公开(公告)号：USD327078S

公开(公告)日：1992-06-16

申请号：US301994

申请日：1989-01-25

申请人： Ken Nakao ,  Seishiro Sato ,  Wataru Ohkase

设计人： Ken Nakao ,  Seishiro Sato ,  Wataru Ohkase

公开(公告)号：US5069591A

公开(公告)日：1991-12-03

申请号：US328096

申请日：1989-03-23

申请人： Kenichi Kinoshita

发明人： Kenichi Kinoshita

IPC分类号： C30B31/10 ,  H01L21/677 ,  H01L21/687

CPC分类号： H01L21/67766 ,  C30B31/103 ,  H01L21/68707 ,  Y10S414/14

摘要： A semiconductor wafer-processing apparatus has a plurality of support members provided respectively for the processing units of a processing apparatus, and designed for supporting wafer receptacles each containing semiconductor wafers, and receptacle-inserting/extracting mechanism for inserting a wafer receptacle from the support members into the processing units, and for extracting the wafer receptacle from the processing units back to the support members. Receptacle-transporting mechanism is provided, operated independently of the receptacle inserting/extracting mechanism, for transporting the wafer receptacle between each support member and a predetermined position.

摘要翻译： 半导体晶片处理装置具有分别为处理装置的处理单元设置的多个支撑构件，其设计用于支撑各自包含半导体晶片的晶片插座，以及用于从支撑构件插入晶片容器的插座/取出机构 进入处理单元，并将晶片接收器从处理单元提回到支撑构件。 提供了插座输送机构，独立于插座插入/拔出机构操作，用于在每个支撑构件和预定位置之间输送晶片插座。

公开(公告)号：US5054988A

公开(公告)日：1991-10-08

申请号：US377949

申请日：1989-07-11

申请人： Hirotsugu Shiraiwa

发明人： Hirotsugu Shiraiwa

IPC分类号： B25J15/10 ,  B25J19/00 ,  B65G47/90 ,  B65G49/07 ,  H01L21/677

CPC分类号： H01L21/67781 ,  Y10S414/138 ,  Y10S414/141

摘要： The present invention relates to an apparatus for transferring a plurality of semiconductor wafers from their cassettes to a boat. This apparatus comprises a support body on which the cassettes and the boat are mounted, a lifter for lifting wafers from the cassettes, a handling device for carrying the wafers and transferring them to the boat, and a plurality fans for introducing dust created by the handling device into the support body and removing it outside the support body.

摘要翻译： 本发明涉及一种用于将多个半导体晶片从其盒带转移到船上的装置。 该装置包括一个其上安装了盒和船的支撑体，一个用于从盒中提升晶片的提升器，一个用于承载晶片并将其转移到船上的处理装置，以及用于引入由处理产生的灰尘的多个风扇 装置进入支撑体并将其移出支撑体外部。

公开(公告)号：US5030057A

公开(公告)日：1991-07-09

申请号：US266651

申请日：1988-11-03

申请人： Hironobu Nishi ,  Kenichi Yamaga ,  Takanobu Asano ,  Kazutoshi Sawado ,  Masashi Fumoto ,  Shozo Ito ,  Yoshinori Mochizuki

发明人： Hironobu Nishi ,  Kenichi Yamaga ,  Takanobu Asano ,  Kazutoshi Sawado ,  Masashi Fumoto ,  Shozo Ito ,  Yoshinori Mochizuki

IPC分类号： H01L21/00 ,  H01L21/205 ,  H01L21/22 ,  H01L21/673 ,  H01L21/677

CPC分类号： H01L21/67313 ,  H01L21/67294 ,  H01L21/67326 ,  H01L21/67781 ,  Y10S414/136 ,  Y10S414/138 ,  Y10S414/14

摘要： A wafer transferring method for transferring wafers between a cassette and a boat having grooves to hold the wafers, comprises the steps of providing an identification mechanism for positional alignment on the boat in advance, detecting the identification mechanism, and aligning the boat to a predetermined position based on a detection result and transferring the wafers from the cassette to the boat. A wafer transferring apparatus comprises a loading device for extracting wafers from a cassette and transferring the wafers onto a boat, a detection device for detecting an identification section provided on the boat in order to identify a wafer transferring position on the boat, and a control device for acquiring the wafer transferring position on the boat based on a detection result attained from the detection device and controlling a mutual position between the boat and the cassette to come to a predetermined position.

摘要翻译： 一种晶片转印方法，用于在具有用于保持晶片的槽的盒和舟皿之间转移晶片，包括以下步骤：提供用于在船上进行位置对准的识别机构，检测识别机构，以及将船对准到预定位置 基于检测结果并将晶片从盒转移到船。 晶片转印装置包括用于从盒中提取晶片并将晶片转移到船上的装载装置，用于检测设置在船上的识别部分以识别船上的晶片转移位置的检测装置，以及控制装置 用于基于从检测装置获得的检测结果获取船上的晶片转移位置，并控制船和盒之间的相互位置到达预定位置。

公开(公告)号：US5007788A

公开(公告)日：1991-04-16

申请号：US342345

申请日：1989-04-24

申请人： Takanobu Asano ,  Kenichi Yamaga ,  Wataru Ohkase

发明人： Takanobu Asano ,  Kenichi Yamaga ,  Wataru Ohkase

IPC分类号： H01L21/677

CPC分类号： H01L21/67781

摘要： A pitch changing device of the present invention includes a lift mechanism for unloading a plurality of wafers arranged in a cassette at predetermined pitches from the cassette while the pitches are kept unchanged, and a chuck mechanism for holding the unloaded wafers while the pitches are kept unchanged. The chuck mechanism includes moving pieces mounted to be movable in an arrangement direction of the wafers, for respectively supporting the wafers, elastic members mounted in the movable pieces to be expandible/contractible in the arrangement direction of the wafers, and a driving mechanism for expanding/contracting the elastic members. When the elastic members expand/contract by the driving mechanism, the pitches of the wafers are changed while the wafers are held. The lift mechanism includes a handler for variably moving wafer stands in the arrangement direction of the wafers, and changes the pitches while the wafers are lifted.

摘要翻译： 本发明的变桨装置包括一个提升机构，用于在间距保持不变的情况下以预定间距从盒子中卸载设置在盒中的多个晶片;以及夹持机构，用于保持未加载的晶片，同时间距保持不变 。 卡盘机构包括安装成能够在晶片的布置方向上移动的移动件，用于分别支撑晶片，安装在可移动片中的弹性构件可在晶片的排列方向上可扩展/收缩;以及驱动机构，用于扩展 /收缩弹性构件。 当弹性构件通过驱动机构膨胀/收缩时，在保持晶片的同时改变晶片的间距。 升降机构包括用于在晶片的排列方向上可变地移动晶片架的处理器，并且在晶片被提升时改变间距。

公开(公告)号：US4989540A

公开(公告)日：1991-02-05

申请号：US392597

申请日：1989-08-11

申请人： Noboru Fuse ,  Hirofumi Kitayama

发明人： Noboru Fuse ,  Hirofumi Kitayama

IPC分类号： C23C16/44 ,  C23C16/455 ,  H01J37/32 ,  H01L21/205 ,  H01L21/22 ,  H01L21/302 ,  H01L21/304 ,  H01L21/3065 ,  H01L21/31

CPC分类号： C23C16/455 ,  C23C16/4405 ,  C23C16/4412 ,  C23C16/45578 ,  C23C16/4558 ,  H01J37/3244 ,  Y10S156/912 ,  Y10S156/916 ,  Y10S438/935

摘要： A treatment apparatus used in manufacturing processes for semiconductor devices and the like, in which substrates are treated by means of a reaction gas. An inner tube, which is coaxially disposed in a reaction tube, defines a reaction region surrounding the substrates to be treated. The inner tube has a number of perforations in its wall, by means of which the inside and outside of the reaction region communicate with each other. During reaction treatment, the reaction gas is supplied to the reaction region, while a cleaning gas is supplied to the region outside the reaction region. Both these gases are discharged through a common exhaust pipe. The flows of the reaction gas and the cleaning gas are controlled so that the pressure inside the reaction region is higher than the pressure outside the region. As the cleaning gas is supplied, production and adhesion of reaction compound particles on the inner surface of the reaction tube is prevented.

摘要翻译： 在半导体器件等的制造工艺中使用的处理装置，其中基板通过反应气体进行处理。 同轴地设置在反应管中的内管限定围绕待处理基板的反应区域。 内管在其壁上具有多个穿孔，通过该穿孔，反应区域的内部和外部彼此连通。 在反应处理期间，将反应气体供给到反应区域，同时向反应区域外的区域供给清洁气体。 这两种气体都通过一个普通的排气管排出。 控制反应气体和清洁气体的流动，使得反应区域内的压力高于区域外的压力。 当提供清洁气体时，防止反应混合物颗粒在反应管的内表面上的生成和粘附。

公开(公告)号：US4955649A

公开(公告)日：1990-09-11

申请号：US312603

申请日：1989-02-21

申请人： Katsumi Ishii ,  Yasushi Sasaki

发明人： Katsumi Ishii ,  Yasushi Sasaki

IPC分类号： B25B9/00 ,  B25B11/00 ,  H01L21/687

CPC分类号： B25B11/00 ,  B25B9/00 ,  H01L21/68707

摘要： The apparatus comprises a first holding member having a flat surface which is brought into contact with the nonprocess surface of the semiconductor wafer, a pair of second holding members having inclined surfaces which are spaced apart from said flat surface by a predetermined distance, and cooperate with the flat surface to receive the arcuated edge of the semiconductor wafer. The second holding members are spaced apart from each other in a direction perpendicular to a semiconductor wafer insertion direction. The inclined surfaces being inclined such that a distance between the inclined surfaces and the flat surface is decreased in the semiconductor wafer insertion direction, thereby clamping the arcuated edge portions of the semiconductor wafer.

摘要翻译： 该装置包括具有与半导体晶片的非过程表面接触的平坦表面的第一保持构件，具有与所述平坦表面间隔开预定距离的倾斜表面的一对第二保持构件，并与 平坦表面以接收半导体晶片的弧形边缘。 第二保持构件在垂直于半导体晶片插入方向的方向上彼此间隔开。 倾斜面倾斜使得倾斜表面和平坦表面之间的距离在半导体晶片插入方向上减小，从而夹紧半导体晶片的圆弧形边缘部分。

公开(公告)号：US4954721A

公开(公告)日：1990-09-04

申请号：US330214

申请日：1989-03-29

申请人： Fujio Suzuki

发明人： Fujio Suzuki

IPC分类号： H01L21/68

CPC分类号： H01L21/68 ,  Y10S414/138 ,  Y10S414/14

摘要： An apparatus for detecting an array of wafers comprises a reference information generator for generating reference information from the reference condition in which wafers are partly inserted correctly in all grooves formed in side plates of a first wafer carrier, a window setting device for setting wafer-detecting windows at those positions where the wafers are arranged on a second wafer carrier, in accordance with the reference information supplied from said reference information generator, a photosensor for detecting the wafers arranged on the second wafer carrier and generating information representing the presence of the wafers on the second wafer carrier, a signal generator for generating signals from the information generated by the photosensor, and a position detector for collating the signals supplied from the signal generator with said wafer detecting windows, to detect the shape of that portion of any signal that corresponds to a wafer window, and to determine the position of the wafer from the shape of said portion of the signal.

摘要翻译： 一种用于检测晶片阵列的装置，包括：参考信息发生器，用于从参考条件产生参考信息，其中晶片部分地插入到形成在第一晶片载体的侧板中的所有凹槽中，用于设置晶片检测的窗口设置装置 根据从所述参考信息发生器提供的参考信息，将晶片布置在第二晶片载体上的那些位置处的窗口，用于检测布置在第二晶片载体上的晶片的光电传感器，并且产生表示存在晶片的信息 第二晶片载体，用于从由光电传感器产生的信息产生信号的信号发生器，以及用于将从信号发生器提供的信号与所述晶片检测窗口进行对照的位置检测器，以检测对应于任何信号的那部分的形状 到晶圆窗口，并确定位置o f是晶片从信号的所述部分的形状。

公开(公告)号：US4950870A

公开(公告)日：1990-08-21

申请号：US273972

申请日：1988-11-21

申请人： Hiroyuki Mitsuhashi ,  Seishiro Sato ,  Wataru Ohkase

发明人： Hiroyuki Mitsuhashi ,  Seishiro Sato ,  Wataru Ohkase

IPC分类号： C30B25/10 ,  C30B31/12 ,  F27B17/00 ,  F27D11/02 ,  G05D23/22

CPC分类号： F27B17/0025 ,  C30B25/10 ,  C30B31/12 ,  F27D11/02 ,  G05D23/1934 ,  G05D23/22

摘要： A heat-treating apparatus includes a process tube accommodating an object to be heat-treated therein, and a plurality of independent heaters including at least three heaters arranged at both end portions and the central portion of a side wall of the process tube, so as to surround the process tube and, the heating temperatures of the individual heaters being freely adjustable. In this heat-treating apparatus, no direct heat transfer is caused between the heaters, so that the heating temperature of the heater at each end portion of the process tube can be adjusted to a high value, without entailing such an uneven temperature distribution as is caused in the case of a conventional heat-treating apparatus. Thus, uniform temperature distribution can be attained in an area covering the same range for the conventional apparatus, even though the heaters at both end portions are reduced in length.

摘要翻译： 热处理装置包括容纳待热处理物体的处理管和多个独立的加热器，其包括布置在处理管的侧壁的两个端部和中心部分处的至少三个加热器，以便 围绕加工管，并且各个加热器的加热温度可自由调节。 在该热处理装置中，不会在加热器之间产生直接的热传递，所以能够将处理管的各端部的加热器的加热温度调整为高值，而不会产生不均匀的温度分布 在常规热处理装置的情况下引起。 因此，即使两端部的加热器的长度减小，也能够在覆盖同一范围的区域中实现均匀的温度分布。

公开(公告)号：US4947784A

公开(公告)日：1990-08-14

申请号：US281026

申请日：1988-12-07

申请人： Hironobu Nishi

发明人： Hironobu Nishi

IPC分类号： H01L21/00 ,  B65G49/07 ,  H01L21/677

CPC分类号： H01L21/67781

摘要： An apparatus for transferring wafers comprises a turntable for orienting a plurality of wafers which are loaded in a cassette, a lifting mechanism for lifting the wafers away from the cassette, a plurality of opening/closing chuck mechanisms, and a slide movement mechanism for conveying the wafers which are held by the opening/closing mechanism onto a boat. The cassette on the turntable is turned selectively through an angle of 180.degree. and wafers are lifted by the link mechanism all at a time and selectively held by the opening/closing chuck mechanism. The wafers thus held are conveyed to a location of a boat where they are loaded onto the boat in a face-to-face relation.

摘要翻译： 用于转移晶片的设备包括用于定向装载在盒中的多个晶片的转台，用于将晶片远离盒子的提升机构，多个打开/关闭卡盘机构，以及用于传送 由开/关机构保持在船上的晶片。 转台上的磁带盒选择性地转动180°的角度，并且晶片被连杆机构一次提升并且被打开/关闭卡盘机构选择性地保持。 将如此保持的晶片传送到船的位置，在那里它们以面对面的关系装载到船上。