公开(公告)号：US06727552B2

公开(公告)日：2004-04-27

申请号：US10062462

申请日：2002-02-05

申请人： Yasuo Inoue ,  Tadashi Nishimura ,  Yasuo Yamaguchi ,  Toshiaki Iwamatsu

发明人： Yasuo Inoue ,  Tadashi Nishimura ,  Yasuo Yamaguchi ,  Toshiaki Iwamatsu

IPC分类号： H01L2701

CPC分类号： H01L21/8238 ,  H01L21/84 ,  H01L23/4825 ,  H01L27/0921 ,  H01L27/1203 ,  H01L29/78609 ,  H01L29/78612 ,  H01L29/78615 ,  H01L29/78621 ,  H01L29/78645 ,  H01L29/78654 ,  H01L2924/0002 ,  H01L2924/00

摘要： According to a semiconductor device of the present invention, a field oxide film is formed so as to cover the main surface of an SOI layer and to reach the main surface of a buried oxide film. As a result, a pMOS active region of the SOI and an nMOS active region of the SOI can be electrically isolated completely. Therefore, latchup can be prevented completely. As a result, it is possible to provide a semiconductor device using an SOI substrate which can implement high integration by eliminating reduction of the breakdown voltage between source and drain, which was a problem of a conventional SOI field effect transistor, as well as by efficiently disposing a body contact region, which hampers high integration, and a method of manufacturing the same.

摘要翻译： 根据本发明的半导体器件，形成场致氧化膜以覆盖SOI层的主表面并到达掩埋氧化膜的主表面。 结果，可以完全电隔离SOI的pMOS有源区和SOI的nMOS有源区。 因此，可以完全防止闭锁。 结果，可以提供使用SOI衬底的半导体器件，该SOI衬底可以通过消除源极和漏极之间的击穿电压的降低来实现高集成度，这是常规SOI场效应晶体管的问题，以及有效地 设置妨碍高集成度的身体接触区域及其制造方法。

公开(公告)号：US06649976B2

公开(公告)日：2003-11-18

申请号：US09982777

申请日：2001-10-22

申请人： Toshiaki Iwamatsu ,  Yasuo Inoue ,  Yasuo Yamaguchi ,  Tadashi Nishimura

发明人： Toshiaki Iwamatsu ,  Yasuo Inoue ,  Yasuo Yamaguchi ,  Tadashi Nishimura

IPC分类号： H01L2976

CPC分类号： H01L21/26506 ,  H01L21/26586 ,  H01L21/84 ,  H01L27/1203 ,  H01L29/41783 ,  H01L29/458 ,  H01L29/66507 ,  H01L29/66659 ,  H01L29/66772 ,  H01L29/78621

摘要： A semiconductor device in which parasitic resistance of source/drain regions can be reduced than the parasitic resistance of the drain region, and manufacturing method thereof, can be obtained. In the semiconductor device, inactivating ions are implanted only to the source region of the semiconductor layer, so as to damage the crystal near the surface of the semiconductor layer, whereby siliciding reaction is promoted. Therefore, in the source region, a titanium silicide film which is thicker can be formed.

公开(公告)号：US6051494A

公开(公告)日：2000-04-18

申请号：US855259

申请日：1997-05-13

申请人： Toshiaki Iwamatsu ,  Yasuo Inoue ,  Yasuo Yamaguchi ,  Tadashi Nishimura

发明人： Toshiaki Iwamatsu ,  Yasuo Inoue ,  Yasuo Yamaguchi ,  Tadashi Nishimura

IPC分类号： H01L21/28 ,  H01L21/265 ,  H01L21/336 ,  H01L21/76 ,  H01L21/84 ,  H01L27/12 ,  H01L29/45 ,  H01L29/78 ,  H01L29/786 ,  H01L21/44

CPC分类号： H01L21/26506 ,  H01L21/84 ,  H01L27/1203 ,  H01L29/41783 ,  H01L29/458 ,  H01L29/66507 ,  H01L29/66659 ,  H01L29/66772 ,  H01L21/26586 ,  H01L29/78621

摘要： A semiconductor device in which parasitic resistance of source/drain regions can be reduced than the parasitic resistance of the drain region, and manufacturing method thereof, can be obtained. In the semiconductor device, inactivating ions are implanted only to the source region of the semiconductor layer, so as to damage the crystal near the surface of the semiconductor layer, whereby siliciding reaction is promoted. Therefore, in the source region, a titanium silicide film which is thicker can be formed.

摘要翻译： 可以获得其中源极/漏极区域的寄生电阻可以比漏极区域的寄生电阻降低的半导体器件及其制造方法。 在半导体装置中，仅将钝化离子注入到半导体层的源极区域，以损坏半导体层的表面附近的晶体，从而促进了硅化反应。 因此，在源极区域中，可以形成更厚的硅化钛膜。

公开(公告)号：US06198134B1

公开(公告)日：2001-03-06

申请号：US09056616

申请日：1998-04-08

申请人： Yasuo Inoue ,  Tadashi Nishimura ,  Yasuo Yamaguchi ,  Toshiaki Iwamatsu

发明人： Yasuo Inoue ,  Tadashi Nishimura ,  Yasuo Yamaguchi ,  Toshiaki Iwamatsu

IPC分类号： H01L2701

CPC分类号： H01L21/8238 ,  H01L21/84 ,  H01L23/4825 ,  H01L27/0921 ,  H01L27/1203 ,  H01L29/78609 ,  H01L29/78612 ,  H01L29/78615 ,  H01L29/78621 ,  H01L29/78645 ,  H01L29/78654 ,  H01L2924/0002 ,  H01L2924/00

摘要： According to a semiconductor device of the present invention, a field oxide film is formed so as to cover the main surface of an SOI layer and to reach the main surface of a buried oxide film. As a result, a pMOS active region of the SOI and an nMOS active region of the SOI can be electrically isolated completely. Therefore, latchup can be prevented completely. As a result, it is possible to provide a semiconductor device using an SOI substrate which can implement high integration by eliminating reduction of the breakdown voltage between source and drain, which was a problem of a conventional SOI field effect transistor, as well as by efficiently disposing a body contact region, which hampers high integration, and a method of manufacturing the same.

摘要翻译： 根据本发明的半导体器件，形成场致氧化膜以覆盖SOI层的主表面并到达掩埋氧化膜的主表面。 结果，可以完全电隔离SOI的pMOS有源区和SOI的nMOS有源区。 因此，可以完全防止闭锁。 结果，可以提供使用SOI衬底的半导体器件，该SOI衬底可以通过消除源极和漏极之间的击穿电压的降低来实现高集成度，这是常规SOI场效应晶体管的问题，以及有效地 设置妨碍高集成度的身体接触区域及其制造方法。

公开(公告)号：US5801080A

公开(公告)日：1998-09-01

申请号：US837959

申请日：1997-04-14

申请人： Yasuo Inoue ,  Tadashi Nishimura ,  Yasuo Yamaguchi ,  Toshiaki Iwamatsu

发明人： Yasuo Inoue ,  Tadashi Nishimura ,  Yasuo Yamaguchi ,  Toshiaki Iwamatsu

IPC分类号： H01L21/76 ,  H01L21/8238 ,  H01L21/84 ,  H01L23/482 ,  H01L27/092 ,  H01L27/12 ,  H01L29/78 ,  H01L29/786

CPC分类号： H01L21/8238 ,  H01L21/84 ,  H01L23/4825 ,  H01L27/0921 ,  H01L27/1203 ,  H01L29/78609 ,  H01L29/78612 ,  H01L29/78615 ,  H01L29/78621 ,  H01L29/78645 ,  H01L29/78654 ,  H01L2924/0002

摘要： According to a semiconductor device of the present invention, a field oxide film is formed so as to cover the main surface of an SOI layer and to reach the main surface of a buried oxide film. As a result, a pMOS active region of the SOI and an nMOS active region of the SOI can be electrically isolated completely. Therefore, latchup can be prevented completely. As a result, it is possible to provide a semiconductor device using an SOI substrate which can implement high integration by eliminating reduction of the breakdown voltage between source and drain, which was a problem of a conventional SOI field effect transistor, as well as by efficiently disposing a body contact region, which hampers high integration, and a method of manufacturing the same.

摘要翻译： 根据本发明的半导体器件，形成场致氧化膜以覆盖SOI层的主表面并到达掩埋氧化膜的主表面。 结果，可以完全电隔离SOI的pMOS有源区和SOI的nMOS有源区。 因此，可以完全防止闭锁。 结果，可以提供使用SOI衬底的半导体器件，该SOI衬底可以通过消除源极和漏极之间的击穿电压的降低来实现高集成度，这是常规SOI场效应晶体管的问题，以及有效地 设置妨碍高集成度的身体接触区域及其制造方法。

公开(公告)号：US5652454A

公开(公告)日：1997-07-29

申请号：US675510

申请日：1996-07-03

申请人： Toshiaki Iwamatsu ,  Yasuo Inoue ,  Yasuo Yamaguchi ,  Tadashi Nishimura

发明人： Toshiaki Iwamatsu ,  Yasuo Inoue ,  Yasuo Yamaguchi ,  Tadashi Nishimura

IPC分类号： H01L21/76 ,  H01L21/8238 ,  H01L21/84 ,  H01L23/482 ,  H01L27/092 ,  H01L27/12 ,  H01L29/78 ,  H01L29/786 ,  H01L27/01 ,  H01L23/58 ,  H01L29/00

CPC分类号： H01L21/8238 ,  H01L21/84 ,  H01L23/4825 ,  H01L27/0921 ,  H01L27/1203 ,  H01L29/78609 ,  H01L29/78612 ,  H01L29/78615 ,  H01L29/78621 ,  H01L29/78645 ,  H01L29/78654 ,  H01L2924/0002

摘要： According to a semiconductor device of the present invention, a field oxide film is formed so as to cover the main surface of an SOI layer and to reach the main surface of a buried oxide film. As a result, a pMOS active region of the SOI and an nMOS active region of the SOI can be electrically isolated completely. Therefore, latchup can be prevented completely. As a result, it is possible to provide a semiconductor device using an SOI substrate which can implement high integration by eliminating reduction of the breakdown voltage between source and drain, which was a problem of a conventional SOI field effect transistor, as well as by efficiently disposing a body contact region, which hampers high integration, and a method of manufacturing the same.

摘要翻译： 根据本发明的半导体器件，形成场致氧化膜以覆盖SOI层的主表面并到达掩埋氧化膜的主表面。 结果，可以完全电隔离SOI的pMOS有源区和SOI的nMOS有源区。 因此，可以完全防止闭锁。 结果，可以提供使用SOI衬底的半导体器件，该SOI衬底可以通过消除源极和漏极之间的击穿电压的降低来实现高集成度，这是常规SOI场效应晶体管的问题，以及有效地 设置妨碍高集成度的身体接触区域及其制造方法。

公开(公告)号：US5659194A

公开(公告)日：1997-08-19

申请号：US614256

申请日：1996-03-12

申请人： Toshiaki Iwamatsu ,  Yasuo Inoue ,  Yasuo Yamaguchi ,  Tadashi Nishimura

发明人： Toshiaki Iwamatsu ,  Yasuo Inoue ,  Yasuo Yamaguchi ,  Tadashi Nishimura

IPC分类号： H01L21/28 ,  H01L21/265 ,  H01L21/336 ,  H01L21/76 ,  H01L21/84 ,  H01L27/12 ,  H01L29/45 ,  H01L29/78 ,  H01L29/786 ,  H01L29/76 ,  H01L29/94 ,  H01L31/062

CPC分类号： H01L21/26506 ,  H01L21/84 ,  H01L27/1203 ,  H01L29/41783 ,  H01L29/458 ,  H01L29/66507 ,  H01L29/66659 ,  H01L29/66772 ,  H01L21/26586 ,  H01L29/78621

摘要： A semiconductor device in which parasitic resistance of source/drain regions can be reduced than the parasitic resistance of the drain region, and manufacturing method thereof, can be obtained. In the semiconductor device, inactivating ions are implanted only to the source region of the semiconductor layer, so as to damage the crystal near the surface of the semiconductor layer, whereby siliciding reaction is promoted. Therefore, in the source region, a titanium silicide film which is thicker can be formed.

摘要翻译： 可以获得其中源极/漏极区域的寄生电阻可以比漏极区域的寄生电阻降低的半导体器件及其制造方法。 在半导体装置中，仅将钝化离子注入到半导体层的源极区域，以损坏半导体层的表面附近的晶体，从而促进了硅化反应。 因此，在源极区域中，可以形成更厚的硅化钛膜。

公开(公告)号：US5440161A

公开(公告)日：1995-08-08

申请号：US273175

申请日：1994-07-26

申请人： Toshiaki Iwamatsu ,  Yasuo Yamaguchi ,  Yasuo Inoue ,  Tadashi Nishimura

发明人： Toshiaki Iwamatsu ,  Yasuo Yamaguchi ,  Yasuo Inoue ,  Tadashi Nishimura

IPC分类号： H01L21/76 ,  H01L21/8238 ,  H01L21/8242 ,  H01L21/84 ,  H01L27/08 ,  H01L27/092 ,  H01L27/108 ,  H01L27/12 ,  H01L29/06 ,  H01L29/40 ,  H01L29/78 ,  H01L29/786 ,  H01L27/01 ,  H01L21/265

CPC分类号： H01L29/402 ,  H01L21/84 ,  H01L27/1203 ,  H01L29/78609 ,  H01L29/78612

摘要： A buried oxide film 4 is formed on a main surface of a silicon substrate 1. An SOI layer 5 is formed on buried oxide film 4. Channel stop regions 22a and 22b respectively connected to channel regions of an nMOS 2 and a pMOS 3 are formed in an element isolation region of SOI layer 5. nMOS 2 and pMOS 3 are formed in an element formation region of SOI layer. A concentration of a p type impurity or an n type impurity included in channel stop regions 22a and 22b is higher than a concentration of the p type impurity or the n type impurity included in the channel region of nMOS 2 or the channel region of pMOS 3. An FS gate 16 is formed on channel stop regions 22a and 22b with an FS gate oxide film 15 interposed therebetween. Therefore, a semiconductor device having an SOI structure which is capable of suppressing a parasitic bipolar operation by drawing out efficiently excessive carriers stored in the channel region of transistor can be obtained.

摘要翻译： 在硅衬底1的主表面上形成掩埋氧化膜4.在掩埋氧化物膜4上形成SOI层5.形成分别连接到nMOS 2和pMOS 3的沟道区的沟道停止区22a和22b 在SOI层5的元件隔离区域中，在SOI层的元件形成区域中形成nMOS 2和pMOS 3。 包含在通道停止区域22a和22b中的ap型杂质或n型杂质的浓度高于包含在nMOS 2的沟道区域或pMOS 3的沟道区域中的p型杂质或n型杂质的浓度。 FS沟道栅极16形成在通道阻挡区域22a和22b上，其中FS栅氧化膜15插入其间。 因此，可以获得具有SOI结构的半导体器件，该半导体器件能够通过有效地抽出存储在晶体管的沟道区域中的过多的载流子来抑制寄生双极性操作。

公开(公告)号：US06351014B2

公开(公告)日：2002-02-26

申请号：US09519598

申请日：2000-03-06

申请人： Yasuo Inoue ,  Tadashi Nishimura ,  Yasuo Yamaguchi ,  Toshiaki Iwamatsu

发明人： Yasuo Inoue ,  Tadashi Nishimura ,  Yasuo Yamaguchi ,  Toshiaki Iwamatsu

IPC分类号： H01L2701

CPC分类号： H01L21/8238 ,  H01L21/84 ,  H01L23/4825 ,  H01L27/0921 ,  H01L27/1203 ,  H01L29/78609 ,  H01L29/78612 ,  H01L29/78615 ,  H01L29/78621 ,  H01L29/78645 ,  H01L29/78654 ,  H01L2924/0002 ,  H01L2924/00

摘要： According to a semiconductor device of the present invention, a field oxide film is formed so as to cover the main surface of an SOI layer and to reach the main surface of a buried oxide film. As a result, a pMOS active region of the SOI and an nMOS active region of the SOI can be electrically isolated completely. Therefore, latchup can be prevented completely. As a result, it is possible to provide a semiconductor device using an SOI substrate which can implement high integration by eliminating reduction of the breakdown voltage between source and drain, which was a problem of a conventional SOI field effect transistor, as well as by efficiently disposing a body contact region, which hampers high integration, and a method of manufacturing the same.

摘要翻译： 根据本发明的半导体器件，形成场致氧化膜以覆盖SOI层的主表面并到达掩埋氧化膜的主表面。 结果，可以完全电隔离SOI的pMOS有源区和SOI的nMOS有源区。 因此，可以完全防止闭锁。 结果，可以提供使用SOI衬底的半导体器件，该SOI衬底可以通过消除源极和漏极之间的击穿电压的降低来实现高集成度，这是常规SOI场效应晶体管的问题，以及有效地 设置妨碍高集成度的身体接触区域及其制造方法。

公开(公告)号：US06319805B1

公开(公告)日：2001-11-20

申请号：US09499733

申请日：2000-02-08

申请人： Toshiaki Iwamatsu ,  Yasuo Inoue ,  Yasuo Yamaguchi ,  Tadashi Nishimura

发明人： Toshiaki Iwamatsu ,  Yasuo Inoue ,  Yasuo Yamaguchi ,  Tadashi Nishimura

IPC分类号： H01L213205

CPC分类号： H01L21/26506 ,  H01L21/26586 ,  H01L21/84 ,  H01L27/1203 ,  H01L29/41783 ,  H01L29/458 ,  H01L29/66507 ,  H01L29/66659 ,  H01L29/66772 ,  H01L29/78621

摘要： A semiconductor device in which parasitic resistance of source/drain regions can be reduced than the parasitic resistance of the drain region, and manufacturing method thereof, can be obtained. In the semiconductor device, inactivating ions are implanted only to the source region of the semiconductor layer, so as to damage the crystal near the surface of the semiconductor layer, whereby siliciding reaction is promoted. Therefore, in the source region, a titanium silicide film which is thicker can be formed.

摘要翻译： 可以获得其中源极/漏极区域的寄生电阻可以比漏极区域的寄生电阻降低的半导体器件及其制造方法。 在半导体装置中，仅将钝化离子注入到半导体层的源极区域，以损坏半导体层的表面附近的晶体，从而促进了硅化反应。 因此，在源极区域中，可以形成更厚的硅化钛膜。