PREPARATION OF METAL SUBSTRATE SURFACES FOR ELECTROPLATING IN IONIC LIQUIDS
    10.
    发明申请
    PREPARATION OF METAL SUBSTRATE SURFACES FOR ELECTROPLATING IN IONIC LIQUIDS 有权
    用于离子液体电镀的金属基材表面的制备

    公开(公告)号:US20150322582A1

    公开(公告)日:2015-11-12

    申请号:US14271371

    申请日:2014-05-06

    IPC分类号: C25D3/44 C25D5/18 C25D5/44

    摘要: Metal surface pretreatments using ionic liquids prior to electroplating are disclosed. The surface treatments include forming an activated metal substrate surface by removing any naturally formed metal oxide layers formed on the surfaces of the metal substrates. According to some embodiments, the surface treatments include exposing the metal substrate to a non-aqueous ionic liquid. In some embodiments, an electrical current is applied to the metal substrate to assist removal of the metal oxide layer. The electrical current can be a pulsed anodic current. After activating the surface, a metal layer can be deposited on the activated surface. In some embodiments, the metal layer is electrodeposited in the same ionic liquid used to form the activated surface. The resultant metal coating is resistant to scratching and peeling.

    摘要翻译: 公开了在电镀之前使用离子液体的金属表面预处理。 表面处理包括通过去除在金属基板的表面上形成的任何天然形成的金属氧化物层来形成活化的金属基板表面。 根据一些实施方案,表面处理包括将金属基材暴露于非水性离子液体。 在一些实施例中,电流被施加到金属基底以辅助去除金属氧化物层。 电流可以是脉冲阳极电流。 激活表面后,金属层可沉积在活化表面上。 在一些实施方案中,将金属层电沉积在用于形成活化表面的相同离子液体中。 所得到的金属涂层耐划伤和剥离。