公开(公告)号：US09914261B2

公开(公告)日：2018-03-13

申请号：US14015777

申请日：2013-08-30

申请人： Toshiba Kikai Kabushiki Kaisha

发明人： Yuki Sugiura ,  Mitsunori Kokubo ,  Shigeru Fujiwara ,  Hidetoshi Kitahara ,  Yu Murofushi ,  Isao Matsuzuki ,  Takato Baba ,  Toru Suzuki

IPC分类号： B29C59/04

CPC分类号： B29C59/043 ,  B29C59/04 ,  B29C59/046 ,  Y10T428/24479

摘要： A transfer device that transfers a fine transfer pattern formed on a master mold to a molded material, includes a first transfer unit that transfers the fine transfer pattern formed on the master mold to a replica mold made from a material that transmits light; and a second transfer unit that transfers a fine transfer pattern formed on the replica mold by the first transfer unit to the molded material.

公开(公告)号：US09604402B2

公开(公告)日：2017-03-28

申请号：US13973958

申请日：2013-08-22

申请人： Toshiba Kikai Kabushiki Kaisha

发明人： Yuki Sugiura ,  Mitsunori Kokubo ,  Isao Matsuzuki ,  Takato Baba ,  Toru Suzuki

IPC分类号： B29C59/04

CPC分类号： B29C59/043 ,  B29C59/04 ,  B29C59/046 ,  Y10T428/24479

摘要： A transfer device includes a holding body that holds a molded material; a first roller that holds, together with the holding body, a wound mold and the molded material held by the holding body so as to carry out a transfer, and rotates about a central axis to move with respect to the holding body; and a second roller on which the mold extending from the first roller is wound in a direction away from the molded material held by the holding body, the second roller rotating about a central axis to relatively move together with the first roller.

公开(公告)号：US09095944B2

公开(公告)日：2015-08-04

申请号：US13691574

申请日：2012-11-30

申请人： Toshiba Kikai Kabushiki Kaisha

发明人： Mitsunori Kokubo ,  Yuki Sugiura ,  Toru Suzuki ,  Hidetoshi Kitahara

IPC分类号： B23Q3/08 ,  B23Q7/00 ,  B25B11/00 ,  B29C43/36 ,  B32B37/10 ,  B32B43/00 ,  B29C43/02 ,  B32B37/00 ,  B32B37/12 ,  B32B38/18 ,  B32B41/00 ,  B32B38/06 ,  B29C43/50 ,  B29C43/58

CPC分类号： B23Q7/00 ,  B23Q3/088 ,  B25B11/005 ,  B29C43/021 ,  B29C43/36 ,  B29C2043/025 ,  B29C2043/5092 ,  B29C2043/5833 ,  B32B37/0007 ,  B32B37/003 ,  B32B37/10 ,  B32B37/1009 ,  B32B37/1018 ,  B32B37/1207 ,  B32B38/06 ,  B32B38/1841 ,  B32B38/1858 ,  B32B43/00 ,  B32B2041/04 ,  B32B2309/68 ,  B32B2309/70 ,  B32B2310/0831 ,  B32B2315/08 ,  B32B2457/202 ,  B32B2551/00 ,  Y10T29/49822 ,  Y10T29/49826 ,  Y10T29/53096 ,  Y10T29/53535

摘要： A work setting apparatus includes a lower table 15, an upper table 17, and a work holding unit 19 provided with a plurality of work holders 25 each having an adhesive to hold a work. A work setting method sets a second work W2 held by the work holders 25 onto a first work W1 set on the lower table 17. A work holder removing method removes the work holders 25 from the second work W2 set on the first work W1 by vibrating the first and second works W1 and W2 on the lower table 15.

摘要翻译： 工作设定装置包括下台15，上台17和工件保持单元19，工件保持单元19设置有多个工件保持件25，每个工件保持件25具有用于保持工件的粘合剂。 工件设定方法将由工件保持器25保持的第二工件W2设置在设置在下台17上的第一工件W1上。工件保持件拆除方法通过振动从设置在第一工件W1上的第二工件W2移除工件保持件25 下表15上的第一和第二工件W1和W2。

公开(公告)号：US20180243971A1

公开(公告)日：2018-08-30

申请号：US15902095

申请日：2018-02-22

申请人： Toshiba Kikai Kabushiki Kaisha

发明人： Mitsunori Kokubo ,  Yuki Sugiura ,  Shigeru Fujiwara ,  Yuki Hashimoto

IPC分类号： B29C59/04 ,  B29C35/08 ,  B29C59/02

CPC分类号： B29C59/046 ,  B29C35/0805 ,  B29C35/0894 ,  B29C37/0003 ,  B29C59/002 ,  B29C59/021 ,  B29C59/026 ,  B29C2035/0827

摘要： According to one embodiment, under a condition that a substrate is installed on a substrate installation unit, a mold is installed on a mold installation unit, and a mask unit is installed in a mask-unit installation unit, a transfer apparatus controls an operation of a mold presser unit so as to press the mold against the substrate, the operation of a first positioning unit so as to position the mask unit with respect to the mold and the operation of an irradiation unit so as to irradiate an uncured material provided on the surface of the substrate with electromagnetic waves of a predetermined wavelength.

公开(公告)号：US11213997B2

公开(公告)日：2022-01-04

申请号：US15950725

申请日：2018-04-11

申请人： Toshiba Kikai Kabushiki Kaisha

发明人： Mitsunori Kokubo ,  Yuki Sugiura ,  Shigeru Fujiwara ,  Yuki Hashimoto

IPC分类号： B29C59/00 ,  B29C59/04 ,  B29C35/10 ,  B29C35/08 ,  G03F7/00

摘要： A transfer apparatus of an embodiment includes a substrate installation part on which a substrate provided with an uncured material is installed, a mold presser roller for pressing the mold against the substrate by a movement of the mold presser roller to the substrate installed on the substrate installation part, and a material recovery unit capable of recovering the uncured material protruding from between the substrate and the mold by the movement of the mold pressure.

公开(公告)号：US20180243970A1

公开(公告)日：2018-08-30

申请号：US15902088

申请日：2018-02-22

申请人： Toshiba Kikai Kabushiki Kaisha

发明人： Mitsunori Kokubo ,  Yuki Sugiura ,  Shigeru Fujiwara ,  Yuki Hashimoto

IPC分类号： B29C59/04 ,  B29C35/08 ,  B29C59/00

CPC分类号： B29C59/046 ,  B29C35/0805 ,  B29C35/0894 ,  B29C37/0003 ,  B29C59/002 ,  B29C59/026 ,  B29C2035/0827

摘要： A device for imprinting a mold onto resin laid on a substrate is comprised of an impression roller carrying the mold; a dancer roller to prevent the mold from loosening; a first driver configured to drive the impression roller; a second driver configured to drive the dancer roller; and a controller electrically connected to and configured to control the first driver and the second driver.

公开(公告)号：US20150231820A1

公开(公告)日：2015-08-20

申请号：US14432694

申请日：2013-09-24

申请人： TOSHIBA KIKAI KABUSHIKI KAISHA

发明人： Mitsunori Kokubo ,  Yuki Sugiura ,  Toru Suzuki ,  Terukatsu Kuboki

IPC分类号： B29C59/00 ,  B29C59/02

CPC分类号： B29C59/002 ,  B29C59/02 ,  B29C2059/023 ,  B29L2031/001 ,  Y10T428/24612

摘要： A molded body assembly (1) includes a to-be-molded body (3) and a mold (5) formed in the shape of a sheet. The mold (5) has a fine transfer pattern (7) formed on one surface thereof facing in the thickness direction thereof. The mold (5) is caused to adhere to the to-be-molded body (3) by the transferring of the fine transfer pattern (7) to the to-be-molded body (3), and protects a fine transferred pattern (9) formed in the to-be-molded body (3).

摘要翻译： 成型体组件（1）包括成型体（3）和形成为片状的模具（5）。 模具（5）具有形成在其厚度方向上的一个表面上的细转印图案（7）。 通过将精细转印图案（7）转印到被成型体（3）上，使模具（5）粘附到成型体（3）上，并保护精细转印图案 9）形成在被成型体（3）中。

公开(公告)号：US11040482B2

公开(公告)日：2021-06-22

申请号：US15902095

申请日：2018-02-22

申请人： Toshiba Kikai Kabushiki Kaisha

发明人： Mitsunori Kokubo ,  Yuki Sugiura ,  Shigeru Fujiwara ,  Yuki Hashimoto

IPC分类号： B29C59/04 ,  B29C59/02 ,  B29C35/08 ,  B29C59/00 ,  B29C37/00

摘要： According to one embodiment, under a condition that a substrate is installed on a substrate installation unit, a mold is installed on a mold installation unit, and a mask unit is installed in a mask-unit installation unit, a transfer apparatus controls an operation of a mold presser unit so as to press the mold against the substrate, the operation of a first positioning unit so as to position the mask unit with respect to the mold and the operation of an irradiation unit so as to irradiate an uncured material provided on the surface of the substrate with electromagnetic waves of a predetermined wavelength.

公开(公告)号：US10723063B2

公开(公告)日：2020-07-28

申请号：US16148515

申请日：2018-10-01

申请人： TOSHIBA KIKAI KABUSHIKI KAISHA

发明人： Mitsunori Kokubo ,  Yuki Sugiura ,  Toru Suzuki ,  Terukatsu Kuboki

IPC分类号： B29C59/00 ,  B29C59/02 ,  B29L31/00

摘要： An apparatus for manufacturing a molded body assembly includes: a to-be-molded body holder configured to hold a to-be-molded body placed thereon; a raw material roll placement portion in which a mold raw material roll is placed; a mold holder configured to hold a leading edge portion of an uncut mold extending from the mold raw material roll, and to move relative to the to-be-molded body holder; a transfer unit configured to transfer a fine transfer pattern of the uncut mold to the to-be-molded body placed on and held by the to-be-molded body holder, a cutting unit; and a controller configured to control the to-be-molded body holder, the mold holder, the transfer unit, and the cutting unit configured to cut the uncut mold at a predetermined position in a longitudinal direction thereof, thereby manufacturing a mold body assembly.

公开(公告)号：US20190105830A1

公开(公告)日：2019-04-11

申请号：US16148515

申请日：2018-10-01

申请人： TOSHIBA KIKAI KABUSHIKI KAISHA

发明人： Mitsunori Kokubo ,  Yuki Sugiura ,  Toru Suzuki ,  Terukatsu Kuboki

IPC分类号： B29C59/00 ,  B29C59/02 ,  B29L31/00

CPC分类号： B29C59/002 ,  B29C59/02 ,  B29C2059/023 ,  B29L2031/001 ,  Y10T428/24612

摘要： An apparatus for manufacturing a molded body assembly includes: a to-be-molded body holder configured to hold a to-be-molded body placed thereon; a raw material roll placement portion in which a mold raw material roll is placed; a mold holder configured to hold a leading edge portion of an uncut mold extending from the mold raw material roll, and to move relative to the to-be-molded body holder; a transfer unit configured to transfer a fine transfer pattern of the uncut mold to the to-be-molded body placed on and held by the to-be-molded body holder, a cutting unit; and a controller configured to control the to-be-molded body holder, the mold holder, the transfer unit, and the cutting unit configured to cut the uncut mold at a predetermined position in a longitudinal direction thereof, thereby manufacturing a mold body assembly.