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公开(公告)号：US10468570B2
公开(公告)日：2019-11-05
申请号：US15880561
申请日：2018-01-26
Applicant: Unimicron Technology Corp.
Inventor： Po-Hsuan Liao , Zong-Hua Li
Abstract: A circuit board includes a base plate, a first circuit layer, a first dielectric layer, and a light emitting element. The first circuit layer is disposed on the base plate. The first dielectric layer is disposed on the base plate and has plural openings. The first circuit layer is embedded in the first dielectric layer and exposes the openings. A Young's modulus of the first dielectric layer is greater than a Young's modulus of the base plate. The light emitting element is electrically connected to the first circuit layer through the openings.
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Patent Agency Ranking
公开(公告)号：US10736215B1
公开(公告)日：2020-08-04
申请号：US16421467
申请日：2019-05-23
Applicant: Unimicron Technology Corp.
Inventor： Shao-Chien Lee , Ming-Hao Wu , Zong-Hua Li
Abstract: A multilayer circuit board structure includes a first multilayer circuit board and a second multilayer circuit board. The first multilayer circuit board includes a first patterned circuit layer and a first dummy circuit layer. The first dummy circuit layer surrounds the first patterned circuit layer. The second multilayer circuit board is disposed on the first multilayer circuit board, and includes a second patterned circuit layer and a second dummy circuit layer surrounding the second patterned circuit layer. The first patterned circuit layer is bonded to the second patterned circuit layer and the first dummy circuit layer is bonded to the second dummy circuit layer. A hollow space is defined between the first multilayer circuit board and the second multilayer circuit board.
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3.发明申请公开(公告)号：US20190067543A1
公开(公告)日：2019-02-28
申请号：US15826702
申请日：2017-11-30
Applicant: Unimicron Technology Corp.
Inventor： Wen-Fang Liu , Shao-Chien Lee , Chen-Wei Tseng , Zong-Hua Li
IPC: H01L33/64 , H01L25/075 , H01L33/62
Abstract: A heat dissipation substrate structure includes a multilayer circuit board including a core board and build-up boards, a heat conduction layer, a cavity structure, bonding pads, and vias. The heat conduction layer is disposed within the core board, or on a surface of the core board, or on a surface of one of the build-up boards. The cavity structure is in the multilayer circuit board with respect to the heat conduction layer and exposes a first surface of the heat conduction layer. The bonding pads are on the surface of the multilayer circuit board at a side of a second surface of the heat conduction layer. The portions of the vias are connected to portions of the bonding pads and the heat conduction layer. Accordingly, heat flow can be distributed via a heat dissipation path from the bonding pads through the vias to the heat conduction layer.
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公开(公告)号：US20180368263A1
公开(公告)日：2018-12-20
申请号：US15622078
申请日：2017-06-14
Applicant: Unimicron Technology Corp.
Inventor： Wen-Fang Liu , Shao-Chien Lee , Chen-Wei Tseng , Zong-Hua Li , Chien-Tsai Li
Abstract: A chip package circuit board module including a circuit board and at least one original chip is provided. The circuit board includes at least one first pad, at least one second pad and at least one substitute pad. The at least one second pad is located besides the at least one first pad and separated from the at least one first pad. The at least one substitute pad is adjacent to the at least one second pad and separated from the at least one first pad and the at least one second pad. The at least one original chip is connected to the at least one first pad and at least one the second pad, respectively. A total width of a portion corresponding to each of the at least one second pad and a portion corresponding to the substitute pad adjacent to the second pad of the first pad is greater than or equal to twice a width of the original chip.
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公开(公告)号：US10159151B1
公开(公告)日：2018-12-18
申请号：US15622078
申请日：2017-06-14
Applicant: Unimicron Technology Corp.
Inventor： Wen-Fang Liu , Shao-Chien Lee , Chen-Wei Tseng , Zong-Hua Li , Chien-Tsai Li
Abstract: A chip package circuit board module including a circuit board and at least one original chip is provided. The circuit board includes at least one first pad, at least one second pad and at least one substitute pad. The at least one second pad is located besides the at least one first pad and separated from the at least one first pad. The at least one substitute pad is adjacent to the at least one second pad and separated from the at least one first pad and the at least one second pad. The at least one original chip is connected to the at least one first pad and at least one the second pad, respectively. A total width of a portion corresponding to each of the at least one second pad and a portion corresponding to the substitute pad adjacent to the second pad of the first pad is greater than or equal to twice a width of the original chip.
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公开(公告)号：US10056356B1
公开(公告)日：2018-08-21
申请号：US15585166
申请日：2017-05-03
Applicant: Unimicron Technology Corp.
Inventor： Wen-Fang Liu , Shao-Chien Lee , Chen-Wei Tseng , Zong-Hua Li
IPC: H01L25/075 , H01L23/498
CPC classification number: H01L25/0753 , H01L23/49811 , H01L33/62
Abstract: A chip package circuit board module includes a circuit board and an original chip. The circuit board includes a first pad and a second pad disposed besides the first pad and separated from the first pad. The original chip is connected to the first pad and the second pad. A width of the original chip is W1, a total width of the first pad is P1, and a total width of the second pad is P2. The total width P1 of the first pad is larger than twice of the width W1 of the original chip, and the total width P2 of the second pad is larger than twice of the width W1 of the original chip.
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