公开(公告)号：US11879077B2

公开(公告)日：2024-01-23

申请号：US16956393

申请日：2019-02-05

Applicant: THREEBOND CO., LTD.

Inventor： Kentaro Watanabe

IPC: C09J171/00 ,  C09J5/00 ,  C09J11/04 ,  C09K5/14 ,  H05K7/20 ,  C09D201/10 ,  C08K5/54

CPC classification number: C09J171/00 ,  C08K5/54 ,  C09D201/10 ,  C09J5/00 ,  C09J11/04 ,  C09K5/14 ,  H05K7/2039 ,  C09J2203/326 ,  C09J2471/00 ,  C09J2483/00

Abstract: The purpose of the present invention is to provide a thermally conductive moisture-curable resin composition which develops excellent thermal conductivity and peelability after curing.
The thermally conductive moisture-curable resin composition contains the following components (A) to (C):



component (A): an organic polymer containing two or more hydrolyzable silyl groups;
component (B): a thermally conductive filler; and
component (C): a silicone compound having a polar group and/or a polar chain at a terminal or a side chain.

公开(公告)号：US11767451B2

公开(公告)日：2023-09-26

申请号：US16956393

申请日：2019-02-05

Applicant: THREEBOND CO., LTD.

Inventor： Kentaro Watanabe

IPC: C09J171/00 ,  C09J5/00 ,  C09J11/04 ,  C09K5/14 ,  H05K7/20 ,  C09D201/10 ,  C08K5/54

CPC classification number: C09J171/00 ,  C08K5/54 ,  C09D201/10 ,  C09J5/00 ,  C09J11/04 ,  C09K5/14 ,  H05K7/2039 ,  C09J2203/326 ,  C09J2471/00 ,  C09J2483/00

Abstract: The purpose of the present invention is to provide a thermally conductive moisture-curable resin composition which develops excellent thermal conductivity and peelability after curing.
The thermally conductive moisture-curable resin composition contains the following components (A) to (C):



component (A): an organic polymer containing two or more hydrolyzable silyl groups;
component (B): a thermally conductive filler; and
component (C): a silicone compound having a polar group and/or a polar chain at a terminal or a side chain.

公开(公告)号：US11155669B2

公开(公告)日：2021-10-26

申请号：US16330894

申请日：2017-09-05

Applicant: THREEBOND CO., LTD.

Inventor： Kentaro Watanabe

IPC: C08G18/10 ,  C08G18/32 ,  C08L79/02 ,  C08L33/14 ,  C08L63/00 ,  B32B27/30 ,  B32B27/40 ,  C08L33/10 ,  B32B27/00 ,  C08G18/76 ,  C08G18/44 ,  C08G18/00 ,  C08G18/36 ,  B32B27/28 ,  B32B9/04 ,  B32B15/20 ,  C08G18/34 ,  B32B17/06 ,  B32B9/00 ,  B32B27/34 ,  B32B15/18 ,  B32B27/36 ,  C08L83/14 ,  B32B15/09 ,  B32B15/085 ,  B32B27/32 ,  B32B15/082 ,  C08G18/18 ,  B32B15/088 ,  B32B7/12 ,  C09J183/14 ,  B32B27/08 ,  C08K5/24

Abstract: A manner for improving storage stability of a curable resin composition and close adhesion of a cured product to a polycarbonate. The present description relates to a curable resin composition including the following components (A) to (C): component (A): an isocyanate group-containing urethane prepolymer, component (B): a powder of a polyamine compound which is solid at 25° C., and component (C): at least one selected from the group consisting of a monofunctional (meth)acrylate compound having an alicyclic structure or a monofunctional (meth)acrylate compound having an aromatic ring, a monofunctional (meth)acrylate compound having a hydrolyzable silyl group, and a polyfunctional (meth)acrylate compound, where the composition does not substantially include a photoradical initiator.