公开(公告)号：US20180019226A1

公开(公告)日：2018-01-18

申请号：US15644379

申请日：2017-07-07

申请人： TOKYO ELECTRON LIMITED

发明人： Masataka MATSUNAGA ,  Takahiro MASUNAGA ,  Yasutaka SOMA ,  Takashi KOGA ,  Shogo HARA ,  Masaaki UMITSUKI ,  Kazutoshi ISHIMARU ,  Fumio SAKATA

IPC分类号： H01L23/00 ,  B32B37/00 ,  B32B41/00

CPC分类号： H01L24/83 ,  B32B37/025 ,  B32B41/00 ,  B32B2457/14 ,  H01L24/74 ,  H01L24/75 ,  H01L24/80 ,  H01L24/94 ,  H01L2224/74 ,  H01L2224/7501 ,  H01L2224/7525 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75501 ,  H01L2224/75502 ,  H01L2224/7565 ,  H01L2224/75701 ,  H01L2224/75702 ,  H01L2224/75724 ,  H01L2224/75725 ,  H01L2224/75743 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/75901 ,  H01L2224/80009 ,  H01L2224/80013 ,  H01L2224/8002 ,  H01L2224/80123 ,  H01L2224/80129 ,  H01L2224/8013 ,  H01L2224/80132 ,  H01L2224/80201 ,  H01L2224/80894 ,  H01L2224/80908 ,  H01L2224/83031 ,  H01L2224/83122 ,  H01L2224/83896 ,  H01L2224/94 ,  H01L2224/80 ,  H01L2924/00012

摘要： A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate to a bonding apparatus, a first holding plate configured to hold the first substrate from an upper surface side, and a second holding plate disposed below the first holding plate and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate. The substrate transfer device includes a first holding part capable of holding the first substrate from the upper surface side, and a second holding part disposed below the first holding part and capable of holding the second substrate from the lower surface side. The first holding part and the second holding part are configured to receive and hold the first substrate and the second substrate at the same time from the first holding plate and the second holding plate.

公开(公告)号：US20180019153A1

公开(公告)日：2018-01-18

申请号：US15644318

申请日：2017-07-07

申请人： TOKYO ELECTRON LIMITED

发明人： Masataka MATSUNAGA ,  Takahiro MASUNAGA ,  Takashi KOGA ,  Yasuharu IWASHITA ,  Shingo KATSUKI ,  Masaaki UMITSUKI ,  Kazutoshi ISHIMARU ,  Fumio SAKATA

IPC分类号： H01L21/683 ,  H01L21/68 ,  H01L21/67

摘要： A substrate transfer device for transferring a first substrate and a second substrate to a bonding apparatus configured to bond the first substrate and the second substrate, includes a first holding part configured to hold the first substrate from an upper surface side, a lower surface of the first substrate serving as a bonding surface, and a second holding part provided below the first holding part and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate, a upper surface of the second substrate serving as a bonding surface to be bonded to the lower surface of the first substrate.