摘要:
A heat-sensitive recording material including a substrate having disposed thereon a heat-sensitive recording layer containing a diazo compound and a coupler compound capable of reacting with the diazo compound to develop color, wherein the coupler compound includes at least one of anilide derivatives represented by the following formula (1) or tautomers thereof: wherein R1 represents an alkyl group or an aryl group; R2, R3 and R4 each independently represent a hydrogen atom, a halogen atom, an alkyl group, an aryl group, an acyl group, an alkoxy group, an alkoxycarbonyl group, a hydroxycarbonyl group, an aminocarbonyl group, an acylamino group, a cyano group, a nitro group, an arylthio group or an alkylthio group; L represents a group which can leave upon coupling with the diazo compound; m represents 1 or 2; and n represents 1 or 2.
摘要:
Phenylurethane compounds of the following general formula (1); asymmetric urea compounds of the following general formula (10) obtained from the phenylurethane compounds; barbituric acid derivatives of general formula (18) produced from the asymmetric urea compounds, which have specific substituents and are useful in diazo thermal recording materials; and diazo thermal recording materials containing the barbituric acid derivative.
摘要:
A photosensitive composition, at least containing: a carboxyl group-containing photosensitive polyurethane resin; a phosphorus-containing flame retardant; a polymerizable compound; and a photopolymerization initiator, wherein both a resin polymer of the photosensitive polyurethane resin and the polymerizable compound do not contain a phosphorus atom, wherein the photosensitive polyurethane resin has the weight average molecular weight from 2,000 to 60,000, the acid value from 20 mg KOH/g to 120 mg KOH/g, and the ethylenically unsaturated group equivalent from 0.05 mmol/g to 3.0 mmol/g, and wherein the photosensitive polyurethane resin has, in the side chain thereof, at least one particular functional group.
摘要:
The present invention provides a polymerizable composition for a solder resist, including an infrared ray shielding material, a polymerization initiator, and a polymerizable compound, and a solder resist pattern forming method using the polymerizable composition for a solder resist.
摘要:
The present invention provides a void-containing resin molded product having high heat insulation properties and a method for producing such a molded product. The present invention also provides an image-receiving film or sheet that includes the void-containing resin molded product to provide favorable printing characteristics and is intended for use in a sublimation transfer recording material or a thermal transfer recording material.The void-containing resin molded product consists of a crystalline polymer and has voids therein, wherein the resin molded product has a ratio X/Y of 0.27 or less, where X denotes a thermal conductivity (in W/mK) of the void-containing resin molded product, and Y denotes a thermal conductivity (in W/mK) of a void-free polymer molded product having the same thickness as the void-containing resin molded product and formed of the same crystalline polymer that forms the void-containing resin molded product.
摘要:
The present invention provides a polymerizable composition for a solder resist, including an infrared ray shielding material, a polymerization initiator, and a polymerizable compound, and a solder resist pattern forming method using the polymerizable composition for a solder resist.
摘要:
A photosensitive composition including: a photosensitive polyurethane resin; a phosphorus-containing flame retardant; a polymerizable compound; and a photopolymerization initiator, wherein the photosensitive polyurethane resin contains an ethylenically unsaturated bond group and a carboxyl group, and contains a polyurethane skeleton which contains a polyol group as a repeating unit.
摘要:
A curable composition of the present invention includes resin-coated inorganic fine particles. The resin-coated inorganic fine particles may be formed by surface-modifying inorganic fine particles with a silane coupling agent containing an organic linking chain formed of a mercapto group, a hydroxyl group, an amino group, an isocyanato group, or a glycidyl group and then coating the surface-modified inorganic fine particles with a thermoplastic resin.
摘要:
Described is a method for producing a void-containing resin molded product which enables producing a void-containing resin molded product having a high color saturation and an appearance excellent in brightness and heat insulation properties by stretching polymer-molded product containing a single crystalline polymer, and a void-containing resin molded product obtained by the production method. A first aspect of the method for producing a void-containing resin molded product is a method for producing a void-containing resin molded product, the method including: stretching a polymer-molded product containing a single crystalline polymer in at least one axial direction, wherein a yield stress (A) and a stress (L30) at an elongation of 30% in a stress-strain curve of the polymer-molded product in the stretching in the one axial direction satisfy Relationship (I): L30/A
摘要翻译:描述了一种通过拉伸含有单晶聚合物的聚合物模制产品来制造含空隙的树脂模制产品的方法,该方法能够制备具有高色饱和度和亮度和隔热性能优异外观的含空隙的树脂模塑制品, 以及通过该制造方法得到的含空隙的树脂成形品。 含空隙的树脂成型体的制造方法的第一方面是含空隙的树脂成形体的制造方法,其特征在于,在至少一个轴向上拉伸含有单晶聚合物的聚合物成型体, 其中,在一个轴向的拉伸中,聚合物成型体的应力 - 应变曲线的伸长率为30%时的屈服应力(A)和应力(L30)满足关系式(I):L30 / A <0.90 关系(一)