公开(公告)号：US20140103948A1

公开(公告)日：2014-04-17

申请号：US14133603

申请日：2013-12-18

Applicant: MPI CORPORATION

Inventor： Chao-Ching Huang ,  Chih-Hao Ho ,  Wei-Cheng Ku

IPC: G01R31/28 ,  G01R1/073

CPC classification number: G01R31/2887 ,  G01R1/07314 ,  G01R31/2889

Abstract: A probe card having a configurable structure for exchanging/swapping electronic components for impedance matching is provided. In the probe card, an applied force is exerted on the electronic component so as to make the electronic component electrically connected with at least one conductive contact pad of a supporting unit. The supporting unit is a circuit board or a space transformer. In order to facilitate the exchange or swap of the electronic component, the applied force can be removed. The probe card includes a pressing plate which can be moved between a pressing position and a non-pressing position. The pressing plate has a pressing surface which is contacted with the top end of the electronic component while the pressing plate is in the pressing position. Therefore, the applied force can be generated or removed by changing the positioning of the pressing plate.

Abstract translation: 提供具有用于交换/交换电子部件用于阻抗匹配的可配置结构的探针卡。 在探针卡中，施加的力施加在电子部件上，以使电子部件与支撑单元的至少一个导电接触垫电连接。 支持单元是电路板或空间变压器。 为了促进电子部件的交换或交换，可以移除施加的力。 探针卡包括能够在按压位置和非按压位置之间移动的按压板。 按压板具有在按压板处于按压位置时与电子部件的顶端接触的按压面。 因此，可以通过改变压板的定位来产生或去除施加的力。

公开(公告)号：US20140016124A1

公开(公告)日：2014-01-16

申请号：US13941009

申请日：2013-07-12

Applicant: MPI CORPORATION

Inventor： Chia-Tai CHANG ,  Chin-Yi TSAI ,  Chiu-Kuei CHEN ,  Chen-Chih YU ,  Chien-Chang LAI ,  Chin-Tien YANG ,  Hui-Pin YANG ,  Keng-Shieng CHANG ,  Yun-Ru HUANG ,  Chien-Hung CHEN

IPC: G01N21/88

CPC classification number: G01N21/88 ,  G01R1/06794 ,  G02B7/022 ,  G02B7/023

Abstract: An optical inspection device includes a circuit board having at least one first opening, a mounting plate disposed on a top or bottom surface of the circuit board and having at least one second opening corresponding to the at least one first opening respectively, at least one lens holder received in the at least one second opening, and at least one probe module disposed on a bottom surface of the mounting plate or the bottom surface of the circuit board, corresponding to the at least one lens holder respectively, and having probes electrically connected with the circuit board. Each lens holder has an accommodation for accommodating a lens, and is operatable to do a position adjusting motion in the corresponding second opening.

Abstract translation: 光学检查装置包括具有至少一个第一开口的电路板，设置在电路板的顶表面或底表面上的安装板，并且具有分别对应于至少一个第一开口的至少一个第二开口，至少一个透镜 容纳在所述至少一个第二开口中的至少一个透镜保持器，以及至少一个探针模块，其布置在所述安装板的底表面或所述电路板的底表面上，所述至少一个探针模块分别对应于所述至少一个透镜保持器，并且具有与 电路板。 每个透镜保持器具有用于容纳透镜的容纳部，并且可操作以在相应的第二开口中进行位置调整运动。

公开(公告)号：US20140016123A1

公开(公告)日：2014-01-16

申请号：US13940870

申请日：2013-07-12

Applicant: MPI CORPORATION

Inventor： Chia-Tai CHANG ,  Chin-Yi TSAI ,  Chiu-Kuei CHEN ,  Chen-Chih YU ,  Chien-Chang LAI ,  Chin-Tien YANG ,  Hui-Pin YANG ,  Keng-Shieng CHANG ,  Yun-Ru HUANG

IPC: G01N21/88 ,  G01R1/073

CPC classification number: G01N21/88 ,  G01R1/04 ,  G01R1/06711 ,  G01R1/073 ,  G01R1/07342 ,  H01L21/68

Abstract: A probe holding structure includes a substrate and a plurality of holding modules. The substrate has an opening and a plurality of grooves arranged around a periphery of the opening. The holding modules are connected with the grooves, respectively. Each holding modules includes a fixing member and a plurality of probes. The fixing member is connected with a corresponding groove. The probes are connected with the fixing member and pass through the corresponding groove. The probe holding structure is combined with a lens adjusting mechanism having a lens to form an optical inspection device for testing electric characteristics of chips.

Abstract translation: 探针保持结构包括基板和多个保持模块。 基板具有围绕开口的周边布置的开口和多个槽。 保持模块分别与凹槽连接。 每个保持模块包括固定构件和多个探针。 固定构件与相应的凹槽连接。 探针与固定部件连接并通过相应的凹槽。 探头保持结构与具有透镜的透镜调节机构组合，以形成用于测试芯片的电特性的光学检查装置。

公开(公告)号：US20250123349A1

公开(公告)日：2025-04-17

申请号：US18820228

申请日：2024-08-29

Applicant: MPI Corporation

Inventor： Kooho Jung ,  Hung-Che Fu

IPC: G01R35/00

Abstract: A new type of calibration standards is presented, which has the uncalibrated peer-ports terminated to matching impedances such as 50Ω. Terminating peer-ports increases calibration accuracy since the calibration process is less affected by the undesired crosstalk in the error-network that is being calibrated or in the calibration standards themselves. Using the disclosed peer-terminated standards were shown to have less calibration errors over using conventional dual standards. This is applicable to any electrical measurement and calibration, where the calibration standards are designed to simultaneously connect multiple ports.

公开(公告)号：US20250035671A1

公开(公告)日：2025-01-30

申请号：US18771127

申请日：2024-07-12

Applicant: MPI CORPORATION

Inventor： CHENG-NIEN SU ,  CHUNG-CHI LIN ,  CHING-HUA WU ,  HSIEN-TA HSU

IPC: G01R1/067 ,  G01R3/00 ,  G01R31/28

Abstract: A contacting member of a contact probe for a probe system for performing a functionality test to a DUT includes a body, a contact tip, and a tip transition section between the body and the contact tip. A bottom side of the contacting member, which faces toward the DUT when testing the DUT, includes a lower surface at the body, a tip bottom surface at the contact tip, and a tip transition surface at the tip transition section. A contact end of the contact tip for contacting the DUT is located on a front side of the tip bottom surface. A rear side of the tip bottom surface and the lower surface have a height difference therebetween. The tip transition surface gradually changes in height from the lower surface to the rear side of the tip bottom surface. The contacting member has high precision and structural strength.

公开(公告)号：US20250020692A1

公开(公告)日：2025-01-16

申请号：US18635405

申请日：2024-04-15

Applicant: MPI CORPORATION

Inventor： SHENG-YU LIN ,  SHANG-JUNG HSIEH ,  CHE-WEI LIN ,  HSUEH-CHIH WU

IPC: G01R1/073 ,  G01R31/28

Abstract: An adhered multilayer die unit includes at least one probe zone and at least one non-probe zone for probes to be inserted in the probe zone. The adhered multilayer die unit includes dies and at least one adhesive layer. Each die includes at least one connecting surface, and through holes in the at least one probe zone for the probes to be inserted through the through holes of each die. The at least one adhesive layer adheres the connecting surfaces of the dies to each other. The at least one adhesive layer is entirely in the at least one non-probe zone. Accordingly, the adhered multilayer die unit of the invention has great structural strength in large-area condition, avoids drilling process difficulty problem and size restriction of fastening combining manner, avoids adhesive spillage and its affection on probes, and avoids adhesive-caused problems of adhesive spillage and die levelness deviation.

公开(公告)号：US12196808B2

公开(公告)日：2025-01-14

申请号：US18121475

申请日：2023-03-14

Applicant: MPI Corporation

Inventor： Sebastian Giessmann ,  Yu-Hsun Hsu

IPC: G01R31/308 ,  B23Q3/16 ,  G01R31/28

Abstract: A motorized chuck stage controlling method adapted to a wafer probing device is provided. The wafer probing device includes a control rod and a motorized chuck stage. The control rod can be moved between an upper limit position and a lower limit position, and the motorized chuck stage is moved along a Z-axis direction in response to a movement of the control rod. One purpose of the motorized chuck stage controlling method is to allow the operator to define the highest position to which the motorized chuck stage can be moved in response to the movement of the control rod, thereby preventing the probe and the wafer from colliding with each other.

公开(公告)号：US20240402218A1

公开(公告)日：2024-12-05

申请号：US18806888

申请日：2024-08-16

Applicant: MPI CORPORATION

Inventor： CHIN-TIEN YANG ,  YU-HAO CHEN ,  HUI-PIN YANG ,  CHI-HSIEN LI

IPC: G01R1/073 ,  G01R31/28

Abstract: A probe head includes multiple probes and guide plates. Each probe includes a first end, a second end, and a probe body. The first end abuts a contact pad of a device under test. The second end abuts a contact pad of a board of a probe system. The probe body extends between the first end and the second end according to a longitudinal development axis. The guide plate includes a guide-hole pair for a probe pair of the probe head to respectively pass through, and the guide-hole pair slidably accommodate the pair of probes. The guide plate further includes an extension hole extending from one guide hole of the guide-hole pair to another guide hole. The extension hole intersects with at least one of the first guide holes and is located substantially between the probe pair on the first guide plate.

公开(公告)号：US20240393368A1

公开(公告)日：2024-11-28

申请号：US18645531

申请日：2024-04-25

Applicant: MPI CORPORATION

Inventor： CHIN-TIEN YANG ,  YU-HAO CHEN ,  HUI-PIN YANG ,  CHI-HSIEN LI

IPC: G01R1/067 ,  G01R1/073

Abstract: A probe system and a probe card, a probe head and a guide plate structure thereof are described herein. The probe head includes a plurality of probes and guide plates. Each probe includes a first end, a second end, and a probe body. The first end is configured to abut a contact pad of the device under test. The second end is configured to abut a contact pad of a board of the probe system. The probe body extends between the first end and the second end according to a longitudinal development axis. The guide plate includes a pair of first guide holes for a pair of probes to pass through, and the pair of first guide holes are configured to slidably accommodate the pair of probes. The material between the pair of first guide holes in the guide plate has a relative dielectric constant not greater than 6, so as to reduce the return loss between the probe head and the device under test.

公开(公告)号：US12050235B2

公开(公告)日：2024-07-30

申请号：US17569080

申请日：2022-01-05

Applicant: MPI CORPORATION

Inventor： Chin-Yi Lin ,  Keng-Min Su ,  Che-Wei Lin ,  Ko-Chun Wu

IPC: G01R1/00 ,  G01R1/073 ,  G01R1/44

CPC classification number: G01R1/44 ,  G01R1/07342

Abstract: A heat dissipatable die unit includes an outer die, a metal heat dissipating layer and an inner die piled in order. The inner die includes a probe installation section, and a peripheral portion surrounding the probe installation section and having an inner connecting surface for being connected to a die and an outer connecting surface opposite thereto. The probe installation section has a recessed portion recessed from the inner connecting surface, and a protruding portion protruding from the outer connecting surface, thereby forming a level difference portion bordering the peripheral portion. The outer die includes an installation recess and a supporting portion surrounding the installation recess. The installation recess is recessed from an inner surface of the supporting portion and accommodates the protruding portion of the inner die. The metal heat dissipating layer is disposed between the peripheral portion and the supporting portion to attain heat dissipating effect.