公开(公告)号：US06679587B2

公开(公告)日：2004-01-20

申请号：US10003600

申请日：2001-10-31

申请人： Chien-Hua Chen ,  Charles C Haluzak

发明人： Chien-Hua Chen ,  Charles C Haluzak

IPC分类号： B41J205

CPC分类号： B41J2/1642 ,  B41J2/1404 ,  B41J2/14201 ,  B41J2/1603 ,  B41J2/1607 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2002/041 ,  B41J2002/043 ,  B41J2002/1437 ,  B41J2002/14403 ,  B41J2202/03 ,  B41J2202/15 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/494 ,  Y10T29/49401

摘要： A fluid ejection device comprising a composite substrate, wherein the composite substrate has two substrates with a patterned etch mask therebetween, and a fluid channel.

公开(公告)号：US06481832B2

公开(公告)日：2002-11-19

申请号：US09774259

申请日：2001-01-29

申请人： Qin Liu ,  Naoto Kawamura ,  Chien-Hua Chen

发明人： Qin Liu ,  Naoto Kawamura ,  Chien-Hua Chen

IPC分类号： B41J205

CPC分类号： B41J2/1645 ,  B41J2/1404 ,  B41J2/14145 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1634 ,  B41J2/1635 ,  Y10T29/49 ,  Y10T29/49085 ,  Y10T29/49401

摘要： The invention is a fluid ejection device, such as a printhead, that has a substrate with a first surface mating to an orifice layer, preferably through a stack of thin-film layers. The orifice layer defines a fluid chamber interfacing to an orifice opening or nozzle. The substrate has a second surface having a truncated pyramidal structure; either polyhedral or triangular ridge shaped defining an opening through the substrate to the fluid chamber. The substrate further has an ejection element, preferably disposed as a resistor in the stack of thin-film layers. When energy is transferred from the ejection element to the fluid in the fluid chamber, fluid is ejected from the orifice opening. The fluid ejection device may have one or a plurality of fluid chambers and one or a plurality of frustums of a truncated polyhedral, truncated pyramidal, truncated conical or truncated triangular cross-sectional ridge structures defining openings from the second surface of the substrate to the fluid chambers.

摘要翻译： 本发明是一种流体喷射装置，例如打印头，其具有基底，其具有与孔层相匹配的第一表面，优选地通过一叠薄膜层。 孔口层限定与孔口或喷嘴连接的流体室。 基板具有具有截头棱锥结构的第二表面; 多面体或三角形脊形，限定通过基底的开口到流体室。 衬底还具有优选地设置在薄膜层堆叠中作为电阻器的喷射元件。 当能量从喷射元件转移到流体室中的流体时，流体从孔口排出。 流体喷射装置可以具有一个或多个流体室和一个或多个截头圆锥体，其截断的多面体，截头锥体，截头圆锥形或截头三角形横截面脊结构限定从衬底的第二表面到流体的开口 房间。

公开(公告)号：US06387575B2

公开(公告)日：2002-05-14

申请号：US09865986

申请日：2001-05-25

申请人： Chien-Hua Chen ,  Michael A Pate

发明人： Chien-Hua Chen ,  Michael A Pate

IPC分类号： G03F900

CPC分类号： B41J2/1634 ,  B41J2/162 ,  B41J2/1626 ,  B41J2/1631 ,  B41J2/1646

摘要： A method for manufacturing ink-jet printheads having nozzles with re-entrant profiles has the following steps. A source of electromagnetic energy is created which is then used with an optical system to produce a source of energy having a constant illumination angle on an process plane. A substrate is then exposed with the electromagnetic source to define the nozzles having the re-entrant profile. Also, apparatus for creating the constant illumination angle include an optical deflecting mask and an afocal optical system.

摘要翻译： 用于制造具有带入口轮廓的喷嘴的喷墨打印头的方法具有以下步骤。 产生电磁能源，然后与光学系统一起使用以在处理平面上产生具有恒定照明角度的能量源。 然后用电磁源将衬底暴露以限定具有入口轮廓的喷嘴。 此外，用于产生恒定照明角度的装置包括光学偏转掩模和无焦光学系统。

公开(公告)号：US10702103B2

公开(公告)日：2020-07-07

申请号：US16007090

申请日：2018-06-13

申请人： Chien-Hua Chen

发明人： Chien-Hua Chen

IPC分类号： A47J43/24

摘要： A flip-top washing device for vegetables and fruits has a housing assembly, a cover assembly pivotally connected to the housing assembly, a driving assembly mounted on the cover assembly, a washing basket mounted in the housing assembly, and an agitating panel assembly mounted on and connected with the washing basket. With multiple driving blocks of a driving member on the cover assembly and multiple connecting blocks on the agitating panel assembly and with an inclined surface and an vertical surface of each of the driving and connecting blocks, the driving member is able to be securely connected with the agitating panel assembly when closing the cover assembly onto the housing assembly. As the agitating panel assembly and the washing basket rotate, water inside the housing assembly is, strongly agitated so as to wash the vegetables and the fruits in the housing assembly.

公开(公告)号：US20190029471A1

公开(公告)日：2019-01-31

申请号：US16007090

申请日：2018-06-13

申请人： Chien-Hua Chen

发明人： Chien-Hua Chen

IPC分类号： A47J43/24

摘要： A flip-top washing device for vegetables and fruits has a housing assembly, a cover assembly pivotally connected to the housing assembly, a driving assembly mounted on the cover assembly, a washing basket mounted in the housing assembly, and an agitating panel assembly mounted on and connected with the washing basket. With multiple driving blocks of a driving member on the cover assembly and multiple connecting blocks on the agitating panel assembly and with an inclined surface and an vertical surface of each of the driving and connecting blocks, the driving member is able to be securely connected with the agitating panel assembly when closing the cover assembly onto the housing assembly. As the agitating panel assembly and the washing basket rotate, water inside the housing assembly is, strongly agitated so as to wash the vegetables and the fruits in the housing assembly.

公开(公告)号：US09355834B2

公开(公告)日：2016-05-31

申请号：US14117773

申请日：2011-07-28

申请人： Chien-Hua Chen ,  Michael G. Groh

发明人： Chien-Hua Chen ,  Michael G. Groh

IPC分类号： G09F3/10 ,  B32B37/02 ,  H01L21/02 ,  H01L23/00 ,  H01L25/065 ,  H01L41/313

CPC分类号： H01L21/02 ,  G09F3/10 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L25/0657 ,  H01L41/313 ,  H01L2221/68368 ,  H01L2224/27003 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/8385 ,  Y10T428/24851

摘要： An adhesive transfer method includes depositing an adhesive on a first substrate, transferring a layer of the adhesive from the first substrate to an intermediate substrate, and transferring adhesive from the layer of the adhesive to at least one area of a second substrate.

摘要翻译： 粘合剂转移方法包括在第一衬底上沉积粘合剂，将粘合剂层从第一衬底转移到中间衬底，以及将粘合剂从粘合剂层转移到第二衬底的至少一个区域。

公开(公告)号：US20150210074A1

公开(公告)日：2015-07-30

申请号：US14421975

申请日：2012-08-16

申请人： Chien-Hua Chen ,  Silam J. Choy ,  Brett E. Dahlgren

发明人： Chien-Hua Chen ,  Silam J. Choy ,  Brett E. Dahlgren

IPC分类号： B41J2/14 ,  B41J27/20

CPC分类号： B41J2/1433 ,  B41J2/14145 ,  B41J2/1603 ,  B41J2/1623 ,  B41J2/1629 ,  B41J2/1634 ,  B41J27/20 ,  B41J2002/14419 ,  Y10T428/24314

摘要： In one example, a method for making diagonal openings in photodefinable glass includes exposing part of a body of photodefinable glass to a beam of light oriented diagonally to a surface of the body at an angle of 5° or greater measured with respect to a normal to the surface of the body and removing some or all of the part of the body exposed to the light beam to form a diagonal opening in the body.

摘要翻译： 在一个实例中，用于在可光限定玻璃中制造斜开口的方法包括将可光限定玻璃体的一部分暴露于相对于正常对准的5°或更大的角度测量的5°或更大的角度对角定向到身体的表面的光束 身体的表面并且去除暴露于光束的身体的部分或全部部分以在体内形成对角线开口。

公开(公告)号：US20130320198A1

公开(公告)日：2013-12-05

申请号：US13985393

申请日：2011-03-20

申请人： Alexander Govyadinov ,  Chien-Hua Chen

发明人： Alexander Govyadinov ,  Chien-Hua Chen

IPC分类号： G01V8/24 ,  G01V8/16

CPC分类号： G01V8/24 ,  B41J2/04558 ,  B41J2/04561 ,  B41J2/04586 ,  B41J2/125 ,  B41J2/16579 ,  B41J2/16585 ,  B41J2/2142 ,  B41J2/2146 ,  G01N21/53 ,  G01V8/16

摘要： A drop detector assembly is provided including an ejection element to eject a fluid drop, a light guide to selectively receive light scattered off of the fluid drop, and a light detector formed in the light guide to detect light received by the light guide.

摘要翻译： 提供一种液滴检测器组件，其包括用于喷射液滴的喷射元件，用于选择性地接收从液滴散射的光的光导;以及形成在光导中的光检测器，用于检测光导所接收的光。

公开(公告)号：US20130102122A1

公开(公告)日：2013-04-25

申请号：US13712410

申请日：2012-12-12

申请人： Chien-Hua Chen ,  Teck-Chong Lee

发明人： Chien-Hua Chen ,  Teck-Chong Lee

IPC分类号： H01L49/02

CPC分类号： H01L28/40 ,  H01L21/76898 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/642 ,  H01L23/645 ,  H01L24/48 ,  H01L25/16 ,  H01L28/10 ,  H01L28/60 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention relates to a semiconductor package and a method for making the same. The method includes the steps of: (a) providing a base material; (b) forming a first metal layer on the base material, wherein the first metal layer comprises a first inductor and a first lower electrode; (c) forming a first dielectric layer and a first upper electrode on the first lower electrode, wherein the first dielectric layer is disposed between the first upper electrode and the first lower electrode, and the first upper electrode, the first dielectric layer and the first lower electrode form a first capacitor; and (d) forming a first protective layer, so as to encapsulate the first inductor and the first capacitor.

摘要翻译： 半导体封装及其制造方法技术领域本发明涉及半导体封装及其制造方法。 该方法包括以下步骤：（a）提供基材; （b）在所述基材上形成第一金属层，其中所述第一金属层包括第一电感器和第一下电极; （c）在所述第一下电极上形成第一电介质层和第一上电极，其中所述第一电介质层设置在所述第一上电极和所述第一下电极之间，所述第一上电极，所述第一电介质层和所述第一电极 下电极形成第一电容器; 和（d）形成第一保护层，以封装第一电感器和第一电容器。

公开(公告)号：US20130032889A1

公开(公告)日：2013-02-07

申请号：US13569882

申请日：2012-08-08

申请人： Hsueh-An Yang ,  Pei-Chun Chen ,  Chien-Hua Chen

发明人： Hsueh-An Yang ,  Pei-Chun Chen ,  Chien-Hua Chen

IPC分类号： H01L23/522 ,  H01L27/092

CPC分类号： H01L21/76898

摘要： The present invention relates to a silicon chip including a silicon substrate, a passivation layer, at least one electrical device and at least one through via. The passivation layer is disposed on a first surface of the silicon substrate. The electrical device is disposed in the silicon substrate, and exposed to a second surface of the silicon substrate. The through via includes a barrier layer and a conductor, and penetrates the silicon substrate and the passivation layer. A first end of the through via is exposed to the surface of the passivation layer, and a second end of the through via connects the electrical device. When a redistribution layer is formed on the surface of the passivation layer, the redistribution layer will not contact the silicon substrate, thus avoiding a short circuit.

摘要翻译： 本发明涉及包括硅衬底，钝化层，至少一个电气器件和至少一个通孔的硅芯片。 钝化层设置在硅衬底的第一表面上。 电气设备设置在硅衬底中，并暴露于硅衬底的第二表面。 通孔包括阻挡层和导体，并且穿透硅衬底和钝化层。 通孔的第一端暴露于钝化层的表面，通孔的第二端连接电气装置。 当在钝化层的表面上形成再分布层时，再分布层将不会接触硅衬底，从而避免短路。