摘要:
A positive type photoresist composition suitable for light in the wavelength region of 170 nm to 220 nm, high in sensitivity, excellent in adhesion and giving a good resist pattern profile, which comprises a resin having an ester group represented by the following general formula [I] in its molecule and a compound generating an acid by irradiation of an active light ray or radiation: wherein R1 represents a hydrogen atom, an alkyl group or a cycloalkyl group; and R2 and R3, which may be the same or different, each represents a hydrogen atom, an alkyl group, a cycloalkyl group or —A—R4, and R2 and R3 may combine together to form a ring, wherein R4 represents a hydrogen atom, an alkyl group or a cycloalkyl group, R4 and R2 or R3 may combine together to form a ring, and A represents an oxygen atom or a sulfur atom.
摘要:
Disclosed is a radiation ray sensitive resin composition comprising a water-insoluble, alkali-soluble resin, a water-insoluble, alkali-soluble low-molecular compound and a radiation ray sensitive component, in which said radiation ray sensitive component contains a mixture composed of (A) a napthoquinonediazide sulfonic acid diester of water-insoluble, alkali-soluble low-molecular compounds having three and/or four phenolic hydroxyl groups and (B) a napthoquinonediazide sulfonic acid ester of a water-insoluble, alkali-soluble low-molecular compound having from 5 to 7 phenolic hydroxyl groups, in an amount of 30% or more of said radiation ray sensitive component. The composition is a positive type photoresist having a high resolution and small film thickness dependence. This has a broad latitude for development and leaves a small resist residue after development. This has high heat resistance and is therefore highly resistant to dry etching.
摘要:
A positive chemically amplified resist composition is disclosed, comprising (a) a compound which generates an acid upon irradiation with active light or radiant ray; (b) a resin insoluble in water but soluble in an aqueous alkali solution; and (c) a low molecular acid-decomposable dissolution inhibitor having a molecular weight of 3,000 or less and containing an acid-decomposable alkyl ester group represented by formula (I), and which increases its solubility in an alkali developer by the action of an acid, and having a sodium content and a potassium content each of 30 ppb or less. Also disclosed is a positive chemically amplified resist composition comprising the foregoing compound (a) and (d) a resin having an acid-decomposable alkyl ester group represented by formula (I), and which increases its solubility in an alkali developer by the action of an acid, and having a sodium content and a potassium content each of 30 ppb or less. Still further disclosed are methods for producing the compounds (c) and (d).
摘要:
The present invention provides a positive-working photoresist composition comprising an alkali-soluble resin and a 1,2-naphthoquinonediazide-5-(and/or -4-)sulfonic ester of a specific water-insoluble alkali-soluble low molecular compound, wherein the high-performance liquid chromatography of the ester with an ultraviolet ray at 254 nm shows that the patterns corresponding to the diester components and complete ester component of the ester each fall within the specific range and a positive-working photoresist composition comprising a water-insoluble alkali-soluble resin, a water-insoluble alkali-soluble low molecular compound, and an ionization-sensitive radioactive compound which comprises a mixture of a naphthoquinone-diazidesulfonic diester of a water-insoluble alkali-soluble low molecular compound having three phenolic hydroxyl groups as an ionization-sensitive radioactive compound (A) and a naphthoquinonediazidesulfonic diester of a water-insoluble alkali-soluble low molecular compound having four phenolic hydroxyl groups as an ionization-sensitive radioactive compound (B) in an amount of 30% or more by weight based on the total amount of the ionization-sensitive radioactive compound.
摘要:
A positive type or negative type light-sensitive composition providing high sensitivity and high resolution in the manufacture of a semiconductor device, and contains:(a) a compound which has at least one group capable of decomposing by acid and a solubility that is increased in an alkaline developing solution,(b) a compound which generates acid by an irradiation with actinic rays or radiation,(c) a compound which generates a base at 50.degree. C. or higher, and(d) a resin which is insoluble in water and soluble in an alkaline aqueous solution.
摘要:
A positive working photoresist composition sensitive to radiation, having high resolving power, high sensitivity, and excellent storage stability, and further forming a pattern capable of accurately reproducing a mask size in a wide range of photomask line width. The present invention has been obtained by a composition containing at least one of a 1,2-napthoquinonediazido-5-sulfonic acid ester of a polyhydroxy compound and a 1,2-napthoquinonediazido-4-sulfonic acid ester of a polyhydroxy compound in combination with at least one alkali-soluble resin.
摘要:
A novel siloxane polymer having at least 1 mol % of a structural unit derived from a cyclic heat addition product between a diene compound of formula (I) or (II) and an olefin or acetylene compound of formula (III), (IV) or (V): ##STR1## and a positive working light-sensitive composition comprising the siloxane polymer.
摘要:
A light-sensitive composition comprises at least one water-insoluble and aqueous alkaline-soluble polyurethane resin having N-sulfonylamido, N-sulfonylureido or N-aminosulfonylamido groups. The light-sensitive composition is excellent in developing properties in an aqueous alkaline developer and coating properties. In addition, the images obtained from the composition are good in wear resistance and exhibit high adhesion to the substrate. Thus, the composition is very suitable for use in making IC circuits, photomasks and PS plates which provide lithographic printing plates exhibiting high printing durability.
摘要:
A light-sensitive composition comprising a diazonium compound and a polymer having the recurring units represented by the following general formula (I): ##STR1## wherein R.sub.1 represents a hydrogen atom or a substituted or unsubstituted alkyl group; R.sub.2 represents an unsubstituted alkyl group; R.sub.3 represents an aliphatic or aromatic hydrocarbon group having a carboxyl group; R.sub.4 represents an aliphatic or aromatic hydrocarbon group which has at least one hydroxyl or nitrile group and which may be further substituted; n.sub.1, n.sub.2, n.sub.3, n.sub.4 and n.sub.5 represent the molar percents of the respective recurring units, provided that n.sub.1 is from about 5 to about 85 mol %, n.sub.2 is from 0 to about 60 mol %, n.sub.3 is from 0 to about 20 mol %, n.sub.4 is from about 3 to about 60 mol % and n.sub.5 is from greater than 0 to about 60 mol %.
摘要:
The photosensitive composition suitable as a posi-posi photosensitive composition for photosensitive lithographic printing plates is composed of a high molecular compound shown by following general formula I or II and an o-naphthoquinonediazide compound; ##STR1## wherein R.sub.1 is a hydrogen atom, an alkyl group having 1 to 8 carbon atoms and R.sub.2 and R.sub.3 each is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.When the photosensitive composition is used as a photosensitive layer of a photosensitive lithographic printing plate and the plate is developed by rubbing with a sponge containing a developer, the photosensitive composition at the exposed areas is completely removed leaving no patches of the composition.