Circuit and operating method for integrated interface of PDA and wireless communication system
    91.
    发明授权
    Circuit and operating method for integrated interface of PDA and wireless communication system 有权
    PDA和无线通信系统集成接口的电路和操作方法

    公开(公告)号:US07278032B2

    公开(公告)日:2007-10-02

    申请号:US10249403

    申请日:2003-04-07

    Abstract: A circuit and operating method for an integrated interface of a PDA and a wireless communication system are disclosed. The circuit includes a PDA-turn-on-wireless-communication-system signal line, a PDA-reset-wireless-communication-system signal line, a PDA-state signal line, a wireless-communication-system-state/wake-up-PDA signal line and two serial ports, wherein the serial ports are electrically connected between the PDA and the wireless communication system, and one of the two ports is used to transmit control signal and status data, another one of the two ports is used to transmit digital data signals. Moreover, the PDA-turn-on-wireless-communication-system signal line and the PDA-reset-wireless-communication-system signal line makes the PDA able to turn on and reset the wireless communication system, respectively. The PDA-state signal line and the wireless-communication-system-state/wake-up-PDA signal line transmit the status of the PDA and wireless communication system to each other.

    Abstract translation: 公开了一种用于PDA和无线通信系统的集成接口的电路和操作方法。 该电路包括PDA开启无线通信系统信号线,PDA复位无线通信系统信号线,PDA状态信号线,无线通信系统状态/唤醒 -PDA信号线和两个串行端口,其中串行端口电连接在PDA和无线通信系统之间,并且两个端口中的一个用于发送控制信号和状态数据,两个端口中的另一个用于 发送数字数据信号。 此外,PDA开启无线通信系统信号线和PDA复位无线通信系统信号线使得PDA能够分别打开和重置无线通信系统。 PDA状态信号线和无线通信系统状态/唤醒PDA信号线将PDA和无线通信系统的状态彼此发送。

    Detection circuit
    92.
    发明授权
    Detection circuit 有权
    检测电路

    公开(公告)号:US07248707B2

    公开(公告)日:2007-07-24

    申请号:US10629863

    申请日:2003-07-30

    CPC classification number: H01R24/58 H01R2105/00 H04R5/04

    Abstract: A plug detection circuit. The detected circuit is disposed in an electronics device with an earphone jack, accepting plugs with a plurality of conductive rings. The detection circuit has a plurality of pins, wherein a first pin detects, and outputs a first logic potential, and a second pin detects the potentials at the conductive rings and outputs a second logic potential. The detection circuit determines the type of earphone connected to the earphone jack.

    Abstract translation: 插头检测电路。 检测电路设置在具有耳机插孔的电子设备中,接收具有多个导电环的插头。 检测电路具有多个引脚,其中第一引脚检测并输出第一逻辑电位,第二引脚检测导电环上的电位并输出第二逻辑电位。 检测电路确定连接到耳机插孔的耳机的类型。

    Connecting mechanism and electronic device
    93.
    发明申请
    Connecting mechanism and electronic device 有权
    连接机构和电子设备

    公开(公告)号:US20070155446A1

    公开(公告)日:2007-07-05

    申请号:US11600881

    申请日:2006-11-17

    CPC classification number: G06F1/1632

    Abstract: An electronic device includes a body, an input device and a connecting mechanism. The connecting mechanism includes a first connector and a second connector installed on the body and the input device, respectively. The connectors are connected via a magnetic interaction. When the electronic device approaches the input device, the electronic device is fixed on the input device by the magnetic interaction.

    Abstract translation: 电子设备包括主体,输入设备和连接机构。 连接机构包括分别安装在主体和输入装置上的第一连接器和第二连接器。 连接器通过磁相互作用连接。 当电子设备接近输入设备时,电子设备通过磁相互作用固定在输入设备上。

    Printed Circuit Board and Manufacturing Method Thereof
    94.
    发明申请
    Printed Circuit Board and Manufacturing Method Thereof 审中-公开
    印刷电路板及其制造方法

    公开(公告)号:US20070133184A1

    公开(公告)日:2007-06-14

    申请号:US11564955

    申请日:2006-11-30

    Applicant: Chin-Wei Ho

    Inventor: Chin-Wei Ho

    Abstract: A printed circuit board and manufacturing method thereof is disclosed. First, a conductive layer disposed on an insulation layer is provided. The conductive layer is patterned to form at least a conductive layer opening and the insulation layer is drilled throughout to form a via at a position corresponding to the conductive layer opening. The via is then loaded with a conductive material. A plurality of substrates are formed through the steps above and are bonded to form a multi-layer printed circuit board.

    Abstract translation: 公开了一种印刷电路板及其制造方法。 首先,设置在绝缘层上的导电层。 导电层被图案化以形成至少导电层开口,并且绝缘层被贯穿整个以在对应于导电层开口的位置处形成通孔。 然后通孔用导电材料加载。 通过上述步骤形成多个基板,并结合以形成多层印刷电路板。

    Alignment Structure of Printed Circuit Board Substrate and Method Thereof
    95.
    发明申请
    Alignment Structure of Printed Circuit Board Substrate and Method Thereof 有权
    印刷电路板基板的对准结构及其方法

    公开(公告)号:US20070128928A1

    公开(公告)日:2007-06-07

    申请号:US11564966

    申请日:2006-11-30

    Applicant: Chin-Wei HO

    Inventor: Chin-Wei HO

    Abstract: An alignment structure of individual printed circuit board and method thereof are disclosed. The alignment structure of individual printed circuit board includes a panel body and an assembling part. An aligned part having a geometric feature is disposed on an inner side of the panel body. The assembling part coupled with an individual printed circuit board is similar to the geometric feature of the aligned part so that the individual printed circuit board is combined with the panel body.

    Abstract translation: 公开了各个印刷电路板的对准结构及其方法。 单个印刷电路板的对准结构包括面板本体和组装部件。 具有几何特征的对准部分设置在面板主体的内侧。 与单独的印刷电路板耦合的组装部分类似于对准部分的几何特征,使得单独的印刷电路板与面板主体组合。

    Method for arbitrating audio data output apparatuses
    96.
    发明申请
    Method for arbitrating audio data output apparatuses 审中-公开
    用于仲裁音频数据输出设备的方法

    公开(公告)号:US20070067169A1

    公开(公告)日:2007-03-22

    申请号:US11523167

    申请日:2006-09-19

    Applicant: John Wang

    Inventor: John Wang

    CPC classification number: G11B27/105

    Abstract: A method for arbitrating audio output apparatuses used in a portable electronic device has audio output apparatuses comprising a speaker and a receiver is provided. When an application program executed in the electronic device generates audio data, the method initially determines the application program type. Then, either the speaker or the receiver is selected to output the audio data according to the type of application program.

    Abstract translation: 用于仲裁在便携式电子设备中使用的音频输出设备的方法具有包括扬声器和接收器的音频输出设备。 当在电子设备中执行的应用程序生成音频数据时,该方法最初确定应用程序类型。 然后,选择扬声器或接收器,以根据应用程序的类型输出音频数据。

    Chip recorder
    97.
    发明申请
    Chip recorder 有权
    芯片录音机

    公开(公告)号:US20070020983A1

    公开(公告)日:2007-01-25

    申请号:US11491061

    申请日:2006-07-24

    CPC classification number: G01R1/0466

    Abstract: A chip recorder is disposed on a circuit board for writing a chip, wherein the chip comprises a contact and the circuit board comprises a contact. The chip recorder comprises a chip housing, a base, a bracket, a push finger and an elastic member. The chip housing is detachably secured on the circuit board for accommodating the chip. The base is detachably mounted to the chip housing and disposed between the chip housing and the circuit board wherein the base comprises at least one probe and a first end of the probe is electrically connected to the contact of the circuit board. The bracket is moveably connected to the chip housing and the push finger is pivotally connected to the bracket and moveably connected to the chip housing. The elastic member is disposed between the bracket and the chip housing to provide a resilient force against the bracket and the chip housing, wherein the resilient force allows the bracket and the push finger to move relative to the chip housing, and allows the push finger to abut against the chip to electrically connect a second end of the probe and the contact of the chip, and when the bracket is pressed toward the chip hosing, the push finger is moved to release the chip from the chip housing.

    Abstract translation: 芯片记录器设置在用于写入芯片的电路板上,其中芯片包括触点,并且电路板包括触点。 芯片记录器包括芯片壳体,基座,支架,推指和弹性构件。 芯片壳体可拆卸地固定在电路板上以容纳芯片。 基座可拆卸地安装在芯片壳体上并且设置在芯片壳体和电路板之间,其中底座包括至少一个探针,并且探头的第一端电连接到电路板的触点。 支架可移动地连接到芯片壳体,并且推动手指可枢转地连接到支架并且可移动地连接到芯片壳体。 弹性构件设置在支架和芯片壳体之间以提供抵靠托架和芯片壳体的弹性力,其中弹性力允许支架和推指相对于芯片壳体移动,并且允许推动手指 抵靠芯片以电连接探针的第二端和芯片的接触,并且当支架被挤压到芯片上时,推动手指被移动以从芯片壳体释放芯片。

    Booting method capable of executing a warm boot or a cold boot when a CPU crash occurs and computer system therefor
    98.
    发明授权
    Booting method capable of executing a warm boot or a cold boot when a CPU crash occurs and computer system therefor 有权
    引导方法能够在发生CPU崩溃时执行热启动或冷引导,并且其计算机系统

    公开(公告)号:US07159107B2

    公开(公告)日:2007-01-02

    申请号:US10771904

    申请日:2004-02-04

    CPC classification number: G06F11/0793 G06F9/4403 G06F9/4418 G06F11/1417

    Abstract: A booting method capable of executing a warm boot or a cold boot when a CPU crash occurs in a computer system having a CPU and a memory. First, when the CPU is in a crash state, it is detected that a user wants to execute a hardware reset function or a software reset function. Next, a hardware reset operation is executed to reboot the CPU. Then, when the user chooses to execute the hardware reset function, data and predefined values of the memory are deleted to make the computer system return to a default state. Thereafter, when the user chooses to execute the software reset function, the hardware reset operation is regarded as an operation to replace a software reset operation, and the computer system holds the data and predefined values to make the computer system return to a setting state before the computer system is crashed.

    Abstract translation: 在具有CPU和存储器的计算机系统中发生CPU崩溃时,能够执行热启动或冷启动的引导方法。 首先,当CPU处于崩溃状态时,检测到用户想要执行硬件复位功能或软件复位功能。 接下来,执行硬件复位操作以重新启动CPU。 然后,当用户选择执行硬件复位功能时,删除存储器的数据和预定义值,使计算机系统恢复到默认状态。 此后,当用户选择执行软件复位功能时,硬件复位操作被认为是替换软件复位操作的操作,并且计算机系统保存数据和预定义的值以使计算机系统恢复到设置状态 计算机系统崩溃。

    Portable electronic apparatus
    99.
    发明申请

    公开(公告)号:US20060274506A1

    公开(公告)日:2006-12-07

    申请号:US11414297

    申请日:2006-05-01

    CPC classification number: H05K7/20445 H04B1/036 H04M1/0214 H04M1/0235

    Abstract: A portable electronic apparatus comprises a housing, a circuit board, a heat-conduction structure and a heat-dissipation structure. The circuit board is disposed in the housing and comprises a substrate and a first electronic device, wherein the first electronic device is disposed on the substrate. The heat-conduction structure is disposed on the circuit board, and dissipates heat from the first electronic device. The heat-dissipation structure is disposed on the housing and connected to the heat-conduction structure, wherein the heat passes the heat-conduction structure and the heat-dissipation structure, and is dissipated out of the housing.

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