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公开(公告)号：US11978825B2
公开(公告)日：2024-05-07
申请号：US17388949
申请日：2021-07-29
申请人： Apple Inc.
IPC分类号： H01L33/14 , H01L23/00 , H01L25/075 , H01L27/01 , H01L27/15 , H01L33/00 , H01L33/06 , H01L33/30 , H01L33/42 , G09G3/32 , H01L33/16 , H01L33/20
CPC分类号： H01L33/145 , H01L24/75 , H01L24/95 , H01L25/0753 , H01L27/016 , H01L27/156 , H01L33/0093 , H01L33/06 , H01L33/14 , H01L33/30 , H01L33/42 , G09G3/32 , H01L33/0016 , H01L33/0095 , H01L33/16 , H01L33/20 , H01L2224/75305 , H01L2224/75725 , H01L2224/7598 , H01L2224/82203 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/12041 , H01L2924/00 , H01L2924/12042 , H01L2924/00 , H01L2924/12044 , H01L2924/00
摘要： Methods and structures for forming arrays of LED devices are disclosed. The LED devices in accordance with embodiments of the invention may include an internally confined current injection area to reduce non-radiative recombination due to edge effects. Several manners for confining current may include etch removal of a current distribution layer, etch removal of a current distribution layer and active layer followed by mesa re-growth, isolation by ion implant or diffusion, quantum well intermixing, and oxide isolation.
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公开(公告)号：US09865832B2
公开(公告)日：2018-01-09
申请号：US14798298
申请日：2015-07-13
申请人： Apple Inc.
IPC分类号： H01L27/15 , H01L27/12 , H01L51/50 , G09G3/00 , H01L23/00 , H01L21/683 , G09G3/3208
CPC分类号： H01L51/50 , G09G3/006 , G09G3/3208 , H01L21/6835 , H01L24/24 , H01L24/32 , H01L24/75 , H01L24/82 , H01L24/83 , H01L24/97 , H01L27/1214 , H01L27/156 , H01L2221/68368 , H01L2221/68381 , H01L2224/2401 , H01L2224/24011 , H01L2224/2405 , H01L2224/24137 , H01L2224/24227 , H01L2224/245 , H01L2224/29005 , H01L2224/29109 , H01L2224/29111 , H01L2224/29113 , H01L2224/29118 , H01L2224/29124 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29155 , H01L2224/32014 , H01L2224/32057 , H01L2224/32237 , H01L2224/32503 , H01L2224/75252 , H01L2224/75301 , H01L2224/7565 , H01L2224/75725 , H01L2224/759 , H01L2224/7598 , H01L2224/82101 , H01L2224/82102 , H01L2224/82104 , H01L2224/83 , H01L2224/83005 , H01L2224/83192 , H01L2224/83193 , H01L2224/83203 , H01L2224/83805 , H01L2224/8381 , H01L2224/83825 , H01L2224/8383 , H01L2224/97 , H01L2924/0781 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/00014 , H01L2924/01049 , H01L2924/0105 , H01L2924/00012 , H01L2924/053 , H01L2924/0549 , H01L2924/0543 , H01L2924/0544 , H01L2924/0103 , H01L2924/01013 , H01L2924/01042 , H01L2924/01022 , H01L2924/01074 , H01L2924/01047 , H01L2924/01079 , H01L2924/00
摘要： A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.
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公开(公告)号：US09859246B2
公开(公告)日：2018-01-02
申请号：US14917318
申请日：2014-12-18
发明人： Andreas Fehkuhrer
IPC分类号： H01L21/00 , H01L23/00 , B32B37/00 , H01L21/18 , H01L21/304 , H01L21/67 , H01L21/683 , H01L25/065 , H01L25/00 , H01L23/544 , B32B38/18
CPC分类号： H01L24/80 , B32B37/0046 , B32B38/1841 , B32B38/1858 , B32B2309/105 , B32B2457/14 , H01L21/187 , H01L21/304 , H01L21/67092 , H01L21/6831 , H01L21/6835 , H01L21/6836 , H01L21/78 , H01L23/544 , H01L24/08 , H01L24/74 , H01L24/75 , H01L24/94 , H01L24/95 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2221/68327 , H01L2221/68363 , H01L2221/68368 , H01L2221/68381 , H01L2223/54426 , H01L2223/54453 , H01L2224/0224 , H01L2224/0381 , H01L2224/0382 , H01L2224/03831 , H01L2224/0384 , H01L2224/08121 , H01L2224/08145 , H01L2224/74 , H01L2224/75251 , H01L2224/75272 , H01L2224/75701 , H01L2224/75702 , H01L2224/75704 , H01L2224/75705 , H01L2224/75724 , H01L2224/75725 , H01L2224/75734 , H01L2224/75735 , H01L2224/75744 , H01L2224/75745 , H01L2224/7598 , H01L2224/80 , H01L2224/80003 , H01L2224/80006 , H01L2224/8001 , H01L2224/80011 , H01L2224/8002 , H01L2224/80047 , H01L2224/80051 , H01L2224/80093 , H01L2224/80099 , H01L2224/8013 , H01L2224/80132 , H01L2224/80201 , H01L2224/80203 , H01L2224/80209 , H01L2224/80213 , H01L2224/80801 , H01L2224/80894 , H01L2224/80907 , H01L2224/92 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2225/06565 , H01L2924/00014 , H01L2924/00012 , H01L2221/68304
摘要： A method for bonding a first substrate with a second substrate, characterized in that the first substrate and/or the second substrate is/are thinned before the bonding.
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公开(公告)号：US20170221856A1
公开(公告)日：2017-08-03
申请号：US15519542
申请日：2015-10-19
申请人： BONDTECH CO., LTD.
发明人： Akira YAMAUCHI
IPC分类号： H01L23/00 , H01L21/683 , H01L21/67
CPC分类号： H01L24/83 , B23K20/023 , B23K20/233 , B23K20/24 , B23K37/0408 , B23K37/047 , B23K2101/40 , B23K2103/50 , H01L21/187 , H01L21/67092 , H01L21/67259 , H01L21/68 , H01L21/6831 , H01L21/6838 , H01L21/68735 , H01L23/544 , H01L24/75 , H01L24/80 , H01L24/94 , H01L2223/54426 , H01L2224/08145 , H01L2224/08146 , H01L2224/7501 , H01L2224/75102 , H01L2224/75251 , H01L2224/75252 , H01L2224/75272 , H01L2224/75303 , H01L2224/75305 , H01L2224/757 , H01L2224/75701 , H01L2224/75702 , H01L2224/75704 , H01L2224/75705 , H01L2224/75724 , H01L2224/75725 , H01L2224/75744 , H01L2224/75745 , H01L2224/75753 , H01L2224/759 , H01L2224/75901 , H01L2224/7592 , H01L2224/75981 , H01L2224/80012 , H01L2224/80013 , H01L2224/8003 , H01L2224/80047 , H01L2224/8009 , H01L2224/8013 , H01L2224/80132 , H01L2224/80203 , H01L2224/80213 , H01L2224/80893 , H01L2224/80895 , H01L2224/80896 , H01L2224/80907 , H01L2224/80908 , H01L2224/80986 , H01L2224/83009 , H01L2224/8309 , H01L2224/83896 , H01L2224/83908 , H01L2224/94 , H01L2924/00012 , H01L2224/80 , H01L2924/00014 , H01L2224/8001 , H01L2224/80009 , H01L2224/80121
摘要： A production of voids between substrates is prevented when the substrates are bonded together, and the substrates are bonded together at a high positional precision while suppressing a strain. A method for bonding a first substrate and a second substrate includes a step of performing hydrophilization treatment to cause water or an OH containing substance to adhere to bonding surface of the first substrate and the bonding surface of the second substrate, a step of disposing the first substrate and the second substrate with the respective bonding surfaces facing each other, and bowing the first substrate in such a way that a central portion of the bonding surface protrudes toward the second substrate side relative to an outer circumferential portion of the bonding surface, a step of abutting the bonding surface of the first substrate with the bonding surface of the second substrate at the respective central portions, and a step of abutting the bonding surface of the first substrate with the bonding surface of the second substrate across the entirety of the bonding surfaces, decreasing a distance between the outer circumferential portion of the first substrate and an outer circumferential portion of the second substrate with the respective central portions abutting each other at a pressure that maintains a non-bonded condition.
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公开(公告)号：US09463613B2
公开(公告)日：2016-10-11
申请号：US14307321
申请日：2014-06-17
IPC分类号： B29C65/50 , B32B43/00 , B32B38/18 , B32B37/00 , B30B5/00 , B30B15/34 , H01L23/00 , H01L21/67
CPC分类号： H01L29/167 , B32B38/18 , H01L21/67144 , H01L24/75 , H01L24/83 , H01L24/95 , H01L24/97 , H01L25/0753 , H01L33/62 , H01L2224/75725 , H01L2224/7598 , H01L2224/83005 , H01L2224/97 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/1421 , H01L2924/1431 , H01L2924/1434 , H01L2924/1461 , H01L2933/0066 , Y10T156/1153 , Y10T156/17 , Y10T156/1705 , Y10T156/1707 , Y10T156/1744 , Y10T156/1749 , Y10T156/1776 , Y10T156/1911 , H01L2224/83 , H01L2924/00
摘要： A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.
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公开(公告)号：US20160176045A1
公开(公告)日：2016-06-23
申请号：US15054977
申请日：2016-02-26
IPC分类号： B25J9/10 , B25J15/00 , H01L23/00 , H01L21/677 , H01L21/68 , B25J7/00 , H01L21/683
CPC分类号： B25J9/1015 , B25J7/00 , B25J9/0015 , B25J15/0052 , B25J15/0085 , B25J17/0208 , H01L21/67144 , H01L21/67721 , H01L21/68 , H01L21/6833 , H01L24/75 , H01L24/95 , H01L2224/75251 , H01L2224/75252 , H01L2224/75282 , H01L2224/7565 , H01L2224/75723 , H01L2224/75725 , H01L2224/75823 , H01L2224/759 , H01L2224/75901 , H01L2224/7592 , H01L2224/7598 , H01L2224/75984 , H01L2924/12041 , H01L2924/12042 , H01L2924/1461 , H01L2924/00
摘要： Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.
摘要翻译： 公开了用于从载体衬底传送微器件的系统和方法。 在一个实施例中，质量传递工具操纵器组件允许在微拾取阵列上的静电转印头阵列和载体衬底上的微器件阵列之间的主动对准。 可以检测质量传递工具操纵器组件的柔性元件的位移，以控制静电转印头阵列与微器件阵列之间的对准。
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公开(公告)号：US20160013170A1
公开(公告)日：2016-01-14
申请号：US14860185
申请日：2015-09-21
发明人： Kapil V. Sakariya , Andreas Bibl , Hsin-Hua Hu
CPC分类号： H01L25/167 , H01L24/24 , H01L24/29 , H01L24/75 , H01L24/82 , H01L24/83 , H01L24/95 , H01L27/1214 , H01L33/06 , H01L33/38 , H01L33/42 , H01L33/54 , H01L33/62 , H01L2224/29109 , H01L2224/29111 , H01L2224/29113 , H01L2224/29118 , H01L2224/29124 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29155 , H01L2224/73267 , H01L2224/75281 , H01L2224/75282 , H01L2224/75725 , H01L2224/7598 , H01L2224/83193 , H01L2224/8381 , H01L2224/83825 , H01L2224/92244 , H01L2924/01322 , H01L2924/10156 , H01L2924/12041 , H01L2924/12044 , H01L2924/00
摘要： A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. An array of micro LED devices are bonded to the corresponding array of bottom electrodes within the array of bank openings. An array of top electrode layers are formed electrically connecting the array of micro LED devices to a ground line in the non-pixel area.
摘要翻译： 描述显示面板和形成显示面板的方法。 显示面板可以包括包括像素区域和非像素区域的薄膜晶体管基板。 像素区域包括堤开口的阵列和堤开口阵列内的一组底部电极。 一组微型LED器件结合到阵列阵列内的相应阵列的底部电极。 形成将微型LED器件的阵列电连接到非像素区域中的接地线的顶部电极层的阵列。
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公开(公告)号：US20140241843A1
公开(公告)日：2014-08-28
申请号：US13776158
申请日：2013-02-25
CPC分类号： B25J9/1015 , B25J7/00 , B25J9/0015 , B25J15/0052 , B25J15/0085 , B25J17/0208 , H01L21/67144 , H01L21/67721 , H01L21/68 , H01L21/6833 , H01L24/75 , H01L24/95 , H01L2224/75251 , H01L2224/75252 , H01L2224/75282 , H01L2224/7565 , H01L2224/75723 , H01L2224/75725 , H01L2224/75823 , H01L2224/759 , H01L2224/75901 , H01L2224/7592 , H01L2224/7598 , H01L2224/75984 , H01L2924/12041 , H01L2924/12042 , H01L2924/1461 , H01L2924/00
摘要： Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.
摘要翻译： 公开了用于从载体衬底传送微器件的系统和方法。 在一个实施例中，质量传递工具操纵器组件允许在微拾取阵列上的静电转印头阵列和载体衬底上的微器件阵列之间的主动对准。 可以检测质量传递工具操纵器组件的柔性元件的位移，以控制静电转印头阵列与微器件阵列之间的对准。
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公开(公告)号：US20240014079A1
公开(公告)日：2024-01-11
申请号：US18474731
申请日：2023-09-26
申请人： NIKON CORPORATION
发明人： Isao SUGAYA , Eiji ARIIZUMI , Yoshiaki KITO , Mikio USHIJIMA , Masanori ARAMATA , Naoto KIRIBE , Hiroshi SHIRASU , Hajime MITSUISHI , Minoru FUKUDA , Masaki TSUNODA
IPC分类号： H01L21/66 , H01L21/67 , H01L21/683 , H01L21/687 , H01L23/00
CPC分类号： H01L22/12 , H01L21/67092 , H01L21/67259 , H01L21/6838 , H01L21/67253 , H01L21/6831 , H01L21/68764 , H01L24/75 , H01L2224/75725 , H01L2224/75745 , H01L2224/75304 , H01L2224/759
摘要： To improve the throughput of substrate bonding. A substrate bonding apparatus that bonds first and second substrates so that contact regions in which the first and second substrates contact are formed in parts of the first and second substrates and the contact regions enlarge from the parts, the apparatus including: a detecting unit detecting information about the contact regions; and a determining unit determining that the first and second substrates can be carried out based on the information detected at the detecting unit. In the substrate bonding apparatus, the information may be information, a value of which changes according to progress of enlargement of the contact regions, and the determining unit may determine that the first and second substrates can be carried out if the value becomes constant or if a rate of changes in the value becomes lower than a predetermined value.
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公开(公告)号：US20180096962A1
公开(公告)日：2018-04-05
申请号：US15820907
申请日：2017-11-22
发明人： Andreas Fehkuhrer
IPC分类号： H01L23/00 , H01L25/00 , B32B37/00 , H01L23/544 , H01L21/683 , H01L21/67 , H01L21/304 , H01L21/18 , B32B38/18 , H01L25/065 , H01L21/78
CPC分类号： H01L24/80 , B32B37/0046 , B32B38/1841 , B32B38/1858 , B32B2309/105 , B32B2457/14 , H01L21/187 , H01L21/304 , H01L21/67092 , H01L21/6831 , H01L21/6835 , H01L21/6836 , H01L21/78 , H01L23/544 , H01L24/08 , H01L24/74 , H01L24/75 , H01L24/94 , H01L24/95 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2221/68327 , H01L2221/68363 , H01L2221/68368 , H01L2221/68381 , H01L2223/54426 , H01L2223/54453 , H01L2224/0224 , H01L2224/0381 , H01L2224/0382 , H01L2224/03831 , H01L2224/0384 , H01L2224/08121 , H01L2224/08145 , H01L2224/74 , H01L2224/75251 , H01L2224/75272 , H01L2224/75701 , H01L2224/75702 , H01L2224/75704 , H01L2224/75705 , H01L2224/75724 , H01L2224/75725 , H01L2224/75734 , H01L2224/75735 , H01L2224/75744 , H01L2224/75745 , H01L2224/7598 , H01L2224/80 , H01L2224/80003 , H01L2224/80006 , H01L2224/8001 , H01L2224/80011 , H01L2224/8002 , H01L2224/80047 , H01L2224/80051 , H01L2224/80093 , H01L2224/80099 , H01L2224/8013 , H01L2224/80132 , H01L2224/80201 , H01L2224/80203 , H01L2224/80209 , H01L2224/80213 , H01L2224/80801 , H01L2224/80894 , H01L2224/80907 , H01L2224/92 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2225/06565 , H01L2924/00014 , H01L2924/00012 , H01L2221/68304
摘要： A method for bonding a first substrate with a second substrate, characterized in that the first substrate and/or the second substrate is/are thinned before the bonding.
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