公开(公告)号：US20230026661A1

公开(公告)日：2023-01-26

申请号：US17936068

申请日：2022-09-28

Applicant: Tokyo Electron Limited

Inventor： Takashi Nakamitsu ,  Shuhei Matsumoto ,  Yosuke Omori

IPC: H01L23/00 ,  H01L21/67 ,  H01L21/68 ,  H01L21/683 ,  H01L21/20 ,  B23K20/00 ,  H01L21/02

Abstract: A bonding apparatus configured to bond substrates includes a first holder configured to vacuum-exhaust a first substrate to attract and hold the first substrate on a bottom surface thereof; a second holder disposed under the first holder, and configured to vacuum-exhaust a second substrate to attract and hold the second substrate on a top surface thereof; a mover configured to move the first holder and the second holder relatively in a horizontal direction; a laser interferometer system configured to measure a position of the first holder or the second holder which is moved by the mover; a linear scale configured to measure a position of the mover; and a controller configured to control the mover based on a measurement result of the laser interferometer system and a measurement result of the liner scale.

公开(公告)号：US10985132B2

公开(公告)日：2021-04-20

申请号：US16928814

申请日：2020-07-14

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yoshitaka Otsuka ,  Takashi Nakamitsu ,  Yosuke Omori ,  Kenji Sugakawa

IPC: B32B41/00 ,  H01L23/00 ,  H01L21/677 ,  H01L21/67 ,  H01L21/683 ,  B32B15/01 ,  H01L21/18 ,  H01L21/20 ,  H01L21/68 ,  B32B37/10 ,  B32B37/00

Abstract: There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.

公开(公告)号：US11094667B2

公开(公告)日：2021-08-17

申请号：US16347856

申请日：2017-10-10

Applicant: Tokyo Electron Limited

Inventor： Takashi Nakamitsu ,  Shuhei Matsumoto ,  Toshifumi Inamasu

IPC: H01L23/00 ,  H01L21/67 ,  H01L21/68 ,  H01L21/02 ,  B23K20/00 ,  H01L21/683

Abstract: A bonding apparatus configured to bond substrates includes a first holder configured to vacuum-exhaust a first substrate to attract and hold the first substrate on a bottom surface thereof; a second holder disposed under the first holder and configured to vacuum-exhaust a second substrate to attract and hold the second substrate on a top surface thereof; a rotator configured to rotate the first holder and the second holder relatively; a moving device configured to move the first holder and the second holder relatively in a horizontal direction; three position measurement devices disposed at the first holder or the second holder rotated by the rotator and configured to measure a position of the first holder or the second holder; and a controller configured to control the rotator and the moving device based on measurement results of the three position measurement devices.

公开(公告)号：US10438920B2

公开(公告)日：2019-10-08

申请号：US15822364

申请日：2017-11-27

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yoshitaka Otsuka ,  Takashi Nakamitsu ,  Yosuke Omori ,  Kenji Sugakawa

IPC: B32B41/00 ,  H01L23/00 ,  H01L21/677 ,  H01L21/67 ,  H01L21/683 ,  B32B15/01 ,  H01L21/18 ,  H01L21/20 ,  H01L21/68 ,  B32B37/10 ,  B32B37/00

Abstract: There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.

公开(公告)号：US11658146B2

公开(公告)日：2023-05-23

申请号：US17374156

申请日：2021-07-13

Applicant: Tokyo Electron Limited

Inventor： Takashi Nakamitsu ,  Shuhei Matsumoto ,  Toshifumi Inamasu

IPC: H01L23/00 ,  H01L21/67 ,  H01L21/68 ,  H01L21/02 ,  B23K20/00 ,  H01L21/683

CPC classification number: H01L24/75 ,  B23K20/00 ,  H01L21/02 ,  H01L21/67207 ,  H01L21/68 ,  H01L21/683 ,  H01L24/94 ,  H01L2224/759 ,  H01L2224/75744 ,  H01L2224/75802

Abstract: A bonding apparatus configured to bond substrates includes a first holder configured to vacuum-exhaust a first substrate to attract and hold the first substrate on a bottom surface thereof; a second holder disposed under the first holder and configured to vacuum-exhaust a second substrate to attract and hold the second substrate on a top surface thereof; a rotator configured to rotate the first holder and the second holder relatively; a moving device configured to move the first holder and the second holder relatively in a horizontal direction; three position measurement devices disposed at the first holder or the second holder rotated by the rotator and configured to measure a position of the first holder or the second holder; and a controller configured to control the rotator and the moving device based on measurement results of the three position measurement devices.

公开(公告)号：US11488929B2

公开(公告)日：2022-11-01

申请号：US16347868

申请日：2017-10-11

Applicant: Tokyo Electron Limited

Inventor： Takashi Nakamitsu ,  Shuhei Matsumoto ,  Yosuke Omori

IPC: H01L21/68 ,  H01L23/00 ,  H01L21/67 ,  H01L21/683 ,  H01L21/20 ,  B23K20/00 ,  H01L21/02

Abstract: A bonding apparatus configured to bond substrates comprises a first holder configured to vacuum-exhaust a first substrate to attract and hold the first substrate on a bottom surface thereof; a second holder disposed under the first holder, and configured to vacuum-exhaust a second substrate to attract and hold the second substrate on a top surface thereof; a mover configured to move the first holder and the second holder relatively in a horizontal direction; a laser interferometer system configured to measure a position of the first holder or the second holder which is moved by the mover; a linear scale configured to measure a position of the mover; and a controller configured to control the mover based on a measurement result of the laser interferometer system and a measurement result of the liner scale.

公开(公告)号：US20190312006A1

公开(公告)日：2019-10-10

申请号：US16347856

申请日：2017-10-10

Applicant: Tokyo Electron Limited

Inventor： Takashi Nakamitsu ,  Shuhei Matsumoto ,  Toshifumi Inamasu

IPC: H01L23/00 ,  H01L21/67 ,  H01L21/68

Abstract: A bonding apparatus configured to bond substrates includes a first holder configured to vacuum-exhaust a first substrate to attract and hold the first substrate on a bottom surface thereof; a second holder disposed under the first holder and configured to vacuum-exhaust a second substrate to attract and hold the second substrate on a top surface thereof; a rotator configured to rotate the first holder and the second holder relatively; a moving device configured to move the first holder and the second holder relatively in a horizontal direction; three position measurement devices disposed at the first holder or the second holder rotated by the rotator and configured to measure a position of the first holder or the second holder; and a controller configured to control the rotator and the moving device based on measurement results of the three position measurement devices.

公开(公告)号：US20240006207A1

公开(公告)日：2024-01-04

申请号：US18341903

申请日：2023-06-27

Applicant: Tokyo Electron Limited

Inventor： Takashi Nakamitsu ,  Tetsuya Maki ,  Yosuke Omori ,  Keiichi Saiki

IPC: H01L21/67 ,  H01L21/18 ,  H01L21/68 ,  H01L21/683

CPC classification number: H01L21/67259 ,  H01L21/67017 ,  H01L21/187 ,  H01L21/681 ,  H01L21/6838

Abstract: A bonding apparatus includes a first holder; a second holder; a horizontally moving unit; an elevating unit; an inclination measuring unit; and a controller. The first holder is configured to attract and hold a first substrate on a bottom surface thereof. The second holder is disposed under the first holder and configured to attract and hold a second substrate on a top surface thereof. The horizontally moving unit is configured to move the first substrate and the second substrate relative to each other in a horizontal direction. The elevating unit is configured to move the second substrate up and down between a proximate position and a spaced position. The inclination measuring unit is configured to measure an inclination of the second holder. The controller calculates a position of the second substrate in the horizontal direction based on a measurement result of the inclination measuring unit.

公开(公告)号：US20210343678A1

公开(公告)日：2021-11-04

申请号：US17374156

申请日：2021-07-13

Applicant: Tokyo Electron Limited

Inventor： Takashi Nakamitsu ,  Shuhei Matsumoto ,  Toshifumi Inamasu

IPC: H01L23/00 ,  H01L21/67 ,  H01L21/68 ,  H01L21/02 ,  B23K20/00 ,  H01L21/683

Abstract: A bonding apparatus configured to bond substrates includes a first holder configured to vacuum-exhaust a first substrate to attract and hold the first substrate on a bottom surface thereof; a second holder disposed under the first holder and configured to vacuum-exhaust a second substrate to attract and hold the second substrate on a top surface thereof; a rotator configured to rotate the first holder and the second holder relatively; a moving device configured to move the first holder and the second holder relatively in a horizontal direction; three position measurement devices disposed at the first holder or the second holder rotated by the rotator and configured to measure a position of the first holder or the second holder; and a controller configured to control the rotator and the moving device based on measurement results of the three position measurement devices.

公开(公告)号：US10756046B2

公开(公告)日：2020-08-25

申请号：US16553530

申请日：2019-08-28

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yoshitaka Otsuka ,  Takashi Nakamitsu ,  Yosuke Omori ,  Kenji Sugakawa

IPC: B32B41/00 ,  H01L23/00 ,  H01L21/677 ,  H01L21/67 ,  H01L21/683 ,  B32B15/01 ,  H01L21/18 ,  H01L21/20 ,  H01L21/68 ,  B32B37/10 ,  B32B37/00

Abstract: There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.