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    METHOD OF MANUFACTURING A PLURALITY OF OPTICAL ELEMENTS AND PRODUCT THEREOF
    1.
    发明申请
    METHOD OF MANUFACTURING A PLURALITY OF OPTICAL ELEMENTS AND PRODUCT THEREOF 有权

    公开(公告)号：US20220137269A1

    公开(公告)日：2022-05-05

    申请号：US17431241

    申请日：2020-03-11

    Applicant: ams Sensors Singapore Pte. Ltd.

    Inventor： Nicola Spring ,  QiChuan Yu

    IPC: G02B3/00 ,  G02B13/00 ,  G02B7/02 ,  B29D11/00

    Abstract: A method of manufacturing a plurality of optical elements (140), the method comprising providing a first wafer (120) having hardened replication material forming optical elements (140) on a first side of the first wafer (120), providing a second wafer (121) having hardened replication material forming optical elements (140) on a first side of the second wafer (121), depositing liquid droplets (180) on the first side of the first wafer (120) between the optical elements (140) aligning the first side of the first wafer (120) with the first side of the second wafer (121), and bringing the two wafers (120, 121) together such that the liquid droplets (180) on the first side of the first wafer (120) adhere to the first side of the second wafer (121).

    METHOD OF MANUFACTURING A MASTER FOR A REPLICATION PROCESS
    2.
    发明申请
    METHOD OF MANUFACTURING A MASTER FOR A REPLICATION PROCESS 有权

    公开(公告)号：US20220229362A1

    公开(公告)日：2022-07-21

    申请号：US17607089

    申请日：2020-05-28

    Applicant: ams Sensors Singapore Pte. Ltd.

    Inventor： Ji Wang ,  Kam Wah Leong ,  QiChuan Yu ,  Sundar Raman Gnana Sambandam

    IPC: G03F7/00 ,  G03F7/16

    Abstract: A method of manufacturing a master for use in a wafer-scale replication process is disclosed. The method comprises at least one step of forming a layer of photoresist on a substrate and exposing the layer of photoresist to a radiation pattern to form at least one patterned layer. The method also comprises a step of developing the at least one patterned layer to provide one or more structures defining the master. In an embodiment, the at least one step of forming the layer of photoresist comprises a process of dry film lamination.

    METHODS FOR MANUFACTURING OPTICAL PRISMS
    3.
    发明公开
    METHODS FOR MANUFACTURING OPTICAL PRISMS 审中-公开

    公开(公告)号：US20230226721A1

    公开(公告)日：2023-07-20

    申请号：US17998192

    申请日：2021-05-11

    Applicant: ams Sensors Singapore Pte. Ltd.

    Inventor： QiChuan Yu ,  Sai Mun Chan ,  Ilias Bosdas ,  Kam Wah Leong ,  Quoc Bao Pham ,  Mark Dranreb Ulpindo

    IPC: B28D1/04 ,  G02B7/18 ,  B28D7/04

    CPC classification number: B28D1/04 ,  G02B7/1805 ,  B28D7/04 ,  G02B1/11

    Abstract: A method for producing a plurality of optical prisms comprises: providing at least one manufacturing intermediate; and dividing the at least one manufacturing intermediate into a plurality of individual triangular prisms. The manufacturing intermediate comprises a main body in the form of a triangular prism having three rectangular surfaces and two triangular surfaces. The main body is formed from a light-transmitting material. A layer of opaque material is provided on two of the three rectangular surfaces of the main body, the layer of opaque material having a plurality of axially spaced apertures on each of the two of the three rectangular surfaces, each one of the apertures on one of the two surfaces being disposed at substantially the same axial position as one of the apertures on the other one of the two surfaces. The at least one manufacturing intermediate is divided into a plurality of individual triangular prisms such that each individual triangular prism has one of the apertures on each of two sides thereof.

    VACUUM INJECTION MOLDING FOR OPTOELECTRONIC MODULES
    4.
    发明申请
    VACUUM INJECTION MOLDING FOR OPTOELECTRONIC MODULES 有权

    公开(公告)号：US20220020901A1

    公开(公告)日：2022-01-20

    申请号：US17294749

    申请日：2019-11-27

    Applicant: ams Sensors Singapore Pte. Ltd.

    Inventor： Ji Wang ,  Kam Wah Leong ,  QiChuan Yu ,  Simon Gubser ,  Yoong Kheng Teoh

    IPC: H01L33/56 ,  B29D11/00 ,  H01L25/16 ,  B29C33/12 ,  H01L33/00

    Abstract: Manufacturing optoelectronic modules includes supporting a printed circuit board substrate (27) on a first vacuum injection tool (24). The printed circuit board substrate (27) has at least one optoelectronic component mounted thereon and has a solder mask (40) on a surface (46) facing away from the first vacuum injection tool (24). The method includes causing the first vacuum injection tool (24) and a second vacuum injection tool (22) to be brought closer to one another such that a surface (46) of the second vacuum injection tool (22) is in contact with the solder mask (40). Subsequently, a first epoxy (100, 20) is provided, using a vacuum injection technique, in spaces (104) between the upper tool (22) and the solder mask (40).

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