公开(公告)号：US08002511B2

公开(公告)日：2011-08-23

申请号：US11585337

申请日：2006-10-24

申请人： Yuji Kamikawa ,  Koji Egashira

发明人： Yuji Kamikawa ,  Koji Egashira

IPC分类号： B65G49/07

CPC分类号： H01L21/67739 ,  H01L21/67718 ,  H01L21/67763 ,  H01L21/67778 ,  H01L21/67781 ,  Y10S414/138

摘要： A batch forming apparatus forms a batch of substrates by combining a plurality of substrates that have been taken out from a plurality of carriers each containing therein the substrates in a stacked manner. The batch forming apparatus includes: a substrate transfer mechanism that takes out the substrates from each carrier and transfer the substrates; a substrate relative positional relationship changing mechanism that rearranges one or more substrates out of the substrates transferred by the substrate transfer mechanism one by one relative to other substrates to change positional relationships of the substrates relative to each other; and a batch forming mechanism that forms a batch of substrates out of the substrates that have been transferred thereto by the substrate transfer mechanism, with positional relationships of the substrates having been changed relative to each other by the substrate relative positional relationship changing mechanism. A substrate processing system includes such a batch forming apparatus, and a substrate processing apparatus that process the batch of substrates formed by the batch forming apparatus.

摘要翻译： 批量形成装置通过组合从多个载体中取出的多个基板形成一批基板，每个载体以堆叠的方式包含在其中的基板。 批量形成装置包括：基板转印机构，其从每个载体取出基板并转印基板; 基板相对位置关系改变机构，用于相对于其它基板逐一地将由基板传送机构转印的基板中的一个或多个基板重新布置，以改变基板相对于彼此的位置关系; 以及批量形成机构，其通过基板传送机构在已经被转印到基板之外形成一批基板，基板的位置关系通过基板相对位置关系改变机构而相对于彼此改变。 一种基板处理系统包括这样的分批成型装置，以及处理由批量形成装置形成的一批基板的基板处理装置。

公开(公告)号：US07347214B2

公开(公告)日：2008-03-25

申请号：US10393882

申请日：2003-03-21

申请人： Koji Egashira ,  Yuji Kamikawa ,  Masaki Taira

发明人： Koji Egashira ,  Yuji Kamikawa ,  Masaki Taira

IPC分类号： B08B9/02

CPC分类号： H01L21/67126 ,  F16J15/164 ,  F16J15/406 ,  Y10S134/902 ,  Y10S277/917

摘要： The present invention provides a rotary shaft sealing mechanism having the seal between the rotary shaft and the seal ring improved, and a liquid processing apparatus including the rotary shaft sealing mechanism.The cleaning processing apparatus 1 comprises a rotor 34 for holding wafers W, an outer chamber 71a and an inner chamber 71b which can house the rotor 34, a spindle 50 for rotating the rotor 34, and an outer cylindrical member 32 disposed around the spindle 50. A first sealing ring 13, etc. of resins are provided in a ring member 12 constituting the outer cylindrical member 32. A clearance between the spindle 50 and the first sealing ring 13 is adjusted by press inserting the spindle 50 into the first sealing ring 13, etc. and rotating the spindle 50 for a prescribed period of time to abrade the fist sealing ring 13, etc.

摘要翻译： 本发明提供了一种旋转轴密封机构，其具有在旋转轴和密封环之间的密封，并且具有旋转轴密封机构的液体处理装置。 清洁处理装置1包括用于保持晶片W的转子34，可以容纳转子34的外部室71a和内部室71b，用于使转子34旋转的主轴50和围绕其旋转的外部圆筒形构件32 在构成外筒构件32的环构件12中设置有树脂的第一密封环13等。通过将主轴50压入第一密封圈13中来调节主轴50和第一密封环13之间的间隙 密封圈13等，并且将心轴50旋转规定的时间以磨擦第一密封圈13等

公开(公告)号：US07314054B2

公开(公告)日：2008-01-01

申请号：US09801106

申请日：2001-02-28

申请人： Koji Egashira ,  Yuji Kamikawa

发明人： Koji Egashira ,  Yuji Kamikawa

IPC分类号： B08B3/02

CPC分类号： H01L21/67051 ,  B08B3/02 ,  Y10S134/902

摘要： A liquid processing apparatus includes containers 26, 27, 26a, 26b surrounding processing chambers 51, 52 for accommodating a plurality of wafers W and nozzles 54, 56 for supplying a processing liquid to the substrates W in order to perform a liquid process. The nozzles 54, 56 are respectively equipped with a plurality of ejecting orifices 53, 55 capable of ejecting the processing liquid in a plane manner, allowing the substrates W to be processed uniformly and effectively.

摘要翻译： 液体处理装置包括容纳多个晶片W的处理室51,52的容器26,27,26a，26b和用于向基板W供给处理液体以进行液体处理的喷嘴54,56。 喷嘴54,56分别配备有能够以平面方式喷射处理液的多个喷射孔53,55，从而能够均匀有效地对基板W进行加工。

公开(公告)号：US20070028950A1

公开(公告)日：2007-02-08

申请号：US11545471

申请日：2006-10-11

申请人： Koji Egashira ,  Yuji Kamikawa

发明人： Koji Egashira ,  Yuji Kamikawa

IPC分类号： B08B3/02

CPC分类号： H01L21/67051 ,  B08B3/02 ,  Y10S134/902

摘要： A liquid processing apparatus includes containers 26, 27, 26a, 26b surrounding processing chambers 51, 52 for accommodating a plurality of wafers W and nozzles 54, 56 for supplying a processing liquid to the substrates W in order to perform a liquid process. The nozzles 54, 56 are respectively equipped with a plurality of ejecting orifices 53, 55 capable of ejecting the processing liquid in a plane manner, allowing the substrates W to be processed uniformly and effectively.

摘要翻译： 液体处理装置包括容纳多个晶片W的处理室51,52的容器26,27,26a，26b和用于向基板W供给处理液体以进行液体处理的喷嘴54,56。 喷嘴54,56分别配备有能够以平面方式喷射处理液的多个喷射孔53,55，从而能够均匀有效地对基板W进行加工。

公开(公告)号：US08851819B2

公开(公告)日：2014-10-07

申请号：US12706958

申请日：2010-02-17

申请人： Yuji Kamikawa ,  Takafumi Tsuchiya ,  Koji Egashira

发明人： Yuji Kamikawa ,  Takafumi Tsuchiya ,  Koji Egashira

IPC分类号： B65G65/00 ,  H01L21/677

CPC分类号： H01L21/67775 ,  H01L21/67727 ,  H01L21/67733 ,  H01L21/67736 ,  H01L21/67769 ,  H01L21/67778 ,  H01L21/687 ,  H01L2221/68368 ,  Y10S414/14

摘要： A substrate processing apparatus, which utilizes a first transfer apparatus and a second transfer apparatus which are configured to transfer a transfer container containing a plurality of substrates, along a first transfer path and a second transfer path whose lateral positions differ from each other, respectively, including a first load port where the transfer container is loaded and unloaded by the first transfer apparatus, and a second load port that is arranged stepwise with respect to the first load port, with the transfer container being loaded to and unloaded from the second load port by the second transfer apparatus.

摘要翻译： 一种基板处理装置，其利用第一传送装置和第二传送装置，所述第一传送装置和第二传送装置分别沿着第一传送路径和横向位置彼此不同的第二传送路径传送包含多个基板的传送容器， 包括第一装载口，其中所述转运容器由所述第一转运装置装载和卸载;以及第二装载端口，其相对于所述第一装载端口逐步布置，所述转运容器被装载到所述第二装载端口并从所述第二装载端口卸载 通过第二传送装置。

公开(公告)号：US08567417B2

公开(公告)日：2013-10-29

申请号：US12896029

申请日：2010-10-01

申请人： Yuji Kamikawa ,  Hiroaki Inadomi ,  Hideyuki Yamamoto ,  Hiroshi Komiya ,  Koji Egashira

发明人： Yuji Kamikawa ,  Hiroaki Inadomi ,  Hideyuki Yamamoto ,  Hiroshi Komiya ,  Koji Egashira

IPC分类号： B08B3/12

CPC分类号： B08B3/12 ,  B08B3/048 ,  H01L21/67057 ,  H01L21/67313 ,  H01L21/67757

摘要： An ultrasonic cleaning apparatus including: a cleaning tank for storing a cleaning liquid; an object-to-be-processed holder for insertion into the cleaning tank, the holder holding an object to be processed and immersing the object into the cleaning liquid; a vibrator disposed on a bottom part of the cleaning tank; and an ultrasonic oscillator configured to make the vibrator ultrasonically vibrate. In the cleaning tank, a lateral holding member configured to hold the object is disposed. The holder is configured to be laterally moved by a driving apparatus. The control device is configured to control the driving apparatus such that the holder is laterally moved after the object has been held by the lateral holding member, and the control device is configured to control the ultrasonic oscillator such that the vibrator is made to ultrasonically vibrate so that the ultrasonic vibration from the vibrator is propagated to the object.

摘要翻译： 一种超声波清洗装置，包括：清洗槽，用于储存清洗液; 用于插入到清洁槽中的被处理物体的保持器，保持被处理物体并将物体浸入清洗液中的保持器; 设置在清洗槽底部的振动器; 以及配置成使振动器超声波振动的超声波振荡器。 在清洗槽中设置有用于保持物体的侧面保持构件。 保持器构造成由驱动装置横向移动。 所述控制装置被构造成控制所述驱动装置，使得所述保持器在所述物体被所述侧向保持构件保持之后横向移动，并且所述控制装置被配置为控制所述超声波振荡器，使得所述振动器被制成超声波振动 来自振动器的超声波振动传播到物体。

公开(公告)号：US20090010748A1

公开(公告)日：2009-01-08

申请号：US11585337

申请日：2006-10-24

申请人： Yuji Kamikawa ,  Koji Egashira

发明人： Yuji Kamikawa ,  Koji Egashira

IPC分类号： B65G59/00

CPC分类号： H01L21/67739 ,  H01L21/67718 ,  H01L21/67763 ,  H01L21/67778 ,  H01L21/67781 ,  Y10S414/138

摘要： A batch forming apparatus forms a batch of substrates by combining a plurality of substrates that have been taken out from a plurality of carriers each containing therein the substrates in a stacked manner. The batch forming apparatus includes: a substrate transfer mechanism that takes out the substrates from each carrier and transfer the substrates; a substrate relative positional relationship changing mechanism that rearranges one or more substrates out of the substrates transferred by the substrate transfer mechanism one by one relative to other substrates to change positional relationships of the substrates relative to each other; and a batch forming mechanism that forms a batch of substrates out of the substrates that have been transferred thereto by the substrate transfer mechanism, with positional relationships of the substrates having been changed relative to each other by the substrate relative positional relationship changing mechanism. A substrate processing system includes such a batch forming apparatus, and a substrate processing apparatus that process the batch of substrates formed by the batch forming apparatus.

摘要翻译： 批量形成装置通过组合从多个载体中取出的多个基板形成一批基板，每个载体以堆叠的方式包含在其中的基板。 批量形成装置包括：基板转印机构，其从每个载体取出基板并转印基板; 基板相对位置关系改变机构，用于相对于其它基板逐一地将由基板传送机构转印的基板中的一个或多个基板重新布置，以改变基板相对于彼此的位置关系; 以及批量形成机构，其通过基板传送机构在已经被转印到基板之外形成一批基板，基板的位置关系通过基板相对位置关系改变机构而相对于彼此改变。 一种基板处理系统包括这样的分批成型装置，以及处理由批量形成装置形成的一批基板的基板处理装置。

公开(公告)号：US06743297B2

公开(公告)日：2004-06-01

申请号：US10151092

申请日：2002-05-21

申请人： Koji Egashira ,  Sadayuki Fujishima ,  Yuji Kamikawa

发明人： Koji Egashira ,  Sadayuki Fujishima ,  Yuji Kamikawa

IPC分类号： B08B300

CPC分类号： H01L21/67303 ,  H01L21/67313 ,  H01L21/68707

摘要： A rotary substrate processing apparatus includes a rotor 1 having a holding member for holding a plurality of semiconductor wafers W arranged at appropriate intervals and a motor 4 for rotating the rotor 1. The holding member includes open/close holding rods 3 that are moved to open or close the rotor 1 in inserting the wafers W into the rotor 1 sideways and a plurality of constant-position holding rods 2a to 2d for holding the wafers W in cooperation with the open/close holding rods 3. Among the constant-position holding rods 2a to 2d, at least one constant-position holding rod 2a is equipped with a plurality of press members 5 which move toward respective peripheral portions of the wafers W by centrifugal force due to the rotation of the rotor 1. Consequently, it becomes possible to make the wafers W follow the rotation of the rotor 1 ensurely and also possible to reduce slip between the open/close holding rods 3, the constant-position holding rods 2a to 2d and the wafers W. Therefore, it is possible to accomplish both improvement in processing efficiency for the substrates and reduction in abrasion amount of the holding member and also possible to increase a life span of the apparatus.

摘要翻译： 旋转基板处理装置包括转子1，转子1具有用于保持以适当间隔布置的多个半导体晶片W的保持部件和用于使转子1旋转的马达4.保持部件具有开闭的保持棒3， 或关闭转子1，将晶片W侧向插入转子1，以及多个恒定位置保持杆2a至2d，用于与打开/关闭保持杆3配合保持晶片W.在恒定位置保持杆 如图2a至2d所示，至少一个恒定位置保持杆2a配备有多个按照转子1的旋转通过离心力朝向晶片W的周边部分移动的按压部件5。因此， 使得晶片W确保地跟随转子1的旋转，并且还可以减小打开/关闭保持杆3，恒定位置保持杆2a至2d和晶片W之间的滑动。因此 e，可以实现基板的加工效率的提高和保持部件的磨损量的降低，并且还可以延长设备的使用寿命。

公开(公告)号：US06698439B2

公开(公告)日：2004-03-02

申请号：US09912412

申请日：2001-07-02

申请人： Yuji Kamikawa ,  Koji Egashira

发明人： Yuji Kamikawa ,  Koji Egashira

IPC分类号： B08B302

CPC分类号： H01L21/67028 ,  Y10S134/902 ,  Y10T29/41

摘要： A processing apparatus includes an inner cylinder 25 (a processing chamber 23) accommodated in a carrying unit for carrying an object to be processed and further seals up the object with the inner cylinder 25 or a first stationary wall 34 to process the object in contact with processing fluid. In this processing apparatus with sealing mechanism, flexible hollow packings 100, 101 are arranged doubly in either the inner cylinder 25 or the first stationary wall 34, at its occluded part with the first stationary wall 34 and the inner cylinder 25. The hollow packings 100, 101 have their hollow parts 102 connected with respective pressurized-air sources 103 through pressure-detecting switches 110 and closing valves 105. By expanding or contracting the hollow packings 100, 101, the operation of the apparatus is switched in between its sealing state and non-sealing state. With this arrangement, it is possible to improve the sealing capability and prolong the life of the mechanism.

摘要翻译： 处理装置包括容纳在用于承载待处理物体的搬运单元中的内筒25（处理室23），并进一步用内筒25或第一固定壁34密封物体，以处理与物体接触的物体 加工液 在具有密封机构的该处理装置中，柔性中空填料100,101在内筒25或第一固定壁34中，在其与第一固定壁34和内筒25的封闭部分处双重布置。中空填料100 101具有通过压力检测开关110和关闭阀105与相应的加压空气源103连接的中空部分102.通过膨胀或收缩中空填料100,101，将设备的操作切换到其密封状态和 非密封状态。 通过这种布置，可以提高密封能力并延长机构的使用寿命。

公开(公告)号：US06725868B2

公开(公告)日：2004-04-27

申请号：US09987369

申请日：2001-11-14

申请人： Yuji Kamikawa ,  Koji Egashira

发明人： Yuji Kamikawa ,  Koji Egashira

IPC分类号： B08B302

CPC分类号： H01L21/67051 ,  B08B3/02 ,  Y10S134/902

摘要： A cleaning processing apparatus, which is one embodiment of a liquid processing apparatus for performing a liquid processing by supplying a predetermined process liquid to a target object to be processed such as a semiconductor wafer while rotating the target object, comprises a rotor for holding wafers W, a slidable process section for housing the rotor, and a cleaning liquid spurting nozzle for supplying a predetermined cleaning liquid to the wafers W. A housing for housing the slidable process section is of a hermetic structure so as to be substantially shielded from the outside.

摘要翻译： 一种清洁处理装置，其是通过在旋转目标物体的同时向诸如半导体晶片的目标被处理物体提供预定处理液来进行液体处理的一个实施例，包括用于保持晶片W的转子 ，用于容纳转子的可滑动工艺部分和用于将预定清洁液体供应到晶片W的清洗液喷射喷嘴。用于容纳可滑动处理部分的壳体是密封结构，以便基本上与外部隔绝。