公开(公告)号：US06799586B2

公开(公告)日：2004-10-05

申请号：US10349098

申请日：2003-01-23

申请人： Yuji Kamikawa ,  Kouji Egashira ,  Koji Tanaka

发明人： Yuji Kamikawa ,  Kouji Egashira ,  Koji Tanaka

IPC分类号： B08B304

CPC分类号： H01L21/67754 ,  H01L21/67051 ,  Y10S134/902 ,  Y10S414/138

摘要： An outer covering wall (26) and an inner covering wall (27), which are capable of surrounding a rotor (24), can be horizontally moved. A wafer carrier waiting portion (30) is disposed right below the rotor (24). A wafer holding member (41) included in a wafer lifter (40) moves into a wafer carrier (C) containing wafers (W) and mounted on a stage (31) (sliding table 32) included in the wafer carrier waiting portion (30), lifts up the wafers (W) and transfers the wafers (W) to the rotor (24). The outer covering wall (26) or the inner covering wall (27) surrounds the rotor (24) to define a processing chamber. The wafers (W) held on the rotor (24) are subjected to a cleaning process in the processing chamber.

摘要翻译： 可以水平地移动能够围绕转子（24）的外覆盖壁（26）和内覆盖壁（27）。 晶片载架等待部分（30）设置在转子（24）的正下方。 包括在晶片升降器（40）中的晶片保持构件（41）移动到包含晶片（W）的晶片载体（C）中并且安装在包括在晶片载体等待部分（30）中的载物台（31）（滑动台32）上 ），提升晶片（W）并将晶片（W）传送到转子（24）。 外覆盖壁（26）或内覆盖壁（27）围绕转子（24）以限定处理室。 保持在转子（24）上的晶片（W）在处理室中进行清洁处理。

公开(公告)号：US06532975B1

公开(公告)日：2003-03-18

申请号：US09635465

申请日：2000-08-11

申请人： Yuji Kamikawa ,  Kouji Egashira ,  Koji Tanaka

发明人： Yuji Kamikawa ,  Kouji Egashira ,  Koji Tanaka

IPC分类号： B08B300

CPC分类号： H01L21/67754 ,  H01L21/67051 ,  Y10S134/902 ,  Y10S414/138

摘要： An outer covering wall (26) and an inner covering wall (27), which are capable of surrounding a rotor (24), can be horizontally moved. A wafer carrier waiting portion (30) is disposed right below the rotor (24). A wafer holding member (41) included in a water lifter (40) moves into a wafer carrier (C) containing wafers (W) and mounted on a stage (31) (sliding table 32) included in the wafer carrier waiting portion (30), lifts up the wafers (W) and transfers the wafers (W) to the rotor (24). The outer covering wall (26) or the inner covering wall (27) surrounds the rotor (24) to define a processing chamber. The wafers (W) held on the rotor (24) are subjected to a cleaning process in the processing chamber.

摘要翻译： 可以水平地移动能够围绕转子（24）的外覆盖壁（26）和内覆盖壁（27）。 晶片载架等待部分（30）设置在转子（24）的正下方。 包括在提升器（40）中的晶片保持构件（41）移动到包含晶片（W）的晶片载体（C）中并安装在包括在晶片载体等待部分（30）中的台（31）（滑台32）上 ），提升晶片（W）并将晶片（W）传送到转子（24）。 外覆盖壁（26）或内覆盖壁（27）围绕转子（24）以限定处理室。 保持在转子（24）上的晶片（W）在处理室中进行清洁处理。

公开(公告)号：US08371318B2

公开(公告)日：2013-02-12

申请号：US13591877

申请日：2012-08-22

申请人： Teruomi Minami ,  Norihiro Ito ,  Yuji Kamikawa

发明人： Teruomi Minami ,  Norihiro Ito ,  Yuji Kamikawa

IPC分类号： B08B3/00

CPC分类号： H01L21/67051 ,  H01L21/67028 ,  H01L21/67034

摘要： A liquid processing apparatus 1 comprises a casing 5, a substrate holding mechanism 20 that holds a wafer (substrate to be processed) W, a process-liquid supplying mechanism 30 that supplies a process liquid, a draining cup 12 that receives a process liquid, and a draining pipe 13 that discharges a process liquid outside. The process-liquid supplying mechanism 30 includes a first chemical-liquid supply mechanism that supplies a hydrofluoric process liquid, and a drying-liquid supplying mechanism that supplies an organic solvent for drying a wafer W. A control part 50 causes the first chemical-liquid supplying mechanism to supply a hydrofluoric process liquid, and then causes the drying-liquid supplying mechanism to supply an organic solvent. In addition, before the control part 50 causes the drying-liquid supplying mechanism to supply an organic solvent, the control part causes a cleaning mechanism 10 to remove an alkaline component in a casing 5.

公开(公告)号：US08347901B2

公开(公告)日：2013-01-08

申请号：US11717170

申请日：2007-03-13

申请人： Tsukasa Watanabe ,  Naoki Shindo ,  Takahiro Furukawa ,  Yuji Kamikawa

发明人： Tsukasa Watanabe ,  Naoki Shindo ,  Takahiro Furukawa ,  Yuji Kamikawa

IPC分类号： B08B3/12

CPC分类号： B08B3/12 ,  B01F15/00207 ,  B01F15/0022 ,  B01F15/0429 ,  B08B3/00 ,  C11D11/0047 ,  H01L21/67057

摘要： The present invention provides a substrate cleaning method capable of removing particles from the entire surface of a substrate to be processed at a high removing efficiency. In the substrate cleaning method according to the present invention, a substrate to be processed W is immersed in a cleaning liquid in a cleaning tank 12. Then, ultrasonic waves are generated in the cleaning liquid contained in the cleaning tank 12, so that the substrate to be processed W is subjected to an ultrasonic cleaning process. While the substrate to be processed is being cleaned, a dissolved gas concentration of a gas dissolved in the cleaning liquid contained in the cleaning tank is changed.

摘要翻译： 本发明提供一种能够以高去除效率从待处理基板的整个表面去除颗粒的基板清洗方法。 在本发明的基板清洗方法中，将待处理基板W浸入清洗槽12内的清洗液中。然后，在包含在清洗槽12内的清洗液中产生超声波，使基板 待处理的W进行超声波清洗处理。 当被处理基板被清洗时，溶解在清洗槽中所含的清洗液中的溶解气体浓度变化。

公开(公告)号：US20120006356A1

公开(公告)日：2012-01-12

申请号：US13179254

申请日：2011-07-08

申请人： Yuji Kamikawa

发明人： Yuji Kamikawa

IPC分类号： B08B3/00

CPC分类号： H01L21/67051

摘要： Disclosed is a substrate processing apparatus in which a liquid state raw material is maintained at a high-temperature and high-pressure fluid state by a cooling mechanism at a first raw material receiving unit, a supplying valve of a raw material supplying path is opened to provide the high-temperature and high-pressure fluid to a processing chamber where a target substrate is disposed, and the target substrate is dried by the high-temperature and high-pressure fluid. A second raw material receiving unit is cooled down below a condensation temperature of the raw material by a second cooling mechanism, the high-temperature and high-pressure fluid in the processing chamber is collected at the second raw material receiving unit by opening a collecting valve. The collected raw material is re-utilized as a raw material supplied from the first raw material receiving unit to the processing chamber.

摘要翻译： 公开了一种基板处理装置，其中液态原料通过第一原料接收单元处的冷却机构保持在高温高压流体状态，原料供给路径的供给阀向 将高温高压流体提供给设置目标基板的处理室，并且通过高温高压流体干燥目标基板。 第二原料接收单元通过第二冷却机构冷却到低于原料的冷凝温度，通过打开集尘阀将处理室中的高温高压流体收集在第二原料接收单元 。 收集的原料被再利用为从第一原料接收单元供给到处理室的原料。

公开(公告)号：US20100083986A1

公开(公告)日：2010-04-08

申请号：US12596882

申请日：2008-12-12

申请人： Yuji Kamikawa ,  Norihiro Ito ,  Jiro Higashijima

发明人： Yuji Kamikawa ,  Norihiro Ito ,  Jiro Higashijima

IPC分类号： B08B3/08 ,  B08B13/00 ,  B08B7/00

CPC分类号： H01L21/68742 ,  H01L21/67051 ,  H01L21/68792

摘要： A liquid processing apparatus includes: a hollow holding plate configured to hold an object to be processed; a hollow outer rotational shaft fixedly connected to the holding plate; a rotary drive part configured to rotate the outer rotational shaft; and a lift pin plate disposed in a hollow space of the holding plate, and having a lift pin configured to support the object to be processed. Inside the lift pin plate, a cleaning-liquid supply part configured to supply a cleaning liquid is extended. Connected to the lift pin plate is a lifting member configured to locate the lift pin plate on an upper position and a lower position. When located on the lower position, the lift pin plate receives a force of the rotary drive part for rotating the outer rotational shaft so that the lift pin plate is rotated.

摘要翻译： 一种液体处理装置，包括：中空的保持板，其构造成保持待加工物体; 固定地连接到所述保持板的中空外旋转轴; 构造成旋转所述外旋转轴的旋转驱动部; 以及设置在所述保持板的中空空间中的提升销板，并且具有构造成支撑待处理物体的升降销。 在升降销板内部，延长了构造成供给清洗液的清洗液供给部。 连接到升降销板的是提升构件，其构造成将升降销板定位在上部位置和下部位置。 当位于下部位置时，提升销板受到用于旋转外部旋转轴的旋转驱动部的力，使得升降销板旋转。

公开(公告)号：US20090151756A1

公开(公告)日：2009-06-18

申请号：US11665847

申请日：2005-10-27

申请人： Yuji Kamikawa

发明人： Yuji Kamikawa

IPC分类号： B08B3/04

CPC分类号： H01L21/67057

摘要： A liquid treating apparatus comprising a holding device (30) for holding wafers (W) in a substantially vertical attitude and a treating vessel (10) for accommodating the wafers held by the holding device. A treating liquid is supplied into the treating vessel by means of a treating liquid supply system. A rotational drive device (20) is provided for rotating the holding device (30) around a rotational axis passing approximately through the center of the wafers (W) in a state of non-contact with the treating vessel (10).

摘要翻译： 一种液体处理装置，包括用于保持基本垂直姿势的晶片（W）的保持装置（30）和用于容纳由保持装置保持的晶片的处理容器（10）。 处理液通过处理液供给系统供给到处理容器中。 提供旋转驱动装置（20），用于在与处理容器（10）不接触的状态下围绕通过晶片（W）的中心的旋转轴线旋转保持装置（30）。

公开(公告)号：US20080097647A1

公开(公告)日：2008-04-24

申请号：US11907518

申请日：2007-10-12

申请人： Hiroshi Tanaka ,  Hironobu Hyakutake ,  Yuji Kamikawa

发明人： Hiroshi Tanaka ,  Hironobu Hyakutake ,  Yuji Kamikawa

IPC分类号： G06F19/00

CPC分类号： H01L21/67057 ,  H01L21/67028

摘要： The feature of the present invention is to enhance the throughput of manufacturing semiconductor wafers and/or liquid crystal substrates, by reducing the time required for performing a rinsing process. In this invention, the position of an object to be processed is controlled, such that a distance (L1) between the surface position (LV1) of a rinsing liquid upon the rinsing process and a top end position (LV2) of the object to be processed (wafers 2) becomes shorter than a distance (L2) between the surface position (LV3) of a chemical liquid upon a chemical liquid process and the top end position (LV4) of the object to be processed (wafers 2). Alternatively, the position of the object to be processed is controlled, such that the distance (L1) between the surface position (LV1) of the rinsing liquid upon the rinsing process and the top end position (LV2) of the object to be processed (wafers 2) becomes shorter than a distance (L3) between the bottom face position (LV5) of the rinsing liquid and a bottom end position (LV6) of the object to be processed (wafers 2).

摘要翻译： 本发明的特征是通过减少进行漂洗处理所需的时间来提高制造半导体晶片和/或液晶基板的生产量。 在本发明中，对被处理物的位置进行控制，使得漂洗处理后的冲洗液的表面位置（LV1）与上述漂洗液的顶端位置（LV2）之间的距离（L 1） 待处理对象（晶片2）变得短于化学液体处理时的化学液体的表面位置（LV 3）与待处理物体的顶端位置（LV 4）之间的距离（L 2） 晶圆2）。 或者，控制待处理对象的位置，使得漂洗过程中的冲洗液体的表面位置（LV 1）与物体的顶端位置（LV2）之间的距离（L 1）与 （晶片2）变得比漂洗液体的底面位置（LV5）和待处理物体（晶片2）的底端位置（LV6）之间的距离（L 3）短。

公开(公告)号：US07347214B2

公开(公告)日：2008-03-25

申请号：US10393882

申请日：2003-03-21

申请人： Koji Egashira ,  Yuji Kamikawa ,  Masaki Taira

发明人： Koji Egashira ,  Yuji Kamikawa ,  Masaki Taira

IPC分类号： B08B9/02

CPC分类号： H01L21/67126 ,  F16J15/164 ,  F16J15/406 ,  Y10S134/902 ,  Y10S277/917

摘要： The present invention provides a rotary shaft sealing mechanism having the seal between the rotary shaft and the seal ring improved, and a liquid processing apparatus including the rotary shaft sealing mechanism.The cleaning processing apparatus 1 comprises a rotor 34 for holding wafers W, an outer chamber 71a and an inner chamber 71b which can house the rotor 34, a spindle 50 for rotating the rotor 34, and an outer cylindrical member 32 disposed around the spindle 50. A first sealing ring 13, etc. of resins are provided in a ring member 12 constituting the outer cylindrical member 32. A clearance between the spindle 50 and the first sealing ring 13 is adjusted by press inserting the spindle 50 into the first sealing ring 13, etc. and rotating the spindle 50 for a prescribed period of time to abrade the fist sealing ring 13, etc.

摘要翻译： 本发明提供了一种旋转轴密封机构，其具有在旋转轴和密封环之间的密封，并且具有旋转轴密封机构的液体处理装置。 清洁处理装置1包括用于保持晶片W的转子34，可以容纳转子34的外部室71a和内部室71b，用于使转子34旋转的主轴50和围绕其旋转的外部圆筒形构件32 在构成外筒构件32的环构件12中设置有树脂的第一密封环13等。通过将主轴50压入第一密封圈13中来调节主轴50和第一密封环13之间的间隙 密封圈13等，并且将心轴50旋转规定的时间以磨擦第一密封圈13等

公开(公告)号：US07314054B2

公开(公告)日：2008-01-01

申请号：US09801106

申请日：2001-02-28

申请人： Koji Egashira ,  Yuji Kamikawa

发明人： Koji Egashira ,  Yuji Kamikawa

IPC分类号： B08B3/02

CPC分类号： H01L21/67051 ,  B08B3/02 ,  Y10S134/902

摘要： A liquid processing apparatus includes containers 26, 27, 26a, 26b surrounding processing chambers 51, 52 for accommodating a plurality of wafers W and nozzles 54, 56 for supplying a processing liquid to the substrates W in order to perform a liquid process. The nozzles 54, 56 are respectively equipped with a plurality of ejecting orifices 53, 55 capable of ejecting the processing liquid in a plane manner, allowing the substrates W to be processed uniformly and effectively.

摘要翻译： 液体处理装置包括容纳多个晶片W的处理室51,52的容器26,27,26a，26b和用于向基板W供给处理液体以进行液体处理的喷嘴54,56。 喷嘴54,56分别配备有能够以平面方式喷射处理液的多个喷射孔53,55，从而能够均匀有效地对基板W进行加工。