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公开(公告)号：US08564954B2
公开(公告)日：2013-10-22
申请号：US12948964
申请日：2010-11-18
申请人： Tzu Hsin Huang , Yu Ting Yang , Hung Hsin Liu , An Hong Liu , Geng Shin Shen , Wei David Wang , Shih Fu Lee
发明人： Tzu Hsin Huang , Yu Ting Yang , Hung Hsin Liu , An Hong Liu , Geng Shin Shen , Wei David Wang , Shih Fu Lee
CPC分类号： H05K7/205 , B82B1/005 , B82Y10/00 , B82Y30/00 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L23/525 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05569 , H01L2224/05572 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/29101 , H01L2224/2919 , H01L2224/29393 , H01L2224/32145 , H01L2224/32225 , H01L2224/456 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48465 , H01L2224/48471 , H01L2224/73204 , H01L2224/73215 , H01L2224/73265 , H01L2224/8592 , H01L2224/92147 , H01L2224/92247 , H01L2225/0651 , H01L2225/06541 , H01L2225/06565 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01077 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H05K5/0213 , Y10S977/932 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/05647 , H01L2224/05124 , H01L2224/05147
摘要： A thermally enhanced electronic package comprises a driver chip, an insulator, a flexible carrier, and carbon nanocapsules. The flexible carrier includes a flexible substrate, a wiring layer formed on the substrate, and a resistant overlaying the wiring layer. The driver chip is connected to the wiring layer. The insulator is filled in the gap between the driver chip and the flexible carrier. The carbon nanocapsules are disposed on the driver chip, on the resistant, on the flexible carrier, or in the insulator to enhance heat dissipation of electronic packages.
摘要翻译： 热增强型电子封装包括驱动器芯片，绝缘体，柔性载体和碳纳米胶囊。 柔性载体包括柔性基板，形成在基板上的布线层和覆盖布线层的电阻。 驱动器芯片连接到布线层。 绝缘体填充在驱动器芯片和柔性载体之间的间隙中。 碳纳米胶囊设置在驱动芯片上，电阻上，柔性载体上或绝缘体中，以增强电子封装的散热。
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公开(公告)号：US20110304991A1
公开(公告)日：2011-12-15
申请号：US12948964
申请日：2010-11-18
申请人： TZU HSIN HUANG , YU TING YANG , HUNG HSIN LIU , AN HONG LIU , GENG SHIN SHEN , DAVID WEI WANG , SHIH FU LEE
发明人： TZU HSIN HUANG , YU TING YANG , HUNG HSIN LIU , AN HONG LIU , GENG SHIN SHEN , DAVID WEI WANG , SHIH FU LEE
CPC分类号： H05K7/205 , B82B1/005 , B82Y10/00 , B82Y30/00 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L23/525 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05569 , H01L2224/05572 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/29101 , H01L2224/2919 , H01L2224/29393 , H01L2224/32145 , H01L2224/32225 , H01L2224/456 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48465 , H01L2224/48471 , H01L2224/73204 , H01L2224/73215 , H01L2224/73265 , H01L2224/8592 , H01L2224/92147 , H01L2224/92247 , H01L2225/0651 , H01L2225/06541 , H01L2225/06565 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01077 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H05K5/0213 , Y10S977/932 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/05647 , H01L2224/05124 , H01L2224/05147
摘要： A thermally enhanced electronic package comprises a driver chip, an insulator, a flexible carrier, and carbon nanocapsules. The flexible carrier includes a flexible substrate, a wiring layer formed on the substrate, and a resistant overlaying the wiring layer. The driver chip is connected to the wiring layer. The insulator is filled in the gap between the driver chip and the flexible carrier. The carbon nanocapsules are disposed on the driver chip, on the resistant, on the flexible carrier, or in the insulator to enhance heat dissipation of electronic packages.
摘要翻译： 热增强型电子封装包括驱动器芯片，绝缘体，柔性载体和碳纳米胶囊。 柔性载体包括柔性基板，形成在基板上的布线层和覆盖布线层的电阻。 驱动器芯片连接到布线层。 绝缘体填充在驱动器芯片和柔性载体之间的间隙中。 碳纳米胶囊设置在驱动芯片上，电阻上，柔性载体上或绝缘体中，以增强电子封装的散热。
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