公开(公告)号：US11499992B2

公开(公告)日：2022-11-15

申请号：US16695830

申请日：2019-11-26

申请人： TOKYO ELECTRON LIMITED

发明人： Shinjiro Watanabe

IPC分类号： G01R1/067 ,  G01R35/00 ,  G06N20/00 ,  H04N5/232

摘要： An inspection system includes a plurality of inspection apparatuses, and a data processing apparatus capable of communicating with the plurality of inspection apparatuses. The data processing apparatus includes a storage part storing a model that determines a causal relationship between an apparatus parameter related to setting of the plurality of inspection apparatuses and index data obtained when the plurality of inspection apparatuses are operated, a collection part collecting the apparatus parameter and the index data, a determination part determining whether or not the index data is included in a predetermined allowable range, and a calculation part calculating an adjustment amount for adjusting the apparatus parameter, based on the apparatus parameter and the index data, and the model, when it is determined that the index data is not included in the predetermined allowable range.

公开(公告)号：US09296010B2

公开(公告)日：2016-03-29

申请号：US14458408

申请日：2014-08-13

申请人： Tokyo Electron Limited

发明人： Shinjiro Watanabe ,  Michikazu Nakamura

IPC分类号： B05C5/00 ,  B05C11/10 ,  B05B13/02 ,  B05B1/30 ,  B05C5/02 ,  B05C13/00 ,  H01L21/67

CPC分类号： B05C11/1021 ,  B05B1/3006 ,  B05C5/0208 ,  B05C5/0225 ,  B05C5/0258 ,  B05C13/00 ,  H01L21/6715

摘要： A coating film forming apparatus includes: a coating nozzle; a horizontal moving mechanism that relatively moves a substrate and the coating nozzle; a pressure regulating mechanism that regulates a pressure inside the coating nozzle; and a controller that changes an amount of the coating solution to be supplied from the coating nozzle, wherein the coating nozzle includes: a discharge port that is formed long in a direction perpendicular to a direction of the relative movement with respect to the substrate; and a storage chamber that communicates with the discharge port and stores the coating solution therein, and wherein while the coating solution is applied to the substrate, the pressure regulating mechanism is controlled according to a change in width of the substrate, to regulate the pressure inside the storage chamber to thereby change a discharge amount per unit time of the coating solution to be discharged.

摘要翻译： 涂膜形成装置包括：涂布喷嘴; 相对移动基板和涂布喷嘴的水平移动机构; 压力调节机构，其调节所述涂布喷嘴内的压力; 以及控制器，其改变从所述涂布喷嘴供给的涂布溶液的量，其中所述涂布喷嘴包括：排出口，其在垂直于相对于所述基板的所述相对运动方向的方向上形成得较长; 以及与排出口连通并将涂布溶液存储在其中的储存室，并且其中当将涂布溶液施加到基板上时，根据基板的宽度变化来控制压力调节机构，以调节内部的压力 储存室，从而改变要排出的涂布溶液的每单位时间的排出量。

公开(公告)号：US20130181040A1

公开(公告)日：2013-07-18

申请号：US13723771

申请日：2012-12-21

申请人： Tokyo Electron Limited

发明人： Shinjiro Watanabe ,  Itaru Iida ,  Muneo Harada

IPC分类号： H01L21/48

CPC分类号： H01L21/4814 ,  H01L21/683 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L24/95 ,  H01L25/0657 ,  H01L25/117 ,  H01L25/50 ,  H01L2224/13101 ,  H01L2224/16145 ,  H01L2224/75101 ,  H01L2224/75272 ,  H01L2224/7598 ,  H01L2224/81011 ,  H01L2224/81065 ,  H01L2224/81075 ,  H01L2224/81139 ,  H01L2224/81815 ,  H01L2924/01007 ,  H01L2924/014 ,  H01L2924/00014

摘要： Provided is a semiconductor device manufacturing system according to the present disclosure which manufactures a semiconductor device using a chip stack. The system includes a chip reducing apparatus and a chip bonding apparatus, the chip reducing apparatus includes a reduction chamber, an oxide film of the surface of the terminal of each chip is reduced in the reduction chamber, the chip bonding apparatus includes a reflow chamber isolated from the reduction chamber, a solder ball is bonded to the terminal of each chip in the reflow chamber, and the chip bonding apparatus is installed separately from the chip reducing apparatus.

摘要翻译： 提供了根据本公开的半导体器件制造系统，其制造使用芯片堆叠的半导体器件。 该系统包括减芯装置和芯片接合装置，所述减芯装置包括还原室，所述还原室中的每个芯片的端子表面的氧化膜被还原，所述芯片接合装置包括隔离的回流室 从还原室将焊球接合到回流室中的每个芯片的端子，并且芯片接合装置与芯片减少装置分开地安装。

公开(公告)号：US11715657B2

公开(公告)日：2023-08-01

申请号：US17141830

申请日：2021-01-05

申请人： Tokyo Electron Limited

发明人： Shinjiro Watanabe ,  Koji Aramaki

IPC分类号： H01L21/683 ,  H01L21/67 ,  G06T7/00 ,  H01L21/677 ,  H01L21/66

CPC分类号： H01L21/67259 ,  G06T7/001 ,  H01L21/67742 ,  H01L21/6838 ,  H01L22/12 ,  G06T2207/30148

摘要： A substrate misalignment detection method includes: acquiring first image information or first position information of a substrate held to a stage by suction at a first height position; delivering the substrate from the stage to a holder in a state in which the suction of the substrate is released and causing the holder to hold the substrate at the first height position; acquiring second image information or second position information of the substrate held at the first height position; and detecting misalignment of the substrate by comparing the first image information with the second image information or by comparing the first position information with the second position information.

公开(公告)号：US11340259B2

公开(公告)日：2022-05-24

申请号：US16709285

申请日：2019-12-10

申请人： TOKYO ELECTRON LIMITED

发明人： Shinjiro Watanabe

IPC分类号： G01R1/073

摘要： A probe card management system includes inspection apparatuses that inspect an inspection object and a management apparatus that manages a state of a probe card. Each inspection apparatus includes a camera that captures an image of a tip of each needle provided on the probe card, an inspection part that measures a state of the tip from the image, and inspects the inspection object by bringing the tip into contact with each test pad based on the measurement result, and supplying an electrical signal to the inspection object through the tip; and a transmission part that transmits the measurement result and a number of executions of the inspection to the management apparatus. The management apparatus includes a threshold specification part that specifies a first threshold value, and a notification part that notifies an outside of the number of executions and the first threshold value.