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1.发明授权Process for inhibiting corrosion and removing contaminant from a surface during wafer dicing and composition useful therefor 有权用于在晶片切割期间抑制腐蚀并从表面除去污染物的方法及其有用的组合物公开(公告)号：US08580656B2
公开(公告)日：2013-11-12
申请号：US12499556
申请日：2009-07-08
Applicant: Terence Quintin Collier , Charles A. Lhota , David Barry Rennie , Rajkumar Ramamurthi , Madhukar Bhaskara Rao , Dnyanesh Chandrakant Tamboli
Inventor： Terence Quintin Collier , Charles A. Lhota , David Barry Rennie , Rajkumar Ramamurthi , Madhukar Bhaskara Rao , Dnyanesh Chandrakant Tamboli
CPC classification number: H01L21/02076 , B28D5/0076 , C11D1/143 , C11D1/22 , C11D1/24 , C11D1/345 , C11D3/2075 , C11D11/0047 , H01L2224/0381 , H01L2224/04042 , H01L2224/05624 , H01L2224/8501
Abstract: Adherence of contaminant residues or particles is suppressed, corrosion of exposed surfaces is substantially reduced or eliminated during the process of dicing a wafer by sawing. A fluoride-free aqueous composition comprising a dicarboxylic acid and/or salt thereof; a hydroxycarboxylic acid and/or salt thereof or amine group containing acid, a surfactant and deionized water is employed.
Abstract translation: 污染物残留物或颗粒的粘附被抑制，在通过锯切切割晶片的过程中，暴露表面的腐蚀显着降低或消除。 一种不含氟的含水组合物，其包含二羧酸和/或其盐; 使用羟基羧酸和/或其盐或含有酸的酸，表面活性剂和去离子水。
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2.发明申请Process for Inhibiting Corrosion and Removing Contaminant from a Surface During Wafer Dicing and Composition Useful Therefor 有权在晶片切割期间抑制腐蚀和从表面去除污染物的方法及其组合物有用公开(公告)号：US20100009517A1
公开(公告)日：2010-01-14
申请号：US12499556
申请日：2009-07-08
Applicant: Terence Quintin Collier , Charles A. Lhota , David Barry Rennie , Rajkumar Ramamurthi , Madhukar Bhaskara Rao , Dnyanesh Chandrakant Tamboli
Inventor： Terence Quintin Collier , Charles A. Lhota , David Barry Rennie , Rajkumar Ramamurthi , Madhukar Bhaskara Rao , Dnyanesh Chandrakant Tamboli
IPC: H01L21/304 , C09K13/00
CPC classification number: H01L21/02076 , B28D5/0076 , C11D1/143 , C11D1/22 , C11D1/24 , C11D1/345 , C11D3/2075 , C11D11/0047 , H01L2224/0381 , H01L2224/04042 , H01L2224/05624 , H01L2224/8501
Abstract: Adherence of contaminant residues or particles is suppressed, corrosion of exposed surfaces is substantially reduced or eliminated during the process of dicing a wafer by sawing. A fluoride-free aqueous composition comprising a dicarboxylic acid and/or salt thereof; a hydroxycarboxylic acid and/or salt thereof or amine group containing acid, a surfactant and deionized water is employed.
Abstract translation: 污染物残留物或颗粒的粘附被抑制，在通过锯切切割晶片的过程中，暴露表面的腐蚀显着降低或消除。 一种不含氟的含水组合物，其包含二羧酸和/或其盐; 使用羟基羧酸和/或其盐或含有酸的酸，表面活性剂和去离子水。
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公开(公告)号：US06646332B2
公开(公告)日：2003-11-11
申请号：US10213760
申请日：2002-08-07
Applicant: Terence Quintin Collier
Inventor： Terence Quintin Collier
IPC: H01L2302
CPC classification number: H01L24/83 , H01L23/49541 , H01L24/29 , H01L2224/2919 , H01L2224/8319 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H05K3/3426 , H05K2201/10689 , H05K2201/1084 , Y02P70/613 , H01L2924/00 , H01L2924/3512
Abstract: Disclosed are semiconductor packages and methods incorporating the use of vias in layers of leaded and nonleaded multilayer packages. The vias provide fluid communication between layers such that bonding material flows among layers for the formation of a 3D bond. As disclosed, the layers may comprise leads, dice, bond pads, or other substantially planar semiconductor package surfaces.
Abstract translation: 公开了半导体封装和方法，其结合在含铅和非铅性多层封装的层中使用通孔。 通孔提供层之间的流体连通，使得结合材料在用于形成3D结合的层之间流动。 如所公开的，这些层可以包括引线，裸片，接合焊盘或其它基本上平面的半导体封装表面。
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