/49816 ,  H01L21/4871 ,  H01L23/3128 ,  H01L23/36 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package may include a heat sink. The heat sink may be disposed above and spaced apart from a substrate, which may support a semiconductor chip. The heat sink may have a hole. A liquid molding compound may be provided through the hole of the heat sink to form an encapsulant. The encapsulant may seal the semiconductor chip, leaving an upper portion of the heat sink exposed. A tape supporting the heat sink may be provided on the substrate. The tape may be removed after the encapsulant is provided.

摘要翻译： 半导体封装可以包括散热器。 散热器可以布置在可以支撑半导体芯片的衬底的上方并与之隔开。 散热器可能有一个孔。 可以通过散热器的孔提供液体模塑料以形成密封剂。 密封剂可以密封半导体芯片，留下散热器的上部。 可以在基板上设置支撑散热器的带。 在提供密封剂之后可以去除胶带。

公开(公告)号：US07888602B2

公开(公告)日：2011-02-15

申请号：US12120622

申请日：2008-05-14

申请人： Sung-Yong Park

发明人： Sung-Yong Park

IPC分类号： H05K1/00

CPC分类号： H05K1/0272 ,  B33Y70/00 ,  H05K1/183 ,  H05K3/284 ,  H05K2203/1178

摘要： Provided is a printed circuit board having air vents and a semiconductor package that uses the printed circuit board having the air vents. The printed circuit board includes a substrate layer having a circuit pattern and a protection layer formed on the substrate layer, a molding region on which at least one semiconductor chip is mounted and for which a molding for the semiconductor chip is performed, and a plurality of air vents extending towards edges of the printed circuit board from the molding region.

摘要翻译： 提供了一种具有通风口的印刷电路板和使用具有通风口的印刷电路板的半导体封装。 印刷电路板包括具有电路图案的基板层和形成在基板层上的保护层，在其上安装有至少一个半导体芯片并且用于其的半导体芯片的模制件的模制区域，以及多个 从成型区域向印刷电路板的边缘延伸的通气口。

公开(公告)号：US07419278B2

公开(公告)日：2008-09-02

申请号：US11517774

申请日：2006-09-08

申请人： Sung-Yong Park

发明人： Sung-Yong Park

IPC分类号： F21S4/00

CPC分类号： G02F1/133608 ,  G02F1/133604

摘要： A lamp guide holder includes a horizontal part that has a front surface and a rear surface, a fixing part that extends from the rear surface, and at least one lamp holding part on the front surface and having a ring shape. The lamp holding part has at least one protrusion on an inner surface thereof. The lamp guide holder further comprises a supporting part that extends from the front surface.

摘要翻译： 灯具保持器包括具有前表面和后表面的水平部分，从后表面延伸的固定部分和在前表面上的至少一个灯保持部分并具有环形形状。 灯保持部件在其内表面上具有至少一个突出部。 灯引导架还包括从前表面延伸的支撑部分。

公开(公告)号：US20070053171A1

公开(公告)日：2007-03-08

申请号：US11517774

申请日：2006-09-08

申请人： Sung-Yong Park

发明人： Sung-Yong Park

IPC分类号： G01D11/28

CPC分类号： G02F1/133608 ,  G02F1/133604

摘要： A lamp guide holder includes a horizontal part that has a front surface and a rear surface, a fixing part that extends from the rear surface, and at least one lamp holding part on the front surface and having a ring shape. The lamp holding part has at least one protrusion on an inner surface thereof. The lamp guide holder further comprises a supporting part that extends from the front surface.

摘要翻译： 灯具保持器包括具有前表面和后表面的水平部分，从后表面延伸的固定部分和在前表面上的至少一个灯保持部分并具有环形形状。 灯保持部件在其内表面上具有至少一个突出部。 灯引导架还包括从前表面延伸的支撑部分。

公开(公告)号：USD530342S1

公开(公告)日：2006-10-17

申请号：US29237836

申请日：2005-09-08

申请人： Jae-Hoon Lee ,  Sung-Yong Park

设计人： Jae-Hoon Lee ,  Sung-Yong Park