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公开(公告)号:US12132447B2
公开(公告)日:2024-10-29
申请号:US18262527
申请日:2023-01-13
Inventor: Yiming Yu , Kai Kang , Chenxi Zhao , Huihua Liu , Yunqiu Wu
CPC classification number: H03D7/1458 , H03D7/1441 , H04B1/005
Abstract: The present invention belongs to the technical field of 5G millimeter wave communication and discloses a 5G dual-band up-mixer with switching between amplification function and frequency mixing function, and terminal. The first double-balanced active mixer and the second double-balanced active mixer are connected in series, and both ends of the first double-balanced active mixer are connected with a first transformer and a second transformer respectively; both ends of the second double-balanced active mixer are respectively connected with the second transformer and the third transformer; the first double-balanced active mixer is provided with a first MOSFET and a fourth transformer connected with the first MOSFET; the second double-balanced active mixer is provided with a second MOSFET and a fifth transformer connected with the second MOSFET.
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公开(公告)号:US11062072B1
公开(公告)日:2021-07-13
申请号:US16912006
申请日:2020-06-25
Inventor: Yuehang Xu , Shuman Mao , Yunqiu Wu
IPC: G06F30/30 , G06F30/367 , G06F30/373 , G06F119/22 , G06F119/06
Abstract: A yield load pull system-based integrated circuit design method and a system thereof are provided. The method includes: setting a yield-related threshold; setting a source impedance; configuring a sweep range of a Smith chart; determining load impedance points within the sweep range of the Smith chart; acquiring impedance information; determining output characteristics of a plurality of sample devices at each load impedance point of the determined load impedance points, based on the source impedance and the impedance information corresponding to each load impedance point, by invoking a harmonic balance simulator embedded in an Advanced Design System, where the output characteristics comprise: a large-signal gain, an output power and a power-added efficiency; determining a device yield for each load impedance point; for each output characteristic calculating a mean value across the plurality of sample devices, at each load impedance point; and determining a best load impedance; conducting IC design.
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公开(公告)号:US12184317B2
公开(公告)日:2024-12-31
申请号:US18262503
申请日:2023-01-13
Inventor: Chenxi Zhao , Kai Kang , Yiming Yu , Huihua Liu , Yunqiu Wu
Abstract: This invention, falling into the field of radio communication technology, discloses 5G millimeter wave dual-band dual-mode mixer and wireless communication terminal. In the said 5G millimeter wave dual-band dual-mode mixer, the first MOSFET is connected to the source of the second MOSFET and the third MOSFET through its drain, with the first MOSFET connected to the drain of the fourth MOSFET through its drain. The second MOSFET is connected to one end of the first capacitor through its gate, with the other end of the first capacitor connected to the drain of the third MOSFET. The third MOSFET is connected to one end of the second capacitor through its gate and the other end of the second capacitor is connected to the drain of the second MOSFET.
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公开(公告)号:US11973136B2
公开(公告)日:2024-04-30
申请号:US17264521
申请日:2019-12-20
Inventor: Yuehang Xu , Yan Wang , Yunqiu Wu
IPC: H01L29/778 , H01L21/02 , H01L23/14 , H01L29/20 , H01L29/66
CPC classification number: H01L29/7786 , H01L23/145 , H01L29/2003 , H01L29/66462
Abstract: The present disclosure provides a flexible microwave power transistor and a preparation method thereof. In view of great lattice mismatch and poor performance of a device prepared with a Si substrate in an existing preparation method, the preparation method of the present disclosure grows a gallium nitride high electron mobility transistor (GaN HEMT) layer on a rigid silicon carbide (SiC) substrate to avoid lattice mismatch between a silicon (Si) substrate and gallium nitride (GaN), improving performance of the flexible microwave power transistor. Moreover, in view of problems such as low output power, power added efficiency and power gain with the existing device preparation method, the present disclosure retains part of the rigid SiC substrate and grows a flexible substrates at room temperature to prepare a high-quality device. The present disclosure has greatly improved power output capability, efficiency and gain, and basically unchanged performance of device under 0.75% of stress.
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