公开(公告)号：US09666990B1

公开(公告)日：2017-05-30

申请号：US15053637

申请日：2016-02-25

Applicant: TYCO ELECTRONICS CORPORATION

Inventor： Thomas Taake de Boer ,  Michael John Phillips ,  John Joseph Consoli ,  Sandeep Patel ,  Bruce Allen Champion ,  Linda Ellen Shields

IPC: H01R13/6471 ,  H01R12/72 ,  H01R24/66

CPC classification number: H01R13/6471 ,  H01R12/721 ,  H01R12/79 ,  H01R13/6464 ,  H01R24/66

Abstract: A plug connector includes a plug body having a terminating end terminated to an electrical component and a mating end mated with a mating electrical connector. The plug body has first and second outer sides. The plug body has pockets between the first and second outer sides. A plug shroud extends from the plug body at the terminating end that is configured to be coupled to the electrical component. A contact array is held by the plug body and includes signal and ground contacts. The signal and ground contacts are exposed along the first and second outer sides. At least some of the ground contacts are aligned with corresponding pockets. Resonance-control lossy inserts are provided in corresponding pockets adjacent corresponding ground contacts. The lossy inserts are manufactured from lossy material capable of absorbing electrical resonance propagating through the plug body.

公开(公告)号：US09413112B2

公开(公告)日：2016-08-09

申请号：US14454043

申请日：2014-08-07

Applicant: Tyco Electronics Corporation

Inventor： David Wayne Helster ,  Linda Ellen Shields ,  Michael John Phillips ,  Bruce Allen Champion ,  Sandeep Patel

IPC: H01R13/648 ,  H01R13/6467 ,  H01R12/71 ,  H01R12/72 ,  H01R13/514 ,  H01R13/6471 ,  H01R13/6587 ,  H01R12/58

CPC classification number: H01R13/6467 ,  H01R12/585 ,  H01R12/714 ,  H01R12/716 ,  H01R12/724 ,  H01R12/727 ,  H01R13/514 ,  H01R13/6471 ,  H01R13/6587

Abstract: An electrical connector includes a housing and a plurality of contact modules and ground plates held by the housing. Each contact module includes left and right signal wafers stacked next to each other along a stack axis. The signal wafers include electrical terminals held by a dielectric body. The electrical terminals have mounting contacts protruding from the dielectric body at a mounting face of the housing. The electrical terminals of at least one of the signal wafers in each contact module are jogged toward the other signal wafer such that the mounting contacts of each contact module align in a column. Each of the ground plates is disposed along an outer side of a corresponding contact module.

Abstract translation: 电连接器包括壳体和由壳体保持的多个接触模块和接地板。 每个触点模块包括沿着堆叠轴线彼此堆叠的左和右信号晶片。 信号晶片包括由绝缘体保持的电端子。 电气端子具有在壳体的安装面处从电介质体突出的安装触头。 每个接触模块中的信号晶片中的至少一个的电端子向另一个信号晶片慢跑，使得每个接触模块的安装触点在一列中对齐。 每个接地板沿对应的接触模块的外侧设置。

公开(公告)号：US09768557B2

公开(公告)日：2017-09-19

申请号：US14967605

申请日：2015-12-14

Applicant: TYCO ELECTRONICS CORPORATION

Inventor： Michael John Phillips ,  Thomas Taake de Boer ,  Bruce Allen Champion ,  John Joseph Consoli ,  Sandeep Patel ,  Linda Ellen Shields

IPC: H01R13/648 ,  H01R13/6471 ,  H01R13/6585 ,  H01R12/70

CPC classification number: H01R13/6471 ,  H01R12/7005 ,  H01R12/721 ,  H01R12/725 ,  H01R12/735 ,  H01R13/405 ,  H01R13/6585

Abstract: An electrical connector includes a housing having a first end and a second end with a mating slot formed between the first and second ends configured to receive a mating connector having contact pads. A leadframe assembly is disposed in the housing. The leadframe assembly has a contact array including ground contacts and signal contacts interspersed between corresponding ground contacts. The leadframe assembly has an overmold body supporting the ground and signal contacts. The overmold body has lossy ground absorbers coupled to corresponding ground contacts. The lossy ground absorbers are manufactured from lossy material absorbing electrical resonance propagating through the leadframe assembly.

公开(公告)号：US20160006182A1

公开(公告)日：2016-01-07

申请号：US14321416

申请日：2014-07-01

Applicant: Tyco Electronics Corporation

Inventor： Sandeep Patel

IPC: H01R13/652 ,  H01R13/6471

CPC classification number: H01R13/652 ,  H01R12/724 ,  H01R12/732 ,  H01R13/6471 ,  H01R13/6597

Abstract: An electrical connector includes a housing having a front and a rear. The housing including a slot defined through the front that is configured to receive a mating connector therein. Signal contacts are held in the housing. The signal contacts are arranged within the slot to mate with the mating connector. Ground contacts are held in the housing and interspersed among the signal contacts. The ground contacts are arranged within the slot to mate with the mating connector. A ground bus includes a base and multiple sets of projections extending from the base. Each set including at least two projections that engage the same corresponding ground contact at spaced-apart locations. The sets of projections are connected via the base to create a ground circuit between the ground contacts that are engaged by the ground bus.

Abstract translation: 电连接器包括具有前和后的外壳。 壳体包括通过前部限定的狭槽，其构造成在其中容纳配合连接器。 信号触点保持在外壳中。 信号触点布置在槽内以与配合连接器配合。 接地触点保持在外壳中，散布在信号触点之间。 接地触头布置在插槽内以与配合连接器配合。 地面总线包括基座和从基座延伸的多组突起。 每个组包括在间隔开的位置处接合相同的对应接地触头的至少两个突起。 这些突起通过基座连接，以在由接地母线接合的接地触头之间产生接地电路。

公开(公告)号：US09871325B2

公开(公告)日：2018-01-16

申请号：US14996692

申请日：2016-01-15

Applicant: TYCO ELECTRONICS CORPORATION

Inventor： Sandeep Patel ,  Bruce Allen Champion ,  Linda Ellen Shields ,  Michael John Phillips ,  Thomas Taake de Boer ,  John Joseph Consoli

IPC: H01R13/66 ,  H01R13/6473 ,  H01R12/72

CPC classification number: H01R13/6473 ,  H01R12/721 ,  H01R12/724 ,  H01R13/6471 ,  H01R24/60 ,  H05K1/0233 ,  H05K1/115 ,  H05K1/117 ,  H05K2201/086 ,  H05K2201/10189

Abstract: An interconnect system includes a circuit board including a substrate having a first surface and a second surface opposite the first surface, a plurality of signal conductors and a plurality of ground conductors including respective contact pads in a mating area of the substrate for engaging corresponding contacts of an electrical connector, and a plurality of ground vias extending at least partially through the substrate between the first and second surfaces. The ground vias are coupled to corresponding ground conductors. The ground vias include lossy plugs at least partially filling the ground vias. The lossy plugs are manufactured from lossy material capable of absorbing electrical resonance propagating through the substrate.

公开(公告)号：US09748697B2

公开(公告)日：2017-08-29

申请号：US14798536

申请日：2015-07-14

Applicant: Tyco Electronics Corporation ,  TYCO ELECTRONICS JAPAN G.K.

Inventor： Sandeep Patel ,  Linda Ellen Shields ,  Bruce Allen Champion ,  Chad William Morgan ,  Masayuki Aizawa

IPC: H01R13/66 ,  H01R13/6471 ,  H05K1/02 ,  H05K1/11

CPC classification number: H01R13/6471 ,  H01R13/6616 ,  H05K1/0228 ,  H05K1/023 ,  H05K1/117 ,  H05K2201/09409

Abstract: Pluggable connector includes a plug housing configured to couple to a communication cable. The plug housing has a plug cavity. The pluggable connector also includes a module board that is disposed within the plug cavity and configured to be communicatively coupled to the communication cable. The module board has a mating edge configured to interface with a mating connector. The module board includes a plurality of signal pathways and a plurality of ground pathways in which the signal pathways are interleaved between corresponding ground pathways. The signal and ground pathways include respective contact pads that are disposed proximate to the mating edge for engaging corresponding contacts of the mating connector. Each of the ground pathways has separate first and second trace segments and a damping component that electrically joins the first and second trace segments.

公开(公告)号：US20170207579A1

公开(公告)日：2017-07-20

申请号：US14996692

申请日：2016-01-15

Applicant: TYCO ELECTRONICS CORPORATION

Inventor： Sandeep Patel ,  Bruce Allen Champion ,  Linda Ellen Shields ,  Michael John Phillips ,  Thomas Taake de Boer ,  John Joseph Consoli

IPC: H01R13/6473 ,  H01R12/72

CPC classification number: H01R13/6473 ,  H01R12/721 ,  H01R12/724 ,  H01R13/6471 ,  H01R24/60 ,  H05K1/0233 ,  H05K1/115 ,  H05K1/117 ,  H05K2201/086 ,  H05K2201/10189

Abstract: An interconnect system includes a circuit board including a substrate having a first surface and a second surface opposite the first surface, a plurality of signal conductors and a plurality of ground conductors including respective contact pads in a mating area of the substrate for engaging corresponding contacts of an electrical connector, and a plurality of ground vias extending at least partially through the substrate between the first and second surfaces. The ground vias are coupled to corresponding ground conductors. The ground vias include lossy plugs at least partially filling the ground vias. The lossy plugs are manufactured from lossy material capable of absorbing electrical resonance propagating through the substrate.

公开(公告)号：US20170170606A1

公开(公告)日：2017-06-15

申请号：US14967605

申请日：2015-12-14

Applicant: TYCO ELECTRONICS CORPORATION

Inventor： Michael John Phillips ,  Thomas Taake de Boer ,  Bruce Allen Champion ,  John Joseph Consoli ,  Sandeep Patel ,  Linda Ellen Shields

IPC: H01R13/6471 ,  H01R12/70 ,  H01R13/6585

CPC classification number: H01R13/6471 ,  H01R12/7005 ,  H01R12/721 ,  H01R12/725 ,  H01R12/735 ,  H01R13/405 ,  H01R13/6585

Abstract: An electrical connector includes a housing having a first end and a second end with a mating slot formed between the first and second ends configured to receive a mating connector having contact pads. A leadframe assembly is disposed in the housing. The leadframe assembly has a contact array including ground contacts and signal contacts interspersed between corresponding ground contacts. The leadframe assembly has an overmold body supporting the ground and signal contacts. The overmold body has lossy ground absorbers coupled to corresponding ground contacts. The lossy ground absorbers are manufactured from lossy material absorbing electrical resonance propagating through the leadframe assembly.

公开(公告)号：US09490587B1

公开(公告)日：2016-11-08

申请号：US14967563

申请日：2015-12-14

Applicant: TYCO ELECTRONICS CORPORATION

Inventor： Michael John Phillips ,  Thomas Taake de Boer ,  Bruce Allen Champion ,  John Joseph Consoli ,  Sandeep Patel ,  Linda Ellen Shields

IPC: H01R9/03 ,  H01R13/6586 ,  H01R13/6599 ,  H01R13/6587

CPC classification number: H01R13/6586 ,  H01R13/6587 ,  H01R13/6599

Abstract: A contact module stack includes signal contact modules and ground contact modules flanking the signal contact modules in a ground-signal-signal-ground contact module arrangement. The signal contact modules each include signal leadframes and signal dielectric bodies. The ground contact modules each include ground leadframes and ground dielectric bodies. The ground leadframes each have at least one ground contact. Each ground dielectric body has a low loss layer on a first side of the ground leadframe and a lossy layer on a second side of the ground leadframe. The lossy layer and the low loss layer substantially enclose a transition portion of the ground contact. The lossy layers are manufactured from lossy material having conductive particles in a dielectric binder material. The lossy layers absorb electrical resonance propagating through the contact module stack.

Abstract translation: 触点模块堆叠包括接地信号 - 接地触头模块装置中的信号触头模块侧面的信号触点模块和接地触头模块。 信号触点模块各自包括信号引线框架和信号电介质体。 接地触头模块各自包括接地引线框架和接地绝缘体。 接地引线框架各自具有至少一个接地触点。 每个接地电介质体在接地引线框架的第一侧具有低损耗层，在接地引线框架的第二侧具有有损层。 有损层和低损耗层基本上包围接地触点的过渡部分。 有损层由介电粘合剂材料中具有导电颗粒的有损耗材料制成。 有损层吸收通过触点模块叠层传播的电谐振。

公开(公告)号：US09455530B2

公开(公告)日：2016-09-27

申请号：US14321416

申请日：2014-07-01

Applicant: Tyco Electronics Corporation

Inventor： Sandeep Patel

IPC: H01R13/652 ,  H01R13/6471 ,  H01R13/6597 ,  H01R12/72 ,  H01R12/73

CPC classification number: H01R13/652 ,  H01R12/724 ,  H01R12/732 ,  H01R13/6471 ,  H01R13/6597

Abstract: An electrical connector includes a housing having a front and a rear. The housing including a slot defined through the front that is configured to receive a mating connector therein. Signal contacts are held in the housing. The signal contacts are arranged within the slot to mate with the mating connector. Ground contacts are held in the housing and interspersed among the signal contacts. The ground contacts are arranged within the slot to mate with the mating connector. A ground bus includes a base and multiple sets of projections extending from the base. Each set including at least two projections that engage the same corresponding ground contact at spaced-apart locations. The sets of projections are connected via the base to create a ground circuit between the ground contacts that are engaged by the ground bus.

Abstract translation: 电连接器包括具有前和后的外壳。 壳体包括通过前部限定的狭槽，其构造成在其中容纳配合连接器。 信号触点保持在外壳中。 信号触点布置在槽内以与配合连接器配合。 接地触点保持在外壳中，散布在信号触点之间。 接地触头布置在插槽内以与配合连接器配合。 地面总线包括基座和从基座延伸的多组突起。 每个组包括在间隔开的位置处接合相同的对应接地触头的至少两个突起。 这些突起通过基座连接，以在由接地母线接合的接地触头之间产生接地电路。