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公开(公告)号：US09091806B2
公开(公告)日：2015-07-28
申请号：US13440839
申请日：2012-04-05
CPC分类号： G02B6/122 , G02B6/4204 , G03H1/0248 , G03H2001/0434 , G03H2223/16 , G03H2270/54
摘要： An integrated circuit includes a holographic recording material substantially filling a cavity in a semiconductor layer. During operation of the integrated circuit, a holographic pattern in the holographic recording is reconstructed and used to diffract an optical signal propagating in a plane of an optical waveguide, which is defined in the semiconductor layer out of the plane through the cavity. In this way, the holographic recording material may be used to couple the optical signal to an optical fiber or another integrated circuit.
摘要翻译： 集成电路包括基本上填充半导体层中的空腔的全息记录材料。 在集成电路的操作期间，全息记录中的全息图被重构并用于将在半导体层中定义的光波导的平面中传播的光信号衍射出通过空腔的平面。 以这种方式，全息记录材料可以用于将光信号耦合到光纤或另一集成电路。
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公开(公告)号：US08971674B2
公开(公告)日：2015-03-03
申请号：US12730774
申请日：2010-03-24
CPC分类号： G02B6/12007 , G02F1/0147 , G02F1/025 , G02F1/3132
摘要： An optical device with high thermal tuning efficiency is described. This optical device may be implemented using a tri-layer structure (silicon-on-insulator technology), including: a substrate, a buried-oxide layer and a semiconductor layer. In particular, a thermally tunable optical waveguide may be defined in the semiconductor layer. Furthermore, a portion of the substrate under the buried-oxide layer and substantially beneath a location of the thermally tunable optical waveguide is fabricated so that a portion of the buried-oxide layer is exposed. In this way, the thermal impedance between the thermally tunable optical waveguide and an external environment is increased, and power consumption associated with thermal tuning of the optical waveguide is reduced.
摘要翻译： 描述了具有高热调谐效率的光学装置。 该光学器件可以使用三层结构（绝缘体上硅技术）来实现，包括：衬底，掩埋氧化物层和半导体层。 特别地，热可调谐光波导可以限定在半导体层中。 此外，制造掩埋氧化物层下面的基板的一部分并且基本上位于热可调谐光波导的位置下方，使得一部分掩埋氧化物层露出。 以这种方式，热可调谐光波导和外部环境之间的热阻抗增加，并且降低与光波导的热调谐相关的功耗。
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公开(公告)号：US20140029940A1
公开(公告)日：2014-01-30
申请号：US13453930
申请日：2012-04-23
IPC分类号： H04B10/077
CPC分类号： H04B10/0775 , H01S5/0687 , H01S5/40 , H04B10/07955
摘要： An optical-source monitor images and diffracts received optical signals using an optical device that has a reflective geometry. For example, the optical device may include a diffraction grating on a curved surface, such as an echelle grating. By imaging and diffracting the optical signals, the optical device may couple to the optical signals on different diffraction orders of the optical device (which have different carrier wavelengths) from input optical waveguides to corresponding output optical waveguides. Then, output power monitors may measure the output power levels of the optical signals, and control logic may provide wavelength control signals to optical sources that provide the optical signals based on measured output power levels.
摘要翻译： 光源监视器使用具有反射几何形状的光学装置对接收到的光信号进行成像和衍射。 例如，光学装置可以包括弯曲表面上的衍射光栅，例如梯形光栅。 通过成像和衍射光学信号，光学器件可以将光学器件（其具有不同的载波波长）的不同衍射级与输入光波导耦合到相应的输出光波导上的光信号。 然后，输出功率监视器可以测量光信号的输出功率电平，并且控制逻辑可以向根据测量的输出功率电平提供光信号的光源提供波长控制信号。
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94.发明申请公开(公告)号：US20130265624A1
公开(公告)日：2013-10-10
申请号：US13440839
申请日：2012-04-05
IPC分类号： G02B6/122
CPC分类号： G02B6/122 , G02B6/4204 , G03H1/0248 , G03H2001/0434 , G03H2223/16 , G03H2270/54
摘要： An integrated circuit includes a holographic recording material substantially filling a cavity in a semiconductor layer. During operation of the integrated circuit, a holographic pattern in the holographic recording is reconstructed and used to diffract an optical signal propagating in a plane of an optical waveguide, which is defined in the semiconductor layer out of the plane through the cavity. In this way, the holographic recording material may be used to couple the optical signal to an optical fiber or another integrated circuit.
摘要翻译： 集成电路包括基本上填充半导体层中的空腔的全息记录材料。 在集成电路的操作期间，全息记录中的全息图被重构并用于将在半导体层中定义的光波导的平面中传播的光信号衍射出通过空腔的平面。 以这种方式，全息记录材料可以用于将光信号耦合到光纤或另一集成电路。
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公开(公告)号：US08340479B2
公开(公告)日：2012-12-25
申请号：US12687633
申请日：2010-01-14
IPC分类号： G02B6/12
CPC分类号： G02B6/1228 , G02F1/2257
摘要： An integrated circuit that includes an optical waveguide to convey an optical signal via an optical mode in an on-chip optical waveguide is described. In this integrated circuit, a cross-sectional area of the optical waveguide may be tapered in proximity to an electro-optic modulator in the integrated circuit, such as a germanium electro-optic modulator or a quantum-well (QW) electro-optic modulator. In particular, the cross-sectional area may be tapered from a first diameter distal from the electro-optic modulator to a second diameter proximate to the electro-optic modulator. This so-called ‘inverse taper’ may increase the spatial extent or size of the optical mode, thereby allowing the optical signal to be optically coupled to or from the electro-optic modulator with low optical loss.
摘要翻译： 描述了一种集成电路，其包括用于在片上光波导中经由光学模式传送光信号的光波导。 在该集成电路中，光波导的横截面积可以在集成电路中的电光调制器附近逐渐变细，例如锗电光调制器或量子阱（QW）电光调制器 。 特别地，横截面积可以从远离电光调制器的第一直径逐渐变细到靠近电光调制器的第二直径。 这种所谓的反向锥度可以增加光学模式的空间范围或尺寸，从而允许光学信号光电耦合到或具有低光损耗的电光调制器。
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96.发明授权公开(公告)号：US08320761B2
公开(公告)日：2012-11-27
申请号：US11962426
申请日：2007-12-21
CPC分类号： G02B6/2804 , G02B6/29343 , G02B6/29352 , G02B6/43 , G02B2006/1215 , H04J14/0212 , H04Q2213/1301 , H04Q2213/13322
摘要： Embodiments of a bidirectional 3-way optical splitter are described. This bidirectional 3-way optical splitter includes an optical splitter having: a first external node, a second external node, a third external node, and a fourth external node. In one mode of operation, the optical splitter may be configured to receive an external input optical signal on the first external node and to provide external output optical signals on the other external nodes. Moreover, in another mode of operation, the optical splitter may be configured to receive the external input optical signal on the third external node and to provide the external output optical signals on the other external nodes.
摘要翻译： 描述双向3路光分路器的实施例。 这种双向3路光分路器包括具有：第一外部节点，第二外部节点，第三外部节点和第四外部节点的光分路器。 在一种操作模式中，光分路器可以被配置为在第一外部节点上接收外部输入光信号，并且在其它外部节点上提供外部输出光信号。 此外，在另一种操作模式中，光分路器可以被配置为在第三外部节点上接收外部输入光信号，并且在其它外部节点上提供外部输出光信号。
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公开(公告)号：US20120189025A1
公开(公告)日：2012-07-26
申请号：US12952838
申请日：2010-11-23
IPC分类号： H01S5/06
CPC分类号： H01S5/1071 , H01S5/021 , H01S5/02248 , H01S5/0261 , H01S5/0612 , H01S5/06255 , H01S5/1032 , H01S5/50
摘要： In a laser source, a first optical waveguide includes a gain medium, and a second optical waveguide includes a phase tuner which adjusts a phase value of the phase tuner to specify the wavelength of the laser source. Furthermore, the laser source includes a first ring resonator and a second ring resonator, which, respectively, are optically coupled to the first optical waveguide and the second optical waveguide at opposite ends of the laser source. In particular, coupling wavelengths of the first and second ring resonators may match a wavelength of the optical signal, thereby defining an optical resonance cavity in the laser source and selecting a laser mode of the laser source which is associated with the wavelength. Additionally, the laser source includes an optical amplifier that receives and amplifies the optical signal output from the optical resonance cavity.
摘要翻译： 在激光源中，第一光波导包括增益介质，第二光波导包括相位调谐器，其调节相位调谐器的相位值以指定激光源的波长。 此外，激光源包括第一环形谐振器和第二环形谐振器，其分别在激光源的相对端处光耦合到第一光波导和第二光波导。 特别地，第一和第二环形谐振器的耦合波长可以匹配光信号的波长，从而在激光源中限定光学谐振腔并选择与波长相关联的激光源的激光模式。 此外，激光源包括光放大器，其接收并放大从光谐振腔输出的光信号。
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公开(公告)号：US20110235962A1
公开(公告)日：2011-09-29
申请号：US12730774
申请日：2010-03-24
CPC分类号： G02B6/12007 , G02F1/0147 , G02F1/025 , G02F1/3132
摘要： An optical device with high thermal tuning efficiency is described. This optical device may be implemented using a tri-layer structure (silicon-on-insulator technology), including: a substrate, a buried-oxide layer and a semiconductor layer. In particular, a thermally tunable optical waveguide may be defined in the semiconductor layer. Furthermore, a portion of the substrate under the buried-oxide layer and substantially beneath a location of the thermally tunable optical waveguide is fabricated so that a portion of the buried-oxide layer is exposed. In this way, the thermal impedance between the thermally tunable optical waveguide and an external environment is increased, and power consumption associated with thermal tuning of the optical waveguide is reduced.
摘要翻译： 描述了具有高热调谐效率的光学装置。 该光学器件可以使用三层结构（绝缘体上硅技术）来实现，包括：衬底，掩埋氧化物层和半导体层。 特别地，热可调谐光波导可以限定在半导体层中。 此外，制造掩埋氧化物层下面的基板的一部分并且基本上位于热可调谐光波导的位置下方，使得一部分掩埋氧化物层露出。 以这种方式，热可调谐光波导和外部环境之间的热阻抗增加，并且降低与光波导的热调谐相关的功耗。
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公开(公告)号：US20110170819A1
公开(公告)日：2011-07-14
申请号：US12687633
申请日：2010-01-14
CPC分类号： G02B6/1228 , G02F1/2257
摘要： An integrated circuit that includes an optical waveguide to convey an optical signal via an optical mode in an on-chip optical waveguide is described. In this integrated circuit, a cross-sectional area of the optical waveguide may be tapered in proximity to an electro-optic modulator in the integrated circuit, such as a germanium electro-optic modulator or a quantum-well (QW) electro-optic modulator. In particular, the cross-sectional area may be tapered from a first diameter distal from the electro-optic modulator to a second diameter proximate to the electro-optic modulator. This so-called ‘inverse taper’ may increase the spatial extent or size of the optical mode, thereby allowing the optical signal to be optically coupled to or from the electro-optic modulator with low optical loss.
摘要翻译： 描述了一种集成电路，其包括在片上光波导中经由光学模式传送光信号的光波导。 在该集成电路中，光波导的横截面积可以在集成电路中的电光调制器附近逐渐变细，例如锗电光调制器或量子阱（QW）电光调制器 。 特别地，横截面积可以从远离电光调制器的第一直径逐渐变细到靠近电光调制器的第二直径。 这种所谓的“倒锥度”可以增加光学模式的空间范围或尺寸，从而允许光学信号以低光损耗光学耦合到电光调制器。
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公开(公告)号：US20110091157A1
公开(公告)日：2011-04-21
申请号：US12581709
申请日：2009-10-19
IPC分类号： G02B6/26
CPC分类号： G02B6/13 , G02B6/12002
摘要： A multi-chip module (MCM), which includes a three-dimensional (3D) stack of chips that are coupled using optical interconnects, is described. In this MCM, disposed on a first surface of a middle chip in the 3D stack, there are: a first optical coupler, an optical waveguide, which is coupled to the first optical coupler, and a second optical coupler, which is coupled to the optical waveguide. The first optical coupler redirects an optical signal from the optical waveguide to a first direction (which is not in the plane of the first surface), or from the first direction to the optical waveguide. Moreover, the second optical coupler redirects the optical signal from the optical waveguide to a second direction (which is not in the plane of the first surface), or from the second direction to the optical waveguide. Note that an optical path associated with the second direction passes through an opening in a substrate in the middle chip.
摘要翻译： 描述了包括使用光学互连耦合的三维（3D）芯片堆叠的多芯片模块（MCM）。 在该MCM中，设置在3D堆叠中的中间芯片的第一表面上，存在：耦合到第一光耦合器的第一光耦合器，光波导和耦合到第三光耦合器的第二光耦合器， 光波导。 第一光学耦合器将来自光波导的光信号重定向到第一方向（其不在第一表面的平面中）或从第一方向到光波导。 此外，第二光耦合器将来自光波导的光信号重定向到第二方向（其不在第一表面的平面）或从第二方向到光波导。 注意，与第二方向相关联的光路通过中间芯片中的衬底中的开口。
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