公开(公告)号：US3841957A

公开(公告)日：1974-10-15

申请号：US29821472

申请日：1972-10-17

Applicant: WESTINGHOUSE ELECTRIC CORP

Inventor： SPRENGLING G

IPC: C08K9/00 ,  C08G85/00 ,  C08J5/08 ,  C08K5/00 ,  C08K9/04 ,  C08L23/00 ,  C08L67/00 ,  C08L77/00 ,  C08L101/00 ,  H01B3/30 ,  H01B3/40 ,  H05K1/03 ,  B32B15/08 ,  B32B15/04

CPC classification number: B32B27/20 ,  B32B27/281 ,  B32B27/285 ,  B32B27/32 ,  B32B27/36 ,  B32B27/38 ,  B32B27/42 ,  B32B2315/085 ,  B32B2323/04 ,  B32B2325/00 ,  B32B2363/00 ,  B32B2367/00 ,  B32B2371/00 ,  B32B2379/08 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2203/122 ,  Y10T428/31511

Abstract: 1. AN ARTICLE COMPRISING (A) A FLAT BOARD WHICH COMPRISES (1) ABOUT 15 TO ABOUT 70% OF A HARDENED, SYNTHETIC, ORGANIC RESIN; (2) ABOUT 30 TO ABOUT 85% NON-CONDUCTIVE FILLER; AND (3) ABOUT 0.001 TO ABOUT 1.0% OF A SURFACTANT HAVING A PERFLUORINATED CHAIN AT LEAST THREE CARBON ATOMS ALONG AT ONE END AND A POLAR GROUP AT THE OTHER END, SAID SURFACTANT POSSESSING THE PROPERTY OF LOWERING THE SURFACE ENERGY OF SAID RESIN BY FREELY MIGRATING TO THE SURFACE OF SAID RESIN AND TO ITS INTERFACES WITH SAID FILLER AFTER SAID RESIN IS HARDENED; AND (B) A CONDUCTING CIRCUIT BONDED TO AT LEAST ONE SIDE OF SAID FLAT BOARD.

公开(公告)号：US3811005A

公开(公告)日：1974-05-14

申请号：US22858672

申请日：1972-02-23

Applicant: WESTINGHOUSE ELECTRIC CORP

Inventor： TRAYNOR E ,  ROGERS D ,  TRUNZO F ,  SPRENGLING G

IPC: C03C27/10 ,  B29C63/00 ,  B32B17/04 ,  B32B19/02 ,  B32B37/00 ,  H01B3/00 ,  H01B3/04 ,  H01B3/08 ,  H01B7/28 ,  B32B17/10 ,  B32B27/12

CPC classification number: B32B19/06 ,  B32B5/024 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2315/085 ,  H01B3/002 ,  H01B3/04 ,  H01B3/084 ,  Y10T428/251 ,  Y10T428/26 ,  Y10T428/2913 ,  Y10T442/3935

Abstract: A composite structure is disclosed which comprises a layer of glass cloth and a layer of mica paper impregnated and bonded together with a B-stage dephenyl oxide resin composition. The structure may be in the form of a tape or of a sheet and is used as insulation over electrical conductors. The dephenyl oxide composition preferably comprises a mixture of methoxy methyl diphenyl oxide and chloromethyl diphenyl oxide and a curing catalyst of finely divided silica containing a small amount of iron metal.

Abstract translation: 公开了一种复合结构，其包括玻璃布层和浸渍并与B阶段苯基氧化物树脂组合物粘合在一起的云母纸层。 该结构可以是带或片的形式，并且用作电导体上的绝缘体。 所述脱苯氧基组合物优选包含甲氧基甲基二苯基氧化物和氯甲基二苯基氧化物的混合物以及含有少量铁金属的细碎二氧化硅的固化催化剂。