利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

21 条记录 (耗时 0.022 秒)

    SEMICONDUCTOR LIGHT EMITTING DEVICE
    1.
    发明申请
    SEMICONDUCTOR LIGHT EMITTING DEVICE 审中-公开
    半导体发光器件

    公开(公告)号：US20120175587A1

    公开(公告)日：2012-07-12

    申请号：US13348317

    申请日：2012-01-11

    申请人： Tae Hun KIM ,  Seung Woo Choi ,  Tae Sung Jang

    发明人： Tae Hun KIM ,  Seung Woo Choi ,  Tae Sung Jang

    IPC分类号： H01L33/06 ,  B82Y20/00

    CPC分类号： H01L33/42 ,  H01L33/405

    摘要： A semiconductor light emitting device is herein disclosed. The semiconductor light emitting device includes: a conductive substrate, a p-type semiconductor layer disposed on the conductive substrate, an active layer disposed on the p-type semiconductor layer, an n-type semiconductor layer disposed on the active layer, and an n-side electrode disposed on the n-type semiconductor layer and including a carbon nanotube layer doped with an n-type impurity.

    摘要翻译： 本文公开了一种半导体发光器件。 半导体发光器件包括：导电衬底，设置在导电衬底上的p型半导体层，设置在p型半导体层上的有源层，设置在有源层上的n型半导体层，以及n 配置在n型半导体层上，并且包含掺杂有n型杂质的碳纳米管层。

    METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE
    4.
    发明申请
    METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE 审中-公开
    制造半导体发光器件的方法

    公开(公告)号：US20130029445A1

    公开(公告)日：2013-01-31

    申请号：US13558051

    申请日：2012-07-25

    申请人： Gi Bum KIM ,  Won Goo HUR ,  Seung Woo CHOI ,  Seung Jae LEE ,  Si Hyuk LEE ,  Tae Hun KIM

    发明人： Gi Bum KIM ,  Won Goo HUR ,  Seung Woo CHOI ,  Seung Jae LEE ,  Si Hyuk LEE ,  Tae Hun KIM

    IPC分类号： H01L33/02

    CPC分类号： H01L33/007 ,  H01L33/0095 ,  H01L33/20

    摘要： There is provided a method of manufacturing a semiconductor light emitting device, the method including: preparing a substrate including first and second main surfaces opposing each other; forming a plurality of protruding parts in the first main surface of the substrate; forming a light emitting stack on the first main surface on which the plurality of protruding parts are formed; forming a plurality of light emitting structures by removing portions of the light emitting stack formed in regions corresponding to groove parts around the plurality of protruding parts; and separating the substrate along the groove parts.

    摘要翻译： 提供一种制造半导体发光器件的方法，该方法包括：制备包括彼此相对的第一和第二主表面的衬底; 在基板的第一主表面上形成多个突出部分; 在形成有所述多个突出部的所述第一主表面上形成发光层; 通过去除形成在与所述多个突出部分周围的槽部分相对应的区域中的所述发光堆叠的部分来形成多个发光结构; 以及沿着所述凹槽部分分离所述基底。

    MOBILE COMMUNICATION DEVICE CAPABLE OF PROVIDING CANADIDATE PHONE NUMBER LIST AND METHOD OF CONTROLLING OPERATION OF THE MOBILE COMMUNICATION DEVICE
    6.
    发明申请
    MOBILE COMMUNICATION DEVICE CAPABLE OF PROVIDING CANADIDATE PHONE NUMBER LIST AND METHOD OF CONTROLLING OPERATION OF THE MOBILE COMMUNICATION DEVICE 有权
    能够提供加拿大电话号码列表的移动通信设备和控制移动通信设备的操作的方法

    公开(公告)号：US20120176333A1

    公开(公告)日：2012-07-12

    申请号：US13423088

    申请日：2012-03-16

    申请人： Tae Hun KIM ,  Jin Sang PARK

    发明人： Tae Hun KIM ,  Jin Sang PARK

    IPC分类号： G06F3/041 ,  G09G5/00

    CPC分类号： G06F3/04886 ,  G06F3/0482 ,  H04M1/274558 ,  H04M1/274583 ,  H04M2250/22

    摘要： A mobile communication device capable of providing a candidate phone number list and a method of controlling an operation of the mobile communication device is provided. The method includes displaying a phone number input window and a display window on the touch screen, displaying a string of numbers input to the phone number input window in the display window and displaying a candidate phone number list on the touch screen if a touch input to the display window is detected when the input number string is displayed in the display window, the candidate phone number list including a plurality of phone numbers that contain the input number string.

    摘要翻译： 提供了能提供候选电话号码列表的移动通信设备和控制移动通信设备的操作的方法。 该方法包括在触摸屏上显示电话号码输入窗口和显示窗口，在显示窗口中显示输入到电话号码输入窗口的号码串，并在触摸屏上显示候选电话号码列表，如果触摸输入 当在显示窗口中显示输入号码串时检测到显示窗口，候选电话号码列表包括包含输入号码串的多个电话号码。

    SEMICONDUCTOR LIGHT EMITTING DIODE AND MANUFACTURING METHOD THEREOF
    7.
    发明申请
    SEMICONDUCTOR LIGHT EMITTING DIODE AND MANUFACTURING METHOD THEREOF 有权
    半导体发光二极管及其制造方法

    公开(公告)号：US20120001152A1

    公开(公告)日：2012-01-05

    申请号：US13162254

    申请日：2011-06-16

    申请人： Ki Sung KIM ,  Gi Bum KIM ,  Tae Hun KIM ,  Young Chul SHIN ,  Young Sun KIM

    发明人： Ki Sung KIM ,  Gi Bum KIM ,  Tae Hun KIM ,  Young Chul SHIN ,  Young Sun KIM

    IPC分类号： H01L33/06 ,  H01L33/22

    CPC分类号： H01L33/22 ,  H01L33/0066 ,  H01L33/0075 ,  H01L33/0079 ,  H01L33/20 ,  H01L2933/0025 ,  H01L2933/0091

    摘要： A semiconductor light emitting diode (LED) and a manufacturing method thereof are disclosed. The method for manufacturing a semiconductor light emitting diode (LED) includes: forming a light emission structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer on a substrate with prominences and depressions; removing the substrate from the light emission structure to expose a first concavoconvex portion corresponding to the prominences and depressions; forming a protection layer on the first concavoconvex portion; removing a portion of the protection layer to expose a convex portion of the first concavoconvex portion; and forming a second concavoconvex portion on the convex portion of the first concavoconvex portion. The semiconductor light emitting diode (LED) includes: a light emission structure including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer; a first concavoconvex portion formed on the light emission structure and having a second concavoconvex portion at a convex portion thereof; and a protection layer filling up a concave portion of the first concavoconvex portion.

    摘要翻译： 公开了一种半导体发光二极管（LED）及其制造方法。 制造半导体发光二极管（LED）的方法包括：在具有突起和凹陷的基板上形成包括第一导电半导体层，有源层和第二导电半导体层的发光结构; 从所述发光结构去除所述衬底以暴露对应于所述突起和凹陷的第一凹凸部分; 在第一凹凸部上形成保护层; 去除所述保护层的一部分以暴露所述第一凹凸部的凸部; 以及在所述第一凹凸部的所述凸部上形成第二凹凸部。 半导体发光二极管（LED）包括：包括第一导电类型半导体层，有源层和第二导电类型半导体层的发光结构; 形成在所述发光结构上的第一凹凸部，在其凸部具有第二凹凸部; 以及填充所述第一凹凸部的凹部的保护层。

    MOBILE TERMINAL AND METHOD OF CONTROLLING THE SAME
    9.
    发明申请
    MOBILE TERMINAL AND METHOD OF CONTROLLING THE SAME 有权
    移动终端及其控制方法

    公开(公告)号：US20090094206A1

    公开(公告)日：2009-04-09

    申请号：US12242208

    申请日：2008-09-30

    申请人： Tae Hun KIM ,  Jang Jae JUNG

    发明人： Tae Hun KIM ,  Jang Jae JUNG

    IPC分类号： G06F17/30 ,  G06F3/048

    CPC分类号： G06F17/30867 ,  G06F3/04886 ,  H04M1/72522 ,  H04M1/72561 ,  H04M2250/70

    摘要： A mobile terminal and method of controlling the same are disclosed, by which a terminal user is enabled to input specific commands to the mobile terminal with minimum effort in a manner of configuring a display screen with consideration of enhanced user's convenience. The present invention includes a display unit, a wireless communication unit for an internet access, a user input unit for receiving an input from a user, and a control unit controlling both a text input box and an indicator indicating one selected from the group consisting of at least two functions of the text input box to be displayed on a standby image of the display unit.

    摘要翻译： 公开了一种移动终端及其控制方法，通过该终端用户能够以考虑到增强的用户便利性配置显示屏的方式以最小的努力向移动终端输入特定命令。 本发明包括显示单元，用于互联网接入的无线通信单元，用于从用户接收输入的用户输入单元，以及控制单元，控制文本输入框和指示从以下组成的组中选择的一个的指示： 要显示在显示单元的待机图像上的文本输入框的至少两个功能。

    METHOD OF ASSEMBLING METAL CLAMP AND BODY SPRINGS OF WIPER BLADE FOR VEHICLE AND ASSEMBLY
    10.
    发明申请
    METHOD OF ASSEMBLING METAL CLAMP AND BODY SPRINGS OF WIPER BLADE FOR VEHICLE AND ASSEMBLY 有权
    装配用于车辆和装配的刮刀的金属夹和身体弹簧的方法

    公开(公告)号：US20110041280A1

    公开(公告)日：2011-02-24

    申请号：US12618738

    申请日：2009-11-15

    申请人： Yong Ki CHOI ,  Tae Hun KIM ,  Dong Geun LEE ,  Sang Cheol LEE

    发明人： Yong Ki CHOI ,  Tae Hun KIM ,  Dong Geun LEE ,  Sang Cheol LEE

    IPC分类号： B60S1/32 ,  B23P17/04

    CPC分类号： B60S1/3858 ,  B60S1/3855 ,  B60S1/3879 ,  Y10T29/49826

    摘要： Disclosed is a method of assembling a metal clamp and body springs of a wiper blade for vehicles, and an assembly. The method includes forming a plurality of through holes at major sides of the body springs, forming a plurality of protrusions corresponding to the through holes at a major side of the clamp such that the protrusions extend outward from the major side of the clamp, inserting the protrusions of the clamp into the respective through holes of the body springs, fixing the protrusions, which are located in the respective through holes, in the respective through holes by pressure welding or riveting such that the clamp is mounted to the body springs.

    摘要翻译： 公开了一种组装用于车辆的刮水片的金属夹具和主体弹簧的组装方法。 该方法包括在主体弹簧的主侧面上形成多个通孔，在夹具的主侧形成与通孔相对应的多个突起，使得突起从夹具的主侧向外延伸， 将夹具的突出物插入主体弹簧的相应通孔中，通过压力焊接或铆接将位于各个通孔中的突起固定在相应的通孔中，使得夹具安装到主体弹簧。