摘要:
A liquid chemical formulation suitable for making a thin solid polycarbonate film of highly uniform thickness is formed with polycarbonate material, a liquid that dissolves the polycarbonate, and possibly one or more other constituents. The liquid is typically capable of dissolving the polycarbonate to a concentration of at least 1% at 20° C. and 1 atmosphere. The liquid also typically has a boiling point of at least 80° C. at 1 atmosphere. Examples of the liquid include pyridine, a ring-substituted pyridine derivative, pyrrole, a ring-substituted pyrrole derivative, pyrrolidine, a pyrrolidine derivative, and cyclohexanone. In forming the polycarbonate-containing film, a liquid film (36A) of the liquid chemical formulation is formed over a substructure (30). The liquid film is processed to largely remove the liquid and convert the polycarbonate into a solid film (38).
摘要:
A buffer having first and second input terminals and an output terminal. The buffer also includes a fast edge driver having an input terminal and an output terminal, with the input terminal connected to the first input terminal of the buffer, and the output terminal connected to the output terminal of the buffer. A shielding circuit is provided having an input terminal and an output terminal, with the input terminal connected to the second input terminal of the buffer. The buffer further includes a recovery circuit having an input terminal and an output terminal, with the input terminal connected to the output terminal of the shielding circuit, and the output terminal connected to the output terminal of the buffer.
摘要:
Multiple procedures are presented for removing contaminant material (12) from electron-emissive elements (10) of an electron-emitting device (30). One procedure involves converting the contaminant material into gaseous products (14), typically by operating the electron-emissive elements, that move away from the electron-emissive elements. Another procedure entails converting the contaminant material into further material (16) and removing the further material. An additional procedure involves forming surface coatings (18 or 20) over the electron-emissive elements. The contaminant material is then removed directly from the surface coatings or by removing at least part of each surface coating.
摘要:
A tri-state CMOS output buffer is provided which exhibits a relatively low input capacitance and tolerance to a range of operating voltages. The output buffer includes a PUP input, a PD input and an output. The output buffer includes a source follower circuit coupled to the PUP input such that the output of the source follower generally follows transitions in the PUP input signal. The source follower output is the buffer output. A pull-down transistor is coupled between the buffer output and ground to pull-down the output voltage when the PD signal goes high. A pull-up transistor and an isolation transistor are coupled in series to form a series coupled circuit. This series-coupled circuit is coupled in parallel with the source follower. The pull-up transistor pulls up the voltage on the buffer output when the PUP input signal goes high. The isolation transistor is switchable to an off state to isolate a parasitic diode associated with the pull-up transistor. A control circuit is coupled to the buffer output and the PUP input to monitor the buffer output and the PUP input to turn off the isolation transistor when the buffer output is in a tri-state condition and the buffer output is driven high by an external device. Otherwise, the control circuit causes the isolation transistor to remain on. In this manner, isolation transistor switching is significantly reduced and the capacitive load presented to the PUP input signal is substantially lowered.
摘要:
A memory (20) has a plurality of columns of memory cells and has a plurality of redundant columns of memory cells. A comparator (45) detects an access to a defective column. A redundant write generator (31) and write fuses (32) are provided for each write portion (30A, 30B, 30C, and 30D) to replace the defective column with a redundant column by replacing a write global data line (37) with a redundant write global data line (39). Redundant read generators (60 and 61) and read fuses (59) are provided for each read portion (50A, 50B, 50C, and 50D) to replace a defective column by deselecting a read global data line (29) and replacing it with a redundant read global data line (44). The fuses and redundant generators are located close to their global data lines, thus reducing the routing of control signals and improving the access time of redundant columns.
摘要:
Methods and systems for measuring the resistance of multiple memory elements are disclosed. The memory elements may be multi-bit memory and through precise measurement of resistance of the multi-bit memory elements, determination of how many and which memory elements fall into specific memory ranges can be accomplished. Furthermore, storage and/or display of this information may allow for the creation of resistance distribution histograms for modeling of one or more memory arrays.
摘要:
The present disclosure includes devices and methods for operating resistance variable memory. One device embodiment includes an array of memory cells wherein a number of the cells are commonly coupled to a select line, the number cells including a number of data cells programmable within a number of target threshold resistance (Rt) ranges which correspond to a number of data states, and a number of reference cells interleaved with the data cells and programmable within the number of target Rt ranges. The aforementioned device embodiment also includes control circuitry coupled to the array and configured to sense a level associated with at least one data cell and at least one reference cell, and compare the sensed level associated with the at least one data cell with the sensed level associated with the at least one reference cell to determine a data state of the at least one data cell.
摘要:
Devices, methods, and systems for temperature compensation in memory devices, such as resistance variable memory, among other types of memory are included. One or more embodiments can include a memory device including a table with an output that is used to create a multiplication factor for a current to compensate for temperature changes in the memory device, where the output depends on an operating temperature of the memory device and a difference in the current between a highest specified operating temperature and a lowest specified operating temperature of the memory device.
摘要:
The present disclosure includes devices, methods, and systems for programming memory, such as resistance variable memory. One embodiment can include an array of resistance variable memory cells, wherein the resistance variable memory cells are coupled to one or more data lines, a row decoder connected to a first side of the array, a column decoder connected to a second side of the array, wherein the second side is adjacent to the first side, a gap located adjacent to the row decoder and the column decoder, and clamp circuitry configured to control a reverse bias voltage associated with one or more unselected memory cells during a programming operation, wherein the clamp circuitry is located in the gap and is selectively coupled to the one or more data lines.
摘要:
Methods for measuring the resistance of multiple memory elements are disclosed. The memory elements may be multi-bit memory and through precise measurement of resistance of the multi-bit memory elements, determination of how many and which memory elements fall into specific memory ranges can be accomplished. Furthermore, storage and/or display of this information may allow for the creation of resistance distribution histograms for modeling of one or more memory arrays.