公开(公告)号：US08564954B2

公开(公告)日：2013-10-22

申请号：US12948964

申请日：2010-11-18

申请人： Tzu Hsin Huang ,  Yu Ting Yang ,  Hung Hsin Liu ,  An Hong Liu ,  Geng Shin Shen ,  Wei David Wang ,  Shih Fu Lee

发明人： Tzu Hsin Huang ,  Yu Ting Yang ,  Hung Hsin Liu ,  An Hong Liu ,  Geng Shin Shen ,  Wei David Wang ,  Shih Fu Lee

IPC分类号： H05K7/20 ,  F28F7/00

CPC分类号： H05K7/205 ,  B82B1/005 ,  B82Y10/00 ,  B82Y30/00 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/525 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29393 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/92147 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K5/0213 ,  Y10S977/932 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05647 ,  H01L2224/05124 ,  H01L2224/05147

摘要： A thermally enhanced electronic package comprises a driver chip, an insulator, a flexible carrier, and carbon nanocapsules. The flexible carrier includes a flexible substrate, a wiring layer formed on the substrate, and a resistant overlaying the wiring layer. The driver chip is connected to the wiring layer. The insulator is filled in the gap between the driver chip and the flexible carrier. The carbon nanocapsules are disposed on the driver chip, on the resistant, on the flexible carrier, or in the insulator to enhance heat dissipation of electronic packages.

摘要翻译： 热增强型电子封装包括驱动器芯片，绝缘体，柔性载体和碳纳米胶囊。 柔性载体包括柔性基板，形成在基板上的布线层和覆盖布线层的电阻。 驱动器芯片连接到布线层。 绝缘体填充在驱动器芯片和柔性载体之间的间隙中。 碳纳米胶囊设置在驱动芯片上，电阻上，柔性载体上或绝缘体中，以增强电子封装的散热。

公开(公告)号：US20110197950A1

公开(公告)日：2011-08-18

申请号：US13024650

申请日：2011-02-10

申请人： Ching Chieh Lin ,  Sin Wei Ho ,  Mei Hsiu Lin ,  Tzu Hsin Huang ,  Chun Hsien Chou ,  Yen Chen Chen

发明人： Ching Chieh Lin ,  Sin Wei Ho ,  Mei Hsiu Lin ,  Tzu Hsin Huang ,  Chun Hsien Chou ,  Yen Chen Chen

IPC分类号： H01L31/052 ,  H01L31/024

CPC分类号： H02S40/42

摘要： A photovoltaic module includes a solar module and a heat sink bonded with a solar unit in a vacuum heating pressing manner. The heat sink is used for dissipating thermal energy generated by the solar module. Through the structure, heat of the solar module can be dissipated more effectively, thereby increasing efficiency of photoelectric conversion. Besides, the structure of the photovoltaic module is simplified, a heat conduction interface material in the prior art is not required, and assembly can be performed in the vacuum heating pressing manner, thereby greatly simplifying the manufacturing procedure.

摘要翻译： 光伏模块包括以真空加热压制方式与太阳能单元结合的太阳能模块和散热器。 散热器用于消散太阳能模块产生的热能。 通过这种结构，可以更有效地消散太阳能模块的热量，从而提高光电转换的效率。 此外，光伏组件的结构简化，不需要现有技术中的导热界面材料，并且可以以真空加热加压方式进行组装，从而大大简化了制造程序。

公开(公告)号：US06952053B2

公开(公告)日：2005-10-04

申请号：US10284350

申请日：2002-10-31

申请人： Tzu Hsin Huang ,  Liming Tsau ,  Vincent Chen

发明人： Tzu Hsin Huang ,  Liming Tsau ,  Vincent Chen

IPC分类号： H01L23/48 ,  H01L31/072

CPC分类号： H01L24/05 ,  H01L22/32 ,  H01L24/11 ,  H01L2224/0401 ,  H01L2224/05001 ,  H01L2224/05073 ,  H01L2224/05554 ,  H01L2224/05558 ,  H01L2224/05624 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/00014

摘要： The present invention is a metal bond pad that provides electrical and mechanical connection to an integrated circuit (IC). The metal bond pad is configured to accommodate for probe travel during probing measurements, without modifying the size of the passivation opening of the bond pad. This enables higher density of active devices on the IC and therefore increases integration and lowers IC cost. The metal bond pad for the integrated circuit includes a substrate, a first metal layer, and a second metal layer. The substrate has the first metal layer disposed therein, having an opening from the top surface of the substrate. The second metal layer has a first-end portion, a second-end portion and a center portion disposed between the first-end portion and the second-end portion. The center portion of the second metal layer is aligned with the opening in the substrate and a bottom surface of the center portion is in contact with the top surface of the first metal layer. A top surface of the center portion has a recessed region that forms a first edge with said first-end portion and a second edge with said second-end portion. The first-end portion of the second metal layer is disposed on the top surface of the substrate and extends from the first edge of the recessed region. It has a length defined from the first edge of the opening. The second-end portion is also disposed on the top surface of the substrate and extends from the second edge of the recessed region. It has a length defined from the second edge of the recessed region, and it is longer than the length of the first-portion.

摘要翻译： 本发明是提供与集成电路（IC）的电连接和机械连接的金属接合焊盘。 金属接合焊盘被配置为在探测测量期间适应探头行程，而不改变接合焊盘的钝化开口的尺寸。 这使得IC上的有源器件的密度更高，因此增加了集成度并降低了IC成本。 用于集成电路的金属焊盘包括衬底，第一金属层和第二金属层。 衬底具有设置在其中的第一金属层，具有从衬底的顶表面开口。 第二金属层具有设置在第一端部和第二端部之间的第一端部，第二端部和中心部。 第二金属层的中心部分与衬底中的开口对准，并且中心部分的底表面与第一金属层的顶表面接触。 中心部分的顶表面具有与所述第一端部分形成第一边缘的凹陷区域和具有所述第二端部分的第二边缘。 第二金属层的第一端部设置在基板的顶表面上并且从凹陷区域的第一边缘延伸。 它具有从开口的第一边缘限定的长度。 第二端部也设置在基板的顶表面上并且从凹陷区域的第二边缘延伸。 它具有从凹陷区域的第二边缘限定的长度，并且其长度大于第一部分的长度。