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    Composite cooling system and data center
    2.
    发明授权
    Composite cooling system and data center 有权

    公开(公告)号：US12127367B2

    公开(公告)日：2024-10-22

    申请号：US17821649

    申请日：2022-08-23

    Applicant: Huawei Digital Power Technologies Co., Ltd.

    Inventor： Jinliang Song ,  Wei Chen

    IPC: H05K7/20

    CPC classification number: H05K7/20145 ,  H05K7/20172 ,  H05K7/20209 ,  H05K7/20309 ,  H05K7/206 ,  H05K7/207

    Abstract: This application provides a composite cooling system. The composite cooling system includes an indoor air duct and an outdoor air duct that are independent of each other. The indoor air duct and the outdoor air duct intersect in a heat exchange area of the composite cooling system. A first-stage heat exchanger core, a second-stage heat exchanger core, and a first side air duct are disposed in the heat exchange area. The heat exchange area is constructed as a part of the outdoor air duct. The first-stage heat exchanger core, the first side air duct, and the second-stage heat exchanger core are sequentially arranged along a flow direction of the outdoor air duct. An inner cavity of the first-stage heat exchanger core and an inner cavity of the second-stage heat exchanger core each are further constructed as a part of the indoor air duct.

    High-capacity memory air cooling device
    3.
    发明授权
    High-capacity memory air cooling device 有权

    公开(公告)号：US12124302B2

    公开(公告)日：2024-10-22

    申请号：US17903770

    申请日：2022-09-06

    Applicant: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.

    Inventor： Jeffrey S Holland ,  Rachel Pollock ,  Bejoy J Kochuparambil

    IPC: G06F1/20 ,  H05K7/20

    CPC classification number: G06F1/20 ,  H05K7/20145 ,  H05K7/20154 ,  H05K7/20409 ,  H05K7/20509 ,  H05K7/20736 ,  G06F2200/201

    Abstract: A combination heat sink/air director apparatus includes conduction plates extending into gaps between dual in-line memory module (“DIMM”) installed in computing device. A plurality of thermal interface material (“TIM”) pads are coupled to each side of each of the plurality of conduction plates. A heat sink thermally is coupled to the conduction plates and mounted above the conduction plates. Air impedance of air flow through an interface includes air flow to the heat sink is selected to balance air flow between the interface and components adjacent to the interface. A chosen percentage of air flow passes through the interface for the balance of air flow. Each conduction plate and the TIM pads coupled to each side of the conduction plate are sized to contact and thermally couple to the DIMMs of the plurality of DIMMs on either side of the conduction plate and associated TIM pads.

    Charging Device and Charging System
    4.
    发明公开
    Charging Device and Charging System 审中-公开

    公开(公告)号：US20240348071A1

    公开(公告)日：2024-10-17

    申请号：US18754162

    申请日：2024-06-26

    Applicant: Greenworks (Jiangsu) Co., Ltd

    Inventor： Chuntao Lu ,  An Yan ,  Xiaohui Huo ,  Qiong Nie ,  Yanqiang Zhu

    IPC: H02J7/00 ,  H05K7/20

    CPC classification number: H02J7/0045 ,  H02J7/0013 ,  H02J7/00309 ,  H02J7/007194 ,  H05K7/20145 ,  H05K7/20209

    Abstract: A charging device includes a housing, a plurality of charging grooves, a handle, a first wheel and a supporting assembly. Wherein, the plurality of the charging grooves is arranged side by side inside the housing for accommodating an inserted battery pack. The handle is for a user to hold and is movably connected with the housing. The first wheel may be rotatably arranged at a bottom of the housing. The supporting assembly is arranged at the bottom of the housing. When the charging device is pulled, the handle is held, and the charging device is inclined and slides relative to a ground by the first wheel. When the charging device is placed horizontally, the first wheel and the supporting assembly are in contact with the ground.

    Air duct with one or more fins
    6.
    发明授权
    Air duct with one or more fins 有权

    公开(公告)号：US12120842B2

    公开(公告)日：2024-10-15

    申请号：US17829869

    申请日：2022-06-01

    Applicant: Quanta Computer Inc.

    Inventor： Chao-Jung Chen ,  Herman Tan ,  Tien-Juei Chuang ,  Chieh-Ling Chang

    IPC: H05K7/20

    CPC classification number: H05K7/20145 ,  H05K7/20209

    Abstract: An air duct is disclosed. The air duct includes a housing for directing air over a plurality of slots within a computer system. The housing includes side housing walls and a top housing wall. The side housing walls are respectively connected to opposing ends of the top housing wall. The side housing walls extend in the same direction from the top housing wall. The air duct further includes a plurality of fins extending from the top housing wall in the same direction as the side housing walls. Each fin of the plurality of fins is arranged on the top housing wall so as to be positioned between adjacent slots of the plurality of slots when the housing is located within the computer system.

    Modular card cage accessories
    7.
    发明授权
    Modular card cage accessories 有权

    公开(公告)号：US12114462B2

    公开(公告)日：2024-10-08

    申请号：US17820112

    申请日：2022-08-16

    Applicant: NATIONAL INSTRUMENTS CORPORATION

    Inventor： Richard G. Baldwin, Jr. ,  Michael H. Singerman

    IPC: H05K1/14 ,  H05K5/02 ,  H05K7/20

    CPC classification number: H05K7/20145 ,  H05K1/141 ,  H05K5/026

    Abstract: Various types of electronic devices may be mounted in a chassis in order to facilitate interfacing with the devices, containing the devices, provide cooling systems which may remove heat from the electronic devices, etc. Delivering adequate cooling air flow to each electronic device in a chassis may be an important issue for the proper functioning, lifetime, or other characteristics of electronic devices contained in a chassis. Some electronic devices may be particularly challenging to cool due to various design characteristics. Other electronic devices may have other requirements that are not well served by existing chassis designs. For example, some electronic devices may benefit from additional electrical and/or thermal connections. Embodiments presented herein describe a novel design for a modular card cage accessory that may be configured to modify air flow and/or to meet particular requirements of an electronic device in a chassis, among various possibilities.

    Shield For Fan-Cooled Units
    8.
    发明公开
    Shield For Fan-Cooled Units 审中-公开

    公开(公告)号：US20240329702A1

    公开(公告)日：2024-10-03

    申请号：US18616360

    申请日：2024-03-26

    Applicant: Aptiv Technologies AG

    Inventor： Lukasz Barus ,  Bartlomiej Cisak ,  Jakub Korta

    IPC: G06F1/20 ,  H05K5/02 ,  H05K7/20

    CPC classification number: G06F1/20 ,  H05K5/0213 ,  H05K7/20145

    Abstract: A shield for a vent or cooling-fan opening in a housing for electronic components. The shield includes an outwardly projectable wall for substantially covering the vent or cooling-fan opening and, at edges of the wall, interfacing with the housing. The shield includes an opening for communicating with a vent or cooling-fan unit to divert airflow to or from the vent or fan-cooled opening while ingress of fluid is mitigated by the outwardly projectable wall.

    Airflow guide with integrated power conduction
    9.
    发明授权
    Airflow guide with integrated power conduction 有权

    公开(公告)号：US12105568B2

    公开(公告)日：2024-10-01

    申请号：US17726877

    申请日：2022-04-22

    Applicant: Dell Products L.P.

    Inventor： Xin Zhi Ma ,  Shi Bing Tai

    IPC: G06F1/20 ,  H05K5/02 ,  H05K7/20

    CPC classification number: G06F1/203 ,  H05K5/0247 ,  H05K7/20145

    Abstract: An information handling system may include a heat-generating information handling resource, an air mover, a power supply unit, and an airflow guide. The airflow guide may include one or more features configured to, either alone or in combination with portions of a chassis of the information handling system, form an air plenum fluidically coupled between the air mover and the heat-generating information handling resource and electrical conduits integrated within the airflow guide configured to deliver electrical current from the power supply unit to the heat-generating information handling resource.

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