公开(公告)号：US20100053904A1

公开(公告)日：2010-03-04

申请号：US12202391

申请日：2008-09-01

Applicant: CHUN-CHI CHEN ,  HONG-CHENG YANG ,  JIN-BIAO LIU ,  HE-PING LIU

Inventor： CHUN-CHI CHEN ,  HONG-CHENG YANG ,  JIN-BIAO LIU ,  HE-PING LIU

IPC: H05K7/20 ,  H01R4/28

CPC classification number: H01L23/4093 ,  H01L23/3672 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A locking device is used for securing a heat sink to an electronic device mounted on a first face of a printed circuit board which defines a first hole. The heat sink defines a second hole therein. The locking device has a fastener including a head portion located aside the heat sink, a foot portion located aside a second face of the printed circuit board, and a body portion extending through the holes of the heat sink and the printed circuit board and interconnecting the head portion and the foot portion. The foot portion includes a buckling part abutting against the second face of the printed circuit board, and a positioning part extending toward the head portion to a position above the buckling part. When the buckling part abuts against the printed circuit board, the positioning part has a portion thereof entering into the first hole.

Abstract translation: 锁定装置用于将散热器固定到安装在限定第一孔的印刷电路板的第一面上的电子装置上。 散热器在其中限定了第二个孔。 锁定装置具有紧固件，该紧固件包括位于散热器的头部的部分，位于印刷电路板的第二面的脚部以及延伸穿过散热器和印刷电路板的孔的主体部分， 头部和脚部。 脚部包括抵靠印刷电路板的第二面的弯曲部，以及朝向头部延伸到屈曲部上方的位置的定位部。 当屈曲部分抵靠印刷电路板时，定位部分的一部分进入第一孔。

公开(公告)号：US07610038B2

公开(公告)日：2009-10-27

申请号：US10541447

申请日：2004-04-14

Applicant: Pek-Yew Tan ,  Hong Cheng ,  Chee Bing Tan

Inventor： Pek-Yew Tan ,  Hong Cheng ,  Chee Bing Tan

IPC: H04M1/68 ,  H04M3/16

CPC classification number: H04W8/26 ,  H04L12/4633 ,  H04L29/12311 ,  H04L61/2038 ,  H04L61/2084 ,  H04L63/0428 ,  H04W8/183 ,  H04W12/02 ,  H04W12/06 ,  H04W12/08 ,  H04W72/04 ,  H04W74/00 ,  H04W76/12 ,  H04W84/12

Abstract: The present invention provides a solution to the mobile terminal address management in the WLAN inter-working. By using the access control framework, the mobile terminal could obtain the address, and setup the tunnel together with the granting of service access. The management process would be shielded by the inherent encryption and protection of the access control process, and thus does not need extra security setup procedures to be performed. The invention also provides a method for the terminal to obtain address that binds to the session, using a fine grain service authorization procedure. The terminal could maintain multiple addresses when accessing multiple parallel sessions. The address management is also integrated with the policy control mechanisms. The policy control would provide means for the terminal and its home network to configure the WLAN when necessary after an address alternation. QoS, or tunnelling information would be modified and provisioned according to the new status using channels available in the existing policy control procedures. By this, a smooth address transition in the roaming time could be achieved, and QoS interruption could be minimized.

Abstract translation: 本发明提供了WLAN互通中移动终端地址管理的解决方案。 通过使用访问控制框架，移动终端可以获得地址，并设置隧道以及授予服务访问权限。 管理过程将被访问控制过程的固有加密和保护屏蔽，因此不需要执行额外的安全设置过程。 本发明还提供了一种使用细粒度服务授权过程来终端获取绑定到会话的地址的方法。 当访问多个并行会话时，终端可以维护多个地址。 地址管理也与政策控制机制相结合。 策略控制将为终端及其归属网络在地址交替之后必要时配置WLAN提供手段。 QoS或隧道信息将使用现有策略控制过程中可用的信道根据新状态进行修改和配置。 由此可以实现漫游时间的平滑地址转换，可以最大限度地减少QoS中断。

公开(公告)号：US20090159245A1

公开(公告)日：2009-06-25

申请号：US11961357

申请日：2007-12-20

Applicant: CHUN-CHI CHEN ,  HONG-CHENG YANG ,  HE-PING LIU

Inventor： CHUN-CHI CHEN ,  HONG-CHENG YANG ,  HE-PING LIU

IPC: H01L23/467 ,  F28F99/00

CPC classification number: H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat dissipation device includes a heat sink, a fan holder and a fan secured on a front side of the fan holder. The heat sink comprises a base and a plurality of fins on the base. An engaging groove is defined in top ends of the fins. The fan holder comprises a top panel and two sidewalls extending downwardly from two lateral edges of the top panel. The top panel has an inserting protrusion at a bottom surface thereof. The two sidewalls have two latching legs at lower ends thereof. The top panel is partially placed on front portion of the top ends of the fins and the inserting protrusion is inserted into the engaging groove of the fins, the two sidewalls abut against two lateral sides of the heat sink and the two latching legs fasten to two lateral sides of the base of the heat sink.

Abstract translation: 散热装置包括散热器，风扇支架和固定在风扇支架前侧的风扇。 散热器包括底座和底座上的多个翅片。 接合槽限定在翅片的顶端。 风扇架包括顶板和从顶板的两个侧边缘向下延伸的两个侧壁。 顶板在其底面具有插入突起。 两个侧壁在其下端具有两个闩锁腿。 顶板部分地放置在翅片顶端的前部，并且插入突起插入翅片的接合槽中，两个侧壁抵靠散热器的两个侧面，并且两个闩锁腿固定到两个 散热器底座的侧面。

公开(公告)号：US20080205350A1

公开(公告)日：2008-08-28

申请号：US11792798

申请日：2004-12-14

Applicant: Hong Cheng Michael Sim

Inventor： Hong Cheng Michael Sim

IPC: H04J3/00

CPC classification number: H04W48/12 ,  H04W8/005 ,  H04W48/08 ,  H04W74/02 ,  H04W84/18

Abstract: A multiple wireless networks structure comprising a plurality of beacon groups each comprising one or more devices communicating via an associated wireless network utilising a superframe structure; wherein each device of each beacon group allocates a local control period and one or more neighbor control periods in each superframe; wherein the neighbor control periods in each beacon group cover all one or more control periods of other beacon groups detected by one or more of the devices in said each beacon group to an extent as said control periods do not overlap with the local control period in said each beacon group.

Abstract translation: 多个无线网络结构，其包括多个信标组，每个信标组包括利用超帧结构经由相关联的无线网络进行通信的一个或多个设备; 其中每个信标组的每个设备在每个超帧中分配本地控制周期和一个或多个相邻控制周期; 其中每个信标组中的相邻控制周期覆盖在所述每个信标组中的一个或多个设备检测到的所有一个或多个控制周期的一个或多个控制周期，因为所述控制周期与所述控制周期中的所述本地控制周期不重叠 每个信标组。

公开(公告)号：USD573106S1

公开(公告)日：2008-07-15

申请号：US29257213

申请日：2006-03-31

Applicant: Hong-Cheng Shu ,  Chao-Ren Chen

Designer： Hong-Cheng Shu ,  Chao-Ren Chen

公开(公告)号：US07301769B2

公开(公告)日：2007-11-27

申请号：US11220732

申请日：2005-09-07

Applicant: Dong-Yun Li ,  Min Li ,  Hong-Cheng Yang ,  Hong-Bo Shi

Inventor： Dong-Yun Li ,  Min Li ,  Hong-Cheng Yang ,  Hong-Bo Shi

IPC: H05K7/20 ,  H01B7/42 ,  H01L23/34 ,  F28F7/00

CPC classification number: H01L23/467 ,  H01L23/4006 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A fan holder (1) includes a base (12) for supporting a fan (3) thereon and a pair of locking members (14) pivotally connected to the base. Each of the locking members includes a pivot shaft (142) and a handle (144) extending perpendicularly from the pivot shaft. The pivot shaft includes a pivot section (1422) and a pressing section (1426) offsetting from the pivot section and spaced from the base, wherein the handle is capable of rotating about an axis of the pivot shaft to lock with the base and to cause the pressing section to exert a force against the fan toward the base to securely attach the fan to the base.

Abstract translation: 风扇架（1）包括用于支撑风扇（3）的基座（12）和与基座枢转连接的一对锁定构件（14）。 每个锁定构件包括枢转轴（142）和从枢轴垂直延伸的手柄（144）。 枢转轴包括枢转部分（1422）和从枢转部分偏离并与基部间隔开的按压部分（1426），其中手柄能够围绕枢轴的轴线旋转以与基部锁定并且引起 所述按压部向所述基座施加力以将风扇牢固地附接到所述基座。

公开(公告)号：US20070254469A1

公开(公告)日：2007-11-01

申请号：US11617220

申请日：2006-12-28

Applicant: Pai-Chou Liu ,  Wen-Shin Lin ,  Sheng-Hong Cheng ,  Yu-Hsin Lee ,  Ming-Chia Hsieh ,  Kuan-Hung Yeh ,  Chia-Wei Chang ,  Tsung-Chi Chen

Inventor： Pai-Chou Liu ,  Wen-Shin Lin ,  Sheng-Hong Cheng ,  Yu-Hsin Lee ,  Ming-Chia Hsieh ,  Kuan-Hung Yeh ,  Chia-Wei Chang ,  Tsung-Chi Chen

IPC: H01L21/4763

CPC classification number: H05K3/3484 ,  H05K3/3442 ,  H05K2201/10636 ,  H05K2203/0545 ,  Y02P70/611 ,  Y02P70/613

Abstract: An improved surface mounting method applied in a semiconductor package process is provided, wherein the method comprises the following steps: First a substrate having at least one pad set on one surface of the substrate is provided. Then a mask having at least one opening associated with one of the at least one pad is set on the substrate, wherein each opening is separated into a plurality of sub-openings by a segregator to expose the pad. Subsequently, a printing process is conducted to form a conductive layer on each pad. After removing the mask, a passive device is set on the conductive layer over the pad, and a heating treatment is conducted to fix the passive device on the pad.

Abstract translation: 提供了一种应用于半导体封装工艺中的改进的表面安装方法，其中该方法包括以下步骤：首先提供在衬底的一个表面上具有至少一个衬垫的衬底。 然后，在衬底上设置具有至少一个与至少一个衬垫中的一个相关联的开口的掩模，其中通过分离器将每个开口分隔成多个子开口以露出衬垫。 随后，进行打印处理以在每个垫上形成导电层。 在去除掩模之后，在焊盘上的导电层上设置无源器件，并且进行加热处理以将无源器件固定在焊盘上。

公开(公告)号：US20070141394A1

公开(公告)日：2007-06-21

申请号：US11563118

申请日：2006-11-24

Applicant: Chien-Hong Cheng ,  Tai-Yen Chen ,  Hung-Hsin Shih ,  Chien-Te Wu ,  Kuan-Che Wang ,  Chin-In Wu ,  Huai-Ting Shih

Inventor： Chien-Hong Cheng ,  Tai-Yen Chen ,  Hung-Hsin Shih ,  Chien-Te Wu ,  Kuan-Che Wang ,  Chin-In Wu ,  Huai-Ting Shih

IPC: H01L51/54 ,  C09K11/06

CPC classification number: H01L51/0085 ,  C07F15/0033 ,  C09K11/06 ,  C09K2211/1029 ,  C09K2211/1037 ,  C09K2211/1044 ,  C09K2211/1059 ,  C09K2211/185 ,  H01L51/5016 ,  H05B33/14

Abstract: An indium complex is disclosed, which has a structure represented by the following formula (I): wherein each of Z1 and Z3 represents an atomic group for forming a nitrogen-containing heteroaryl group or a nitrogen-containing heterocycloalkenyl group; Z2 represents an atomic group for forming an aryl group, a heteroaryl group, a cycloalkenyl group or a heterocycloalkenyl group; Y represents an atomic group for forming a 5-membered nitrogen-containing heterocycloalkenyl group; each of R1, R2, R3 and R4 represents a hydrogen atom or a substituent; m is 1 or 2; a, b and d is 0 or any positive integer; and c is an integer of from 0 to 2.

Abstract translation: 公开了具有由下式（I）表示的结构的铟络合物：其中Z 1和Z 3各自表示用于形成氮原子的原子团， 含杂芳基或含氮杂环烯基; Z 2表示用于形成芳基，杂芳基，环烯基或杂环烯基的原子团; Y表示形成5元含氮杂环烯基的原子团; R 1，R 2，R 3和R 4中的每一个代表氢原子或取代基; m为1或2; a，b和d为0或任何正整数; c为0〜2的整数。

公开(公告)号：USD530629S1

公开(公告)日：2006-10-24

申请号：US29224972

申请日：2005-03-08

Applicant: Ji Hong Cheng

Designer： Ji Hong Cheng

公开(公告)号：US20060218302A1

公开(公告)日：2006-09-28

申请号：US10551485

申请日：2004-04-09

Applicant: Pie Chia ,  Hong Cheng

Inventor： Pie Chia ,  Hong Cheng

IPC: G06F15/16

CPC classification number: H04W28/18 ,  H04L47/10 ,  H04L47/11 ,  H04L47/12 ,  H04L47/14 ,  H04L47/20 ,  H04L47/2416 ,  H04L47/2425 ,  H04L47/2441 ,  H04L47/32 ,  H04L47/745 ,  H04L47/762 ,  H04L47/781 ,  H04L47/805 ,  H04L47/824 ,  H04W28/24

Abstract: A technique for the end terminal provided with services to handle QoS process is disclosed. According to this technique, a terminal based QoS management scheme is implemented to achieve end-to-end QoS wherein the end terminal 21 is responsible for handling of the QoS related functions. In order for QoS management to be handled at terminal, the terminal needs to know the network conditions and external state of entities in order to know what action to be taken. For example, the terminal performs monitoring and usage collection. These performance data are then reported to a central server (SLA manager 28). The central server collects these data from all terminals within its administration domain. The central server also has access to information on the QoS to be given to individual terminals, such as service level. Based on the information, the central server decides what action to be taken by individual terminal and enforces these actions into the affected terminals.

Abstract translation: 公开了一种提供服务处理QoS进程的终端的技术。 根据该技术，实现基于终端的QoS管理方案以实现端到端QoS，其中终端21负责处理QoS相关功能。 为了在终端处理QoS管理，终端需要知道实体的网络状况和外部状态，以了解要采取的行动。 例如，终端执行监视和使用收集。 这些性能数据然后被报告给中央服务器（SLA管理器28）。 中央服务器从其管理域内的所有终端收集这些数据。 中央服务器还可以访问要提供给各个终端的QoS的信息，例如服务级别。 根据信息，中央服务器决定个别终端采取何种行动，并将这些行为强制执行到受影响的终端。