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    OPTICAL TRANSCEIVER WITH VERSATILE POSITIONING
    91.
    发明申请
    OPTICAL TRANSCEIVER WITH VERSATILE POSITIONING 有权

    公开(公告)号：US20220019039A1

    公开(公告)日：2022-01-20

    申请号：US17386607

    申请日：2021-07-28

    Applicant: Samtec, Inc.

    Inventor： Eric Zbinden

    IPC: G02B6/42 ,  H04B10/25 ,  H04B10/40

    Abstract: An optical transceiver can include a transmitter and a receiver. The optical transceiver is configured to mate with an electrical connector in first and second orientations that are opposite each other. In certain examples, a thermally conductive surface of the transceiver is configured to be placed in thermal communication with a heat dissipation member in one or both of the first and second orientations. Further examples of optical transceivers can be mounted to a base and placed in electrical communication with an electrical connector. A lid provides a compressive force that simultaneously makes electrical contact between the transceiver and a host printed circuit board (PCB) and provides a low impedance heat transfer path to dissipate heat generated during transceiver operation.

    HYBRID ELECTRICAL CONNECTOR FOR HIGH-FREQUENCY SIGNALS
    94.
    发明申请
    HYBRID ELECTRICAL CONNECTOR FOR HIGH-FREQUENCY SIGNALS 有权

    公开(公告)号：US20210257785A1

    公开(公告)日：2021-08-19

    申请号：US17265845

    申请日：2019-10-24

    Applicant: Samtec, Inc.

    Inventor： Jignesh H. SHAH ,  Jean Karlo WILLIAMS BARNET

    IPC: H01R13/6474 ,  H01R12/72

    Abstract: A connector includes a housing; a cage surrounding the housing; first contacts that are located in the housing and that transmit high-speed signals; second contacts that are located in the housing, that transmit low-speed signals, and that each include a portion that extends from a top surface of the housing; first cables connected to the first contacts; and second cables connected to the second contacts.

    METHOD FOR CREATING THROUGH-CONNECTED VIAS AND CONDUCTORS ON A SUBSTRATE
    99.
    发明申请
    METHOD FOR CREATING THROUGH-CONNECTED VIAS AND CONDUCTORS ON A SUBSTRATE 审中-公开

    公开(公告)号：US20200343105A1

    公开(公告)日：2020-10-29

    申请号：US16924600

    申请日：2020-07-09

    Applicant: Samtec, Inc.

    Inventor： Fred Koelling ,  Alan D. Nolet ,  Daniel Long

    IPC: H01L21/48 ,  H01L23/498 ,  B22F7/08 ,  B22F3/15 ,  B22F1/02

    Abstract: A method to reduce the number and type of processing steps to achieve conductive lines in the planes of a substrate concurrently interconnecting conductor through the substrate, by forming structures in the planes of a substrate. These structures may include interconnect lines, bond pads, and other structures, and improve the performance of subsequent unique processing while simultaneously reducing the manufacturing complexity to reduce time and cost. These structures are formed by selective etching using chemical mechanical polishing, and then completed using a single fill step with a conductive material.

    OPTICAL TRANSCEIVER
    100.
    发明申请
    OPTICAL TRANSCEIVER 审中-公开

    公开(公告)号：US20200310054A1

    公开(公告)日：2020-10-01

    申请号：US16900097

    申请日：2020-06-12

    Applicant: Samtec, Inc.

    Inventor： Marc Epitaux ,  John L. Nightingale

    IPC: G02B6/42 ,  G02B6/35

    Abstract: An optical transceiver can include a transmitter having a photonic integrated circuit, and a receiver having a current-to-voltage converter and a photodetector in electrical communication with the current-to-voltage converter and separate from the photonic integrated circuit. Each of the transmitter and the receiver can include an interconnect member that includes first and second optical paths for the propagation of optical transmit signals and optical receive signals, respectively. The interconnect members of the transmitter and receiver can further define electrical paths that are configured to connect to an underlying substrate at one end, and the transmitter and receiver, respectively. The interconnect members can be separate from each other or can define a single monolithic interconnect member.

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