公开(公告)号：US11690232B2

公开(公告)日：2023-06-27

申请号：US16885346

申请日：2020-05-28

申请人： Taiwan Semiconductor Manufacturing Company Limited

发明人： Te-Hsien Hsieh ,  Yuan-Tai Tseng

IPC分类号： H01L45/00 ,  H10B63/00 ,  H10N70/20 ,  H10N70/00

CPC分类号： H10B63/84 ,  H10B63/24 ,  H10N70/063 ,  H10N70/24 ,  H10N70/826 ,  H10N70/841 ,  H10N70/8833 ,  H10N70/8836

摘要： A memory device including a first array of rail structures that extend along a first horizontal direction, in which each of the rail structures are formed to serve as a bottom electrode, and a second array of rail structures that laterally extend along a second horizontal direction and are laterally spaced apart along the first horizontal direction. Each of the rail structures in the second array are formed to server as a top electrode. The memory device also includes a continuous dielectric memory layer located between the first array of rail structures and the second array of rail structures. The continuous dielectric memory layer providing protection from current leakage between the rail structures of the first array and the rail structures of the second array.

公开(公告)号：US11686155B2

公开(公告)日：2023-06-27

申请号：US16822257

申请日：2020-03-18

申请人： Keystone Tower Systems, Inc.

发明人： Eric D. Smith ,  Loren Daniel Bridgers

IPC分类号： E06C9/02 ,  F03D13/20 ,  E04H12/08 ,  F03D80/50 ,  F03D80/80

CPC分类号： E06C9/02 ,  F03D13/20 ,  E04H12/08 ,  F03D80/50 ,  F03D80/88 ,  F05B2260/30

摘要： Devices, systems, and methods are directed to mounting an auxiliary component to a tower based at least in part on a force distribution in which a normal force is greater than a shear force exerted by the auxiliary component on a shell of the tower such that the auxiliary component may be held in place relative to the tower without penetrating the shell of the tower. Thus, as compared to mounting techniques requiring penetration of the shell of the tower, this force distribution along the shell of the tower may facilitate mounting the auxiliary component to the tower with little to no impact on cost and/or structural requirements of the tower. Further, or instead, as compared to other mounting techniques, mounting the auxiliary component based at least in part on this force distribution may reduce or eliminate the need for specialized tools, thus facilitating in-field installation of the auxiliary component.

公开(公告)号：US11682730B2

公开(公告)日：2023-06-20

申请号：US16910125

申请日：2020-06-24

申请人： Taiwan Semiconductor Manufacturing Company Limited

发明人： Li-Zhen Yu ,  Chia-Hao Chang ,  Lin-Yu Huang ,  Cheng-Chi Chuang ,  Chih-Hao Wang

IPC分类号： H01L29/78 ,  H01L29/417 ,  H01L29/423 ,  H01L29/66 ,  H01L23/522 ,  H01L23/528 ,  H01L29/49

CPC分类号： H01L29/785 ,  H01L23/528 ,  H01L23/5226 ,  H01L29/41791 ,  H01L29/42372 ,  H01L29/4975 ,  H01L29/66795 ,  H01L2029/7858

摘要： A semiconductor nanostructure and an epitaxial semiconductor material portion are formed on a front surface of a substrate, and a planarization dielectric layer is formed thereabove. Recess cavities are formed to expose a first active region and the epitaxial semiconductor material portion. A metallic cap structure is formed on the first active region, and a sacrificial metallic material portion is formed on the epitaxial semiconductor material portion. A connector via cavity is formed by anisotropically etching the sacrificial metallic material portion and an underlying portion of the epitaxial semiconductor material portion while the metallic cap structure is masked with a hard mask layer. A connector via structure is formed in the connector via cavity. Front-side metal interconnect structures are formed on the connector via structure and the metallic cap structure, and a backside via structure is formed through the substrate on the connector via structure.

公开(公告)号：US11676954B2

公开(公告)日：2023-06-13

申请号：US17134997

申请日：2020-12-28

申请人： SANDISK TECHNOLOGIES LLC

发明人： Peter Rabkin ,  Masaaki Higashitani ,  Kwang-ho Kim

IPC分类号： H01L25/065 ,  H01L23/528 ,  H01L25/18 ,  H01L23/00 ,  H01L25/00 ,  H10B41/27 ,  H10B43/27

CPC分类号： H01L25/18 ,  H01L23/5286 ,  H01L24/08 ,  H01L24/80 ,  H01L25/0657 ,  H01L25/50 ,  H10B41/27 ,  H10B43/27 ,  H01L2224/08145 ,  H01L2224/80006 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2924/1431 ,  H01L2924/14511

摘要： A semiconductor structure includes a memory die bonded to a logic die. The memory die includes an alternating stack of insulating layers and electrically conductive layers; memory openings extending through the alternating stack, memory opening fill structures located in the memory openings and comprising a respective vertical semiconductor channel and a respective memory film, a source layer contacting the vertical semiconductor channels, a backside isolation dielectric layer contacting a backside surface of the source layer, and a source power supply mesh including a planar portion of a source-side electrically conductive layer that is located on a backside of the backside isolation dielectric layer and electrically connected to the source layer by conductive material portions that extend through the backside isolation dielectric layer.

公开(公告)号：US11672747B2

公开(公告)日：2023-06-13

申请号：US17415665

申请日：2019-12-17

申请人： L'OREAL

发明人： Stéphane Sabelle ,  Olivier Guerard

IPC分类号： A61Q5/10 ,  A61K8/41 ,  A61K8/35 ,  A61K8/46 ,  A61Q5/06

CPC分类号： A61K8/416 ,  A61K8/35 ,  A61K8/355 ,  A61K8/466 ,  A61Q5/065 ,  A61K2800/4322

摘要： The present invention relates to a cosmetic process for treating keratin materials, in particular keratin fibers, preferably human keratin fibers such as the hair, using a) one or more direct dyes which are preferably neutral and b) one or more particular aliphatic ammonium salts, and to a composition comprising ingredients a) and b). The cosmetic process for treating keratin materials of the invention makes it possible to obtain a good color build-up up and, furthermore, the colors are vivid and chromatic.

公开(公告)号：US11664521B2

公开(公告)日：2023-05-30

申请号：US17174923

申请日：2021-02-12

申请人： BLOOM ENERGY CORPORATION

发明人： Tad Armstrong ,  Harald Herchen ,  David Weingaertner ,  Rajan Surve ,  Matthias Gottmann ,  Prasad Pmsvvsv ,  Ranganathan Gurunathan ,  Arne Ballantine ,  Michael Gasda ,  Tyler Dawson ,  Chockkalingam Karuppaiah

IPC分类号： H01M8/04 ,  H01M8/249 ,  H01M8/2483 ,  H01M8/0267 ,  H01M8/04858

CPC分类号： H01M8/249 ,  H01M8/0267 ,  H01M8/0488 ,  H01M8/0491 ,  H01M8/2483

摘要： A fuel cell system column includes a first terminal plate connected to a first electrical output of the column, a second terminal plate connected to a second electrical output of the column, at least one first fuel cell stack located in a middle portion of the column between the first terminal plate and the second terminal plate, and at least one electrical connection which is electrically connected to the middle portion of the column and which is configured to provide a more uniform fuel utilization across the first column.

公开(公告)号：US11658320B2

公开(公告)日：2023-05-23

申请号：US17520302

申请日：2021-11-05

申请人： BLOOM ENERGY CORPORATION

发明人： David Weingaertner ,  Ivan Hartana ,  David Edmonston ,  Michael Petrucha ,  Martin Perry

IPC分类号： H01M8/04 ,  H01M8/04828 ,  H01M8/04014 ,  H01M8/0662 ,  H01M8/04089 ,  H01M8/04701

CPC分类号： H01M8/04843 ,  H01M8/04014 ,  H01M8/04097 ,  H01M8/04708 ,  H01M8/0662

摘要： A method of operating a fuel cell system includes providing an anode exhaust from a fuel cell stack to a water injector, supplying water to the water injector, and injecting the water from the water injector into the anode exhaust to vaporize the water and generate a humidified anode exhaust.

公开(公告)号：US11652785B1

公开(公告)日：2023-05-16

申请号：US17246368

申请日：2021-04-30

申请人： Charter Communications Operating, LLC

发明人： Timothy C. Bleidorn ,  Erez Jordan Gottlieb

IPC分类号： G06F15/16 ,  H04L61/5007 ,  H04W84/12 ,  H04W88/02

CPC分类号： H04L61/2007 ,  H04W84/12 ,  H04W88/02

摘要： Systems and network devices configured to use Stateless Address Auto-Configuration (SLAAC) to provide different internet protocol (IP) address information to user equipment (UE) devices that are connected to the same local area network (LAN). A network device (e.g., default router, etc.) may determine whether a UE device is eligible to receive special treatment based on a link-layer address of the UE device. The network device send the UE device a solicited unicast router advertisement that includes a special prefix in response to determining that the UE device is eligible to receive special treatment based on the link-layer address. The network device may send the UE device a solicited unicast router advertisement that includes a base prefix in response to determining that the UE device is not eligible to receive special treatment based on the link-layer address.

公开(公告)号：US11650472B2

公开(公告)日：2023-05-16

申请号：US17176510

申请日：2021-02-16

申请人： HELIOTROPE TECHNOLOGIES, INC.

发明人： Xiaoliang Wang ,  Evelyn Davies ,  Pedro Gonzalez ,  Guillermo Garcia ,  Amir Bayati ,  John Bohland

IPC分类号： G02F1/155 ,  G02F1/161 ,  G02F1/153 ,  G02F1/1523 ,  G02F1/15

CPC分类号： G02F1/155 ,  G02F1/15 ,  G02F1/1525 ,  G02F1/1533 ,  G02F1/161 ,  G02F2001/1555 ,  G02F2001/164 ,  G02F2202/025

摘要： A method of forming an electrochromic (EC) device includes forming a solid-state first electrolyte layer, after forming the solid-state first electrolyte layer, laminating the first solid-state first electrolyte layer between a transparent first substrate and a transparent second substrate such that a transparent first electrode is disposed between the first substrate and a first side of the solid-state first electrolyte layer, and a transparent second electrode is disposed between the second substrate and a second side of the solid-state first electrolyte layer, and applying a sealant to seal the solid-state first electrolyte layer between the first and second substrates and to form the EC device.

公开(公告)号：US11647498B2

公开(公告)日：2023-05-09

申请号：US17342937

申请日：2021-06-09

申请人： QUALCOMM incorporated

发明人： Sharad Shahi ,  Madhup Chandra ,  Tom Chin

IPC分类号： H04W72/1268 ,  H04W72/0446 ,  H04W72/0453

CPC分类号： H04W72/1268 ,  H04W72/0446 ,  H04W72/0453

摘要： Various embodiments may provide systems and methods for managing transmit (TX) timing of data transmissions. The methods include applying a plurality of radio frequency (RF) channel factors related to data uplink transmissions by the wireless device to a TX timing model configured to provide as an output a TX timing for a data transmission to a base station and a number of carriers for sending the data transmission, and selecting a TX time and a number of carriers for sending a next data transmission to the base station based in part on the TX timing model output.