公开(公告)号：US09412674B1

公开(公告)日：2016-08-09

申请号：US14062805

申请日：2013-10-24

Applicant: Xilinx, Inc.

Inventor： Myongseob Kim ,  Henley Liu ,  Cheang-Whang Chang ,  Sanjiv Stokes

IPC: H01L23/58 ,  H01L29/10 ,  H01L21/66 ,  G01R31/26

CPC classification number: H01L22/34 ,  H01L22/14 ,  H01L22/32 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/06 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/06181 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/14181 ,  H01L2224/14515 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/17515 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/014 ,  H01L2224/03 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/1403

Abstract: An integrated circuit includes a die having a conductive layer. The conductive layer includes a data wire, a first power supply wire of a first voltage potential, and a second power supply wire of a second voltage potential different from the first voltage potential. A segment of the data wire is located between, and substantially parallel to, a segment of the first power supply wire and a segment of the second power supply wire. Further, the first power supply wire is coupled to a first probe structure; and, the second power supply wire is coupled to a second probe structure.

Abstract translation: 集成电路包括具有导电层的管芯。 导电层包括数据线，第一电压电位的第一电源线和不同于第一电压电位的第二电压电位的第二电源线。 数据线的一段位于第一电源线的一段和第二电源线的一段之间并基本上平行。 此外，第一电源线耦合到第一探针结构; 并且所述第二电源线耦合到第二探针结构。