摘要:
A memory module is formed of multiple memory chips and an optical interface chip fixed on a substrate. The chips are interconnected by proximity communication (PxC) in which each chip includes transmitting and receiving elements, such as electrical pads which form capacitively coupled links when the chips are placed together with their pads facing each other. The PxC links may be directly between the chips or through an intermediate passive bridge chip. The interface chip is coupled to an external optical channel and includes converters between optical and electrical signals, control circuitry, buffers, and PxC elements for communicating with the memory chips. The array of memories may be a linear or two-dimensional array around the interface chip forming a redundant PxC network, optionally with redundant PxC connections. Multiple rectangular memory chips may present their narrow sides to the interface chip to maximize bandwidth.
摘要:
One embodiment of the present invention provides a system that facilitates capacitive communication between integrated circuit chips. The system includes a substrate having an active face upon which active circuitry and signal pads reside, and a back face opposite the active face. The system additionally includes an integrated circuit chip having an active face upon which active circuitry and signal pads reside, and a back face opposite the active face. Additionally, the integrated circuit chip is pressed against the substrate such that the active face of the integrated circuit chip is parallel to and adjacent to the active face of the substrate, and capacitive signal pads on the active face of the integrated circuit chip overlap signal pads on the active face of the substrate. The arrangement of the substrate and integrated circuit chip facilitates communication between the integrated circuit chip and the substrate through capacitive coupling via the overlapping signal pads.
摘要:
One embodiment of the present invention provides a system that facilitates capacitive communication between integrated circuit chips. The system includes a substrate having an active face upon which active circuitry and signal pads reside, and a back face opposite the active face. The system additionally includes an integrated circuit chip having an active face upon which active circuitry and signal pads reside, and a back face opposite the active face. Additionally, the integrated circuit chip is pressed against the substrate such that the active face of the integrated circuit chip is parallel to and adjacent to the active face of the substrate, and capacitive signal pads on the active face of the integrated circuit chip overlap signal pads on the active face of the substrate. The arrangement of the substrate and integrated circuit chip facilitates communication between the integrated circuit chip and the substrate through capacitive coupling via the overlapping signal pads.
摘要:
One embodiment of the present invention provides a system that detects changes in power-supply current within an integrated circuit (IC) chip. During operation, the system monitors an induced current through a detection loop. This detection loop is situated at least partially within the IC chip in close proximity to a power-supply current for the IC chip, so that a change in the power-supply current changes a magnetic field passing through the detection loop, thereby inducing a corresponding current through the detection loop. The system then generates a control signal based on the induced current, so that changes in the power-supply current cause the control signal to change. In addition, the system uses the control signal to control circuits within the IC chip.
摘要:
Embodiments of an integrated circuit that includes a debug circuit are described. This debug circuit is configured to test an asynchronous circuit by performing analog measurements on asynchronous signals associated with the asynchronous circuit, and includes a triggering module configured to gate the debug circuit based on one or more of the asynchronous signals. This triggering module has a continuous mode of operation and a single-shot mode of operation. A timing module within the debug circuit has a timing range exceeding a pre-determined value, and is configured to provide signals corresponding to a first time base or signals corresponding to a second time base. Furthermore, control logic within the debug circuit is configured to select a mode of operation and a given time base for the debug circuit, which is either the first time base or the second time base.
摘要:
Embodiments of an encoding circuit to communicate a sequence of words are described. This encoding circuit includes an encoding module that is configured to receive a first sequence of words and to generate a DC-balanced second sequence of words based on the first sequence of words, where communicating the second sequence of words consumes less energy than communicating a third sequence of words that includes words in the first sequence of words alternating with words in the inverse of the first sequence of words. In addition, the second sequence of words includes substantially twice as many words as the first sequence of words.
摘要:
One embodiment of the present invention provides a system that asynchronously controls the sending of data items from a sender to a receiver. The system includes a data path between the sender and the receiver, a first control path between the sender and the receiver, and a second control path between the sender and the receiver. The first control path and the second control path alternately control the asynchronous transmission of consecutive data items on the data path between the sender and the receiver.
摘要:
Embodiments of the present invention provide a system that electronically aligns mini-bars on different semiconductor chips which are situated face-to-face to facilitate communication between the semiconductor chips through capacitive coupling. During operation, the system selects a group of transmitter mini-bars on the first chip to form a transmitter bit position and selects a group of receiver mini-bars on the second chip to form a receiver bit position. The system then associates transmitter bit positions on the first chip with proximate receiver bit positions on the second chip. In this way, the system allows data signals transmitted by the mini-bars within a transmitter bit position on the first chip to be collectively received by the mini-bars within an associated receiver bit position on the second chip.
摘要:
One embodiment of the present invention provides a system for high-throughput asynchronous communication that includes a sender and a receiver. A sender's first-in, first-out (FIFO) buffer is coupled to an input of the sender, a receiver's FIFO buffer is coupled to an input of the receiver, a forward communication channel is coupled between the sender and the receiver's FIFO buffer, and a reverse communication channel is coupled between the receiver and the sender's FIFO buffer. The forward communication channel, the receiver's FIFO buffer, the reverse communication channel, and the sender's FIFO buffer operate collectively as a network FIFO between the sender and the receiver. The network FIFO is configured to ensure that asynchronous communication between the sender and the receiver takes place reliably and without unnecessary waiting by the sender or the receiver.
摘要:
An integrated circuit containing a communication channel is described. This communication channel includes: a transmit circuit configured to transmit signals; a link coupled to an output of the transmit circuit; a receive circuit coupled to the link; and a clamping circuit coupled to the link. Note that the transmit circuit is capacitively coupled to the receive circuit via the link. Furthermore, the clamping circuit is configured to compensate for leakage current on the link by maintaining a voltage on the link corresponding to a logical “1” or a logical “0.” This voltage is based on a history of the transmitted signals.