公开(公告)号：US10147664B2

公开(公告)日：2018-12-04

申请号：US15495720

申请日：2017-04-24

Applicant: Xilinx, Inc.

Inventor： Gamal Refai-Ahmed ,  Suresh Ramalingam ,  Daniel Elftmann ,  Brian D. Philofsky ,  Anthony Torza

IPC: H01L23/10 ,  H01L23/34 ,  H01L23/367 ,  H05K1/18 ,  H01L23/433 ,  H01L23/373 ,  H01L23/498 ,  H01L23/00

Abstract: Chip packages and electronic devices are provided that include a heat sink flexibly interfaced with a die for enhanced temperature control. In one example, a solid state electronic assembly is provided that includes a first integrated circuit (IC) die mounted to a substrate and a heat sink mounted over the first IC die. The heat sink includes a thermally conductive plate and a first thermal carrier. The first thermal carrier has a first end mechanically fixed to the conductive plate. The first thermal carrier has a second end cantilevered from the conductive plate. The second end is in conductive contact with a top surface of the first IC die.

公开(公告)号：US20180308783A1

公开(公告)日：2018-10-25

申请号：US15495720

申请日：2017-04-24

Applicant: Xilinx, Inc.

Inventor： Gamal Refai-Ahmed ,  Suresh Ramalingam ,  Daniel Elftmann ,  Brian D. Philofsky ,  Anthony Torza

IPC: H01L23/367 ,  H05K1/18 ,  H01L23/433 ,  H01L23/373 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L23/3675 ,  H01L23/3672 ,  H01L23/3736 ,  H01L23/433 ,  H01L23/4338 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/32 ,  H01L24/72 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29293 ,  H01L2224/29299 ,  H01L2224/293 ,  H01L2224/32221 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H05K1/181 ,  H05K2201/10378 ,  H05K2201/10734 ,  H01L2924/0665 ,  H01L2924/01006

Abstract: Chip packages and electronic devices are provided that include a heat sink flexibly interfaced with a die for enhanced temperature control. In one example, a solid state electronic assembly is provided that includes a first integrated circuit (IC) die mounted to a substrate and a heat sink mounted over the first IC die. The heat sink includes a thermally conductive plate and a first thermal carrier. The first thermal carrier has a first end mechanically fixed to the conductive plate. The first thermal carrier has a second end cantilevered from the conductive plate. The second end is in conductive contact with a top surface of the first IC die.