公开(公告)号：US5898203A

公开(公告)日：1999-04-27

申请号：US903387

申请日：1997-07-30

申请人： Takashi Yoshitomi ,  Masanobu Saito ,  Hisayo Momose ,  Hiroshi Iwai ,  Yukihiro Ushiku ,  Mizuki Ono ,  Yasushi Akasaka ,  Hideaki Nii ,  Satoshi Matsuda ,  Yasuhiro Katsumata

发明人： Takashi Yoshitomi ,  Masanobu Saito ,  Hisayo Momose ,  Hiroshi Iwai ,  Yukihiro Ushiku ,  Mizuki Ono ,  Yasushi Akasaka ,  Hideaki Nii ,  Satoshi Matsuda ,  Yasuhiro Katsumata

IPC分类号： H01L21/033 ,  H01L21/225 ,  H01L21/28 ,  H01L21/336 ,  H01L21/8238 ,  H01L27/092 ,  H01L29/08 ,  H01L29/423 ,  H01L29/78 ,  H01L29/76

CPC分类号： H01L29/6659 ,  H01L21/0338 ,  H01L21/2255 ,  H01L21/28035 ,  H01L21/28123 ,  H01L21/823814 ,  H01L27/0928 ,  H01L29/0847 ,  H01L29/41783 ,  H01L29/42376 ,  H01L29/66492 ,  H01L29/6656 ,  H01L29/66628 ,  H01L29/7833 ,  Y10S257/90 ,  Y10S438/965

摘要： A diffused server as a source and a drain. It is formed comprised of a deep first diffused layer and a shallow second diffused layer positioned between the first diffused layer and the channel region. In the second diffused region, a distribution in a depth direction of carriers has a profile in which the concentration is more than 5.times.10.sup.18 cm-.sup.-3 at the peak and is in correspondence with a carrier concentration of the semiconductor substrate at a depth less than 0.04 .mu.m. Since the second diffused layer has a high concentration, the short-channel effect can be suppressed. As the second diffused region, a solid phase diffusion source such as an impurity doped silicate glass is used.

摘要翻译： 一个扩散的服务器作为源和漏。 其形成包括位于第一扩散层和沟道区之间的深第一扩散层和浅第二扩散层。 在第二扩散区域中，载流子深度方向的分布具有在峰值处浓度大于5×10 18 cm -3的轮廓，并且与深度小于0.04的半导体衬底的载流子浓度相对应 亩 由于第二扩散层具有高浓度，所以可以抑制短沟道效应。 作为第二扩散区域，使用诸如杂质掺杂硅酸盐玻璃的固相扩散源。

公开(公告)号：US5766965A

公开(公告)日：1998-06-16

申请号：US353301

申请日：1994-12-05

申请人： Takashi Yoshitomi ,  Masanobu Saito ,  Hisayo Momose ,  Hiroshi Iwai ,  Yukihiro Ushiku ,  Mizuki Ono ,  Yasushi Akasaka ,  Hideaki Nii ,  Satoshi Matsuda ,  Yasuhiro Katsumata

发明人： Takashi Yoshitomi ,  Masanobu Saito ,  Hisayo Momose ,  Hiroshi Iwai ,  Yukihiro Ushiku ,  Mizuki Ono ,  Yasushi Akasaka ,  Hideaki Nii ,  Satoshi Matsuda ,  Yasuhiro Katsumata

IPC分类号： H01L21/033 ,  H01L21/225 ,  H01L21/28 ,  H01L21/336 ,  H01L21/8238 ,  H01L27/092 ,  H01L29/08 ,  H01L29/423 ,  H01L29/78 ,  H01L21/265

CPC分类号： H01L29/6659 ,  H01L21/0338 ,  H01L21/2255 ,  H01L21/28035 ,  H01L21/28123 ,  H01L21/823814 ,  H01L27/0928 ,  H01L29/0847 ,  H01L29/41783 ,  H01L29/42376 ,  H01L29/66492 ,  H01L29/6656 ,  H01L29/66628 ,  H01L29/7833 ,  Y10S257/90 ,  Y10S438/965

摘要： A diffused layer serves as a source and a drain. It is formed comprised of a deep first diffused layer and a shallow second diffused layer positioned between the first diffused layer and the channel region. In the second diffused region, a distribution in a depth direction of carriers has a profile in which the concentration is more than 5.times.10.sup.18 cm.sup.-3 at the peak and is in correspondence with a carrier concentration of the semiconductor substrate at a depth less than 0.04 .mu.m. Since the second diffused layer has a high concentration, the short-channel effect can be suppressed. As the second diffused region, a solid phase diffusion source such as an impurity doped silicate glass is used.

公开(公告)号：US5698881A

公开(公告)日：1997-12-16

申请号：US353240

申请日：1994-12-02

申请人： Takashi Yoshitomi ,  Masanobu Saito ,  Hisayo Momose ,  Hiroshi Iwai ,  Yukihiro Ushiku ,  Mizuki Ono ,  Yasushi Akasaka ,  Hideaki Nii ,  Satoshi Matsuda ,  Yasuhiro Katsumata ,  Tatsuya Ooguro ,  Claudio Fiegna

发明人： Takashi Yoshitomi ,  Masanobu Saito ,  Hisayo Momose ,  Hiroshi Iwai ,  Yukihiro Ushiku ,  Mizuki Ono ,  Yasushi Akasaka ,  Hideaki Nii ,  Satoshi Matsuda ,  Yasuhiro Katsumata ,  Tatsuya Ooguro ,  Claudio Fiegna

IPC分类号： H01L21/033 ,  H01L21/225 ,  H01L21/28 ,  H01L21/336 ,  H01L21/8238 ,  H01L27/092 ,  H01L29/08 ,  H01L29/423 ,  H01L29/76

CPC分类号： H01L29/6659 ,  H01L21/0338 ,  H01L21/2255 ,  H01L21/28035 ,  H01L21/28123 ,  H01L21/823814 ,  H01L27/0928 ,  H01L29/0847 ,  H01L29/42376 ,  H01L29/66628

摘要： A MOS type semiconductor device has a gate whose length is 170 nm (0.17 .mu.m) or less, a junction depth of source and drain diffusion layers in the vicinity of a channel is 22 nm or less, and a concentration of impurities at the surface in the source and drain diffusion layers is made to 10.sup.20 cm.sup.-3 or more. Such structure is obtained using solid phase diffusion using heat range from 950.degree. C. to 1050.degree. C. and/or narrowing gate width by ashing or etching. The other MOS type semiconductor device is characterized in that the relationship between the junction depth x.sub.j �nm! in the source and drain diffusion layer regions and the effective channel length L.sub.eff �nm! is determined by L.sub.eff >0.69 x.sub.j -6.17.

摘要翻译： MOS型半导体器件具有长度为170nm（0.17μm）以下的栅极，沟道附近的源极和漏极扩散层的结深度为22nm以下，表面上的杂质浓度 在源极和漏极扩散层中形成1020cm-3以上。 这种结构使用从950℃到1050℃的热范围的固相扩散和/或通过灰化或蚀刻使栅极宽度变窄来获得。 其他MOS型半导体器件的特征在于源极和漏极扩散层区域中的结深度xj [nm]与有效沟道长度Leff [nm]之间的关系由Leff> 0.69×j-6.17确定。

公开(公告)号：US5903027A

公开(公告)日：1999-05-11

申请号：US910222

申请日：1997-08-13

申请人： Takashi Yoshitomi ,  Masanobu Saito ,  Hisayo Momose ,  Hiroshi Iwai ,  Yukihiro Ushiku ,  Mizuki Ono ,  Yasushi Akasaka ,  Hideaki Nii ,  Satoshi Matsuda ,  Yasuhiro Katsumata ,  Tatsuya Ooguro ,  Claudio Fiegna

发明人： Takashi Yoshitomi ,  Masanobu Saito ,  Hisayo Momose ,  Hiroshi Iwai ,  Yukihiro Ushiku ,  Mizuki Ono ,  Yasushi Akasaka ,  Hideaki Nii ,  Satoshi Matsuda ,  Yasuhiro Katsumata ,  Tatsuya Ooguro ,  Claudio Fiegna

IPC分类号： H01L21/033 ,  H01L21/225 ,  H01L21/28 ,  H01L21/336 ,  H01L21/8238 ,  H01L27/092 ,  H01L29/08 ,  H01L29/423 ,  H01L29/76

CPC分类号： H01L29/6659 ,  H01L21/0338 ,  H01L21/2255 ,  H01L21/28035 ,  H01L21/28123 ,  H01L21/823814 ,  H01L27/0928 ,  H01L29/0847 ,  H01L29/42376 ,  H01L29/66628

摘要： A MOS type semiconductor device has a gate whose length is 170 nm (0.17 .mu.m) or less, a junction depth of source and drain diffusion layers in the vicinity of a channel is 22 nm or less, and a concentration of impurities at the surface in the source and drain diffusion layers is made to 10.sup.20 cm.sup.-3 or more. Such structure is obtained using solid phase diffusion using heat range from 950.degree. C. to 1050.degree. C. and/or narrowing gate width by ashing or etching. The other MOS type semiconductor device is characterized in that the relationship between the junction depth x.sub.j �nm! in the source and drain diffusion layer regions and the effective channel length L.sub.eff �nm! is determined by L.sub.eff >0.69 x.sub.j -6.17.

摘要翻译： MOS型半导体器件具有长度为170nm（0.17μm）以下的栅极，沟道附近的源极和漏极扩散层的结深度为22nm以下，表面上的杂质浓度 在源极和漏极扩散层中形成1020cm-3以上。 这种结构使用从950℃到1050℃的热范围的固相扩散和/或通过灰化或蚀刻使栅极宽度变窄来获得。 其他MOS型半导体器件的特征在于源极和漏极扩散层区域中的结深度xj [nm]与有效沟道长度Leff [nm]之间的关系由Leff> 0.69×j-6.17确定。

公开(公告)号：US5434440A

公开(公告)日：1995-07-18

申请号：US68529

申请日：1993-05-28

申请人： Takashi Yoshitomi ,  Masanobu Saito ,  Hisayo Momose ,  Hiroshi Iwai ,  Yukihiro Ushiku ,  Mizuki Ono ,  Yasushi Akasaka ,  Hideaki Nii ,  Satoshi Matsuda ,  Yasuhiro Katsumata

发明人： Takashi Yoshitomi ,  Masanobu Saito ,  Hisayo Momose ,  Hiroshi Iwai ,  Yukihiro Ushiku ,  Mizuki Ono ,  Yasushi Akasaka ,  Hideaki Nii ,  Satoshi Matsuda ,  Yasuhiro Katsumata

IPC分类号： H01L21/033 ,  H01L21/225 ,  H01L21/28 ,  H01L21/336 ,  H01L21/8238 ,  H01L27/092 ,  H01L29/08 ,  H01L29/423 ,  H01L29/78 ,  H01L29/06

CPC分类号： H01L29/6659 ,  H01L21/0338 ,  H01L21/2255 ,  H01L21/28035 ,  H01L21/28123 ,  H01L21/823814 ,  H01L27/0928 ,  H01L29/0847 ,  H01L29/41783 ,  H01L29/42376 ,  H01L29/66492 ,  H01L29/6656 ,  H01L29/66628 ,  H01L29/7833 ,  Y10S257/90 ,  Y10S438/965

摘要： A diffused layer serves as a source and a drain. It is formed comprised of a deep first diffused layer and a shallow second diffused layer positioned between the first diffused layer and the channel region. In the second diffused region, a distribution in a depth direction of carriers has a profile in which the concentration is more than 5.times.10.sup.18 cm.sup.-3 at the peak and is in correspondence with a carrier concentration of the semiconductor substrate at a depth less than 0.04 .mu.m. Since the second diffused layer has a high concentration, the short-channel effect can be suppressed. As the second diffused region, a solid phase diffusion source such as an impurity doped silicate glass is used.

摘要翻译： 扩散层用作源极和漏极。 其形成包括位于第一扩散层和沟道区之间的深第一扩散层和浅第二扩散层。 在第二扩散区域中，载流子深度方向的分布具有在峰值处浓度大于5×10 18 cm -3的轮廓，并且与深度小于0.04μm的半导体衬底的载流子浓度相对应 m。 由于第二扩散层具有高浓度，所以可以抑制短沟道效应。 作为第二扩散区域，使用诸如杂质掺杂硅酸盐玻璃的固相扩散源。

公开(公告)号：US06642560B2

公开(公告)日：2003-11-04

申请号：US10160036

申请日：2002-06-04

申请人： Hisayo Momose ,  Hiroshi Iwai ,  Masanobu Saito ,  Tatsuya Ohguro ,  Mizuki Ono ,  Takashi Yoshitomi ,  Shinichi Nakamura

发明人： Hisayo Momose ,  Hiroshi Iwai ,  Masanobu Saito ,  Tatsuya Ohguro ,  Mizuki Ono ,  Takashi Yoshitomi ,  Shinichi Nakamura

IPC分类号： H01L2976

CPC分类号： H01L29/66575 ,  H01L21/2255 ,  H01L21/2256 ,  H01L21/28211 ,  H01L27/0629 ,  H01L27/088 ,  H01L29/42364 ,  H01L29/42372 ,  H01L29/78

摘要： A semiconductor device comprises: a p-type semiconductor substrate (1); an insulating film (3); a gate electrode (2) formed on the substrata via the insulating film; and an n-type source/drain region (5) formed on both sides of a channel forming region (4) located under the gate electrode (2) formed on the substrate (1). In particular, the thickness (Tox) of the insulating film (3) is determined to be less than 2.5 nm at conversion rate of silicon oxide film (silicon oxide equivalent thickness); a gate length (Lg) of the gate electrode (2) is determined to be equal to or lass than 0.3 &mgr;m; and further a voltage applied to the gate electrode (2) and the drain region (6) is determined to be 1.3 V or less. Therefore, in the MOSFET having the tunneling gate oxide film (3), the reliability of the transistor under the hot carrier stress can be improved, and the gate leakage current can be reduced markedly, so that the transistor characteristics can be improved markedly.

摘要翻译： 半导体器件包括：p型半导体衬底（1）; 绝缘膜（3）; 经由所述绝缘膜形成在所述基体上的栅电极（2） 以及形成在形成在基板（1）上的栅电极（2）下方的沟道形成区域（4）的两侧的n型源极/漏极区域（5）。 特别地，绝缘膜（3）的厚度（Tox）在氧化硅膜的转换率（氧化硅当量厚度））被确定为小于2.5nm。 栅电极（2）的栅极长度（Lg）被确定为等于或小于0.3μm; 并且进一步施加到栅极（2）和漏极区（6）的电压被确定为1.3V或更小。 因此，在具有隧穿栅极氧化膜（3）的MOSFET中，可以提高热载流子应力下的晶体管的可靠性，并且可以显着降低栅极漏电流，从而可以显着提高晶体管特性。

公开(公告)号：US06229164B1

公开(公告)日：2001-05-08

申请号：US09440938

申请日：1999-11-16

申请人： Hisayo Momose ,  Hiroshi Iwai ,  Masanobu Saito ,  Tatsuya Ohguro ,  Mizuki Ono ,  Takashi Yoshitomi ,  Shinichi Nakamura

发明人： Hisayo Momose ,  Hiroshi Iwai ,  Masanobu Saito ,  Tatsuya Ohguro ,  Mizuki Ono ,  Takashi Yoshitomi ,  Shinichi Nakamura

IPC分类号： H01L2976

CPC分类号： H01L29/66575 ,  H01L21/2255 ,  H01L21/2256 ,  H01L21/28211 ,  H01L27/0629 ,  H01L27/088 ,  H01L29/42364 ,  H01L29/42372 ,  H01L29/78

摘要： A semiconductor device comprises: a p-type semiconductor substrate (1); an insulating film (3); a gate electrode (2) formed on the substrate via the insulating film; and an n-type source/drain region (5) formed on both sides of a channel forming region (4) located under the gate electrode (2) formed on the substrate (1). In particular, the thickness (TOX) of the insulating film (3) is determined to be less than 2.5 nm at conversion rate of silicon oxide film (silicon oxide equivalent thickness); a gate length (Lg) of the electrode (2) is determined to be equal to or less than 0.3 &mgr;m; and further a voltage applied to the gate electrode (2) and the drain region (6) is determined to be 1.5 V or less. Therefore, in the MOSFET having the tunneling gate oxide film (3), the reliability of the transistor under the hot carrier stress can be improved, and the gate leakage current can be reduced markedly, so that the transistor characteristics can be improved markedly.

摘要翻译： 半导体器件包括：p型半导体衬底（1）; 绝缘膜（3）; 经由所述绝缘膜形成在所述基板上的栅电极（2） 以及形成在形成在基板（1）上的栅电极（2）下方的沟道形成区域（4）的两侧的n型源极/漏极区域（5）。 特别地，绝缘膜（3）的厚度（TOX）在氧化硅膜的转换率（氧化硅当量厚度））被确定为小于2.5nm。 电极（2）的栅极长度（Lg）被确定为等于或小于0.3μm; 并且进一步施加到栅极（2）和漏极区（6）的电压被确定为1.5V或更小。 因此，在具有隧穿栅极氧化膜（3）的MOSFET中，可以提高热载流子应力下的晶体管的可靠性，并且可以显着降低栅极漏电流，从而可以显着提高晶体管特性。

公开(公告)号：US5955761A

公开(公告)日：1999-09-21

申请号：US69980

申请日：1998-04-30

申请人： Takashi Yoshitomi ,  Hiroshi Iwai ,  Masanobu Saito ,  Hisayo Momose ,  Tatsuya Ohguro ,  Mizuki Ono

发明人： Takashi Yoshitomi ,  Hiroshi Iwai ,  Masanobu Saito ,  Hisayo Momose ,  Tatsuya Ohguro ,  Mizuki Ono

IPC分类号： H01L21/265 ,  H01L21/336 ,  H01L21/8238 ,  H01L27/092 ,  H01L29/08 ,  H01L29/45 ,  H01L29/78 ,  H01L27/088

CPC分类号： H01L29/66628 ,  H01L21/2652 ,  H01L21/823864 ,  H01L27/0928 ,  H01L29/0847 ,  H01L29/456 ,  H01L29/78 ,  H01L29/7833 ,  Y10S257/90

摘要： A semiconductor device capable of restraining a short channel effect and obtaining a current drivability that is as high as possible includes a semiconductor substrate, a gate insulating film formed on the surface of this substrate, a gate electrode formed on this gate insulating film and side wall insulating films formed on this gate electrode and along side walls of the gate insulating film. The semiconductor device further includes side wall conductor films formed adjacent to the side wall insulating films and a source/drain region formed in a surface region of the substrate under the side wall conductivity film and in a surface region, adjacent to the side wall conductivity film, of the semiconductor substrate. An impurity concentration in a depthwise direction of the substrate with the surface of the side wall conductor film serving as a starting point exhibits one maximum value in a predetermined depth but decreases in a portion deeper than the predetermined depth.

摘要翻译： 能够抑制短通道效应并获得尽可能高的电流驱动性的半导体器件包括半导体衬底，形成在该衬底的表面上的栅极绝缘膜，形成在该栅极绝缘膜上的栅电极和侧壁 在该栅电极上形成的绝缘膜和栅极绝缘膜的侧壁。 半导体器件还包括与侧壁绝缘膜相邻形成的侧壁导体膜和形成在侧壁导电膜下的基板的表面区域中的源极/漏极区域以及与侧壁导电膜相邻的表面区域 的半导体衬底。 在侧壁导体膜的表面作为起始点的基板的深度方向上的杂质浓度在预定深度呈现一个最大值，但在比预定深度更深的部分中减小。

公开(公告)号：US20080048250A1

公开(公告)日：2008-02-28

申请号：US11846369

申请日：2007-08-28

申请人： Hisayo MOMOSE ,  Hiroshi Iwai ,  Masanobu Saito ,  Tatsuya Ohguro ,  Mizuki Ono ,  Takashi Yoshitomi ,  Shinichi Nakamura

发明人： Hisayo MOMOSE ,  Hiroshi Iwai ,  Masanobu Saito ,  Tatsuya Ohguro ,  Mizuki Ono ,  Takashi Yoshitomi ,  Shinichi Nakamura

IPC分类号： H01L27/06

CPC分类号： H01L29/66575 ,  H01L21/2255 ,  H01L21/2256 ,  H01L21/28211 ,  H01L27/0629 ,  H01L27/088 ,  H01L29/42364 ,  H01L29/42372 ,  H01L29/78

摘要： A semiconductor device comprises: a p-type semiconductor substrate (1); an insulating film (3); a gate electrode (2) formed on the substrate via the insulating film; and an n-type source/drain region (5) formed on both sides of a channel forming region (4) located under the gate electrode (2) formed on the substrate (1). In particular, the thickness (TOX) of the insulating film (3) is determined to be less than 2.5 nm at conversion rate of silicon oxide film (silicon oxide equivalent thickness); a gate length (Lg) of the gate electrode (2) is determined to be equal to or less than 0.3 μm; and further a voltage applied to the gate electrode (2) and the drain region (6) is determined to be 1.5 V or less. Therefore, in the MOSFET having the tunneling gate oxide film (3), the reliability of the transistor under the hot carrier stress can be improved, and the gate leakage current can be reduced markedly, so that the transistor characteristics can be improved markedly.

摘要翻译： 半导体器件包括：p型半导体衬底（1）; 绝缘膜（3）; 经由所述绝缘膜形成在所述基板上的栅电极（2） 以及形成在形成在基板（1）上的栅电极（2）下方的沟道形成区域（4）的两侧的n型源极/漏极区域（5）。 特别地，在氧化硅膜的转换率（氧化硅当量厚度）下，确定绝缘膜（3）的厚度（T×OX ）小于2.5nm。 栅极（2）的栅极长度（L SUB）确定为等于或小于0.3μm; 并且进一步施加到栅极（2）和漏极区（6）的电压被确定为1.5V或更小。 因此，在具有隧穿栅极氧化膜（3）的MOSFET中，可以提高热载流子应力下的晶体管的可靠性，并且可以显着降低栅极漏电流，从而可以显着提高晶体管特性。

公开(公告)号：US06929990B2

公开(公告)日：2005-08-16

申请号：US10681318

申请日：2003-10-09

申请人： Hisayo Momose ,  Hiroshi Iwai ,  Masanobu Saito ,  Tatsuya Ohguro ,  Mizuki Ono ,  Takashi Yoshitomi ,  Shinichi Nakamura

发明人： Hisayo Momose ,  Hiroshi Iwai ,  Masanobu Saito ,  Tatsuya Ohguro ,  Mizuki Ono ,  Takashi Yoshitomi ,  Shinichi Nakamura

IPC分类号： H01L21/225 ,  H01L21/336 ,  H01L27/088 ,  H01L29/423 ,  H01L29/76 ,  H01L29/78

CPC分类号： H01L29/66575 ,  H01L21/2255 ,  H01L21/2256 ,  H01L21/28211 ,  H01L27/0629 ,  H01L27/088 ,  H01L29/42364 ,  H01L29/42372 ,  H01L29/78

摘要： A semiconductor device comprises: a p-type semiconductor substrate (1); an insulating film (3); a gate electrode (2) formed on the substrate via the insulating film; and an n-type source/drain region (5) formed on both sides of a channel forming region (4) located under the gate electrode (2) formed on the substrate (1). In particular, the thickness (TOX) of the insulating film (3) is determined to be less than 2.5 nm at conversion rate of silicon oxide film (silicon oxide equivalent thickness); a gate length (Lg) of the gate electrode (2) is determined to be equal to or less than 0.3 μm; and further a voltage applied to the gate electrode (2) and the drain region (6) is determined to be 1.5 V or less. Therefore, in the MOSFET having the tunneling gate oxide film (3), the reliability of the transistor under the hot carrier stress can be improved, and the gate leakage current can be reduced markedly, so that the transistor characteristics can be improved markedly.

摘要翻译： 半导体器件包括：p型半导体衬底（1）; 绝缘膜（3）; 经由所述绝缘膜形成在所述基板上的栅电极（2） 以及形成在形成在基板（1）上的栅电极（2）下方的沟道形成区域（4）的两侧的n型源极/漏极区域（5）。 特别地，在氧化硅膜的转换率（氧化硅当量厚度）下，确定绝缘膜（3）的厚度（T×OX ）小于2.5nm。 栅极（2）的栅极长度（L SUB）确定为等于或小于0.3μm; 并且进一步施加到栅极（2）和漏极区（6）的电压被确定为1.5V或更小。 因此，在具有隧穿栅极氧化膜（3）的MOSFET中，可以提高热载流子应力下的晶体管的可靠性，并且可以显着降低栅极漏电流，从而可以显着提高晶体管特性。