公开(公告)号：US20210376133A1

公开(公告)日：2021-12-02

申请号：US16887729

申请日：2020-05-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yi-Tse Hung ,  Chao-Ching Cheng ,  Tse-An Chen ,  Hung-Li Chiang ,  Tzu-Chiang Chen ,  Lain-Jong Li

IPC: H01L29/76 ,  H01L29/78 ,  H01L29/66

Abstract: A method includes: forming a dielectric fin protruding above a substrate; forming a channel layer over an upper surface of the dielectric fin and along first sidewalls of the dielectric fin, the channel layer including a low dimensional material; forming a gate structure over the channel layer; forming metal source/drain regions on opposing sides of the gate structure; forming a channel enhancement layer over the channel layer; and forming a passivation layer over the gate structure, the metal source/drain regions, and the channel enhancement layer.

公开(公告)号：US11183449B1

公开(公告)日：2021-11-23

申请号：US16881005

申请日：2020-05-22

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hung-Li Chiang ,  Chao-Ching Cheng ,  Tzu-Chiang Chen ,  Jin Cai ,  Yu-Sheng Chen

IPC: H01L23/50 ,  H01L21/82 ,  H01L23/44 ,  H01L23/367 ,  H01L23/427 ,  H01L23/433

Abstract: Cryogenic integrated circuits are provided. A cryogenic integrated circuit includes a thermally conductive base, a data processor, a storage device, a buffer device, a thermally conductive shield and a cooling pipe. The data processor is located on the thermally conductive base. The storage device is located on the thermally conductive base and disposed aside and electrically connected to the data processor. The buffer device is disposed on the data processor. The thermally conductive shield covers the data processor, the storage device and the buffer device. The cooling pipe is located in physical contact with the thermally conductive base and disposed at least corresponding to the data processor.

公开(公告)号：US11043578B2

公开(公告)日：2021-06-22

申请号：US16118143

申请日：2018-08-30

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tzu-Chung Wang ,  Chao-Ching Cheng ,  Tzu-Chiang Chen ,  Tung Ying Lee

IPC: H01L29/76 ,  H01L29/66 ,  H01L29/06 ,  H01L29/10 ,  H01L29/08 ,  H01L29/78 ,  H01L29/423 ,  H01L29/775 ,  H01L21/8238 ,  H01L21/02 ,  H01L21/8234

Abstract: The current disclosure describes techniques for forming a low resistance junction between a source/drain region and a nanowire channel region in a gate-all-around FET device. A semiconductor structure includes a substrate, multiple separate semiconductor nanowire strips vertically stacked over the substrate, a semiconductor epitaxy region adjacent to and laterally contacting each of the multiple separate semiconductor nanowire strips, a gate structure at least partially over the multiple separate semiconductor nanowire strips, and a dielectric structure laterally positioned between the semiconductor epitaxy region and the gate structure. The first dielectric structure has a hat-shaped profile.

公开(公告)号：US11043577B2

公开(公告)日：2021-06-22

申请号：US16657747

申请日：2019-10-18

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Chao-Ching Cheng ,  Yu-Lin Yang ,  Wei-Sheng Yun ,  Chen-Feng Hsu ,  Tzu-Chiang Chen

IPC: H01L29/66 ,  H01L29/06 ,  H01L29/423 ,  H01L29/786 ,  H01L21/02 ,  H01L21/306 ,  H01L29/04 ,  H01L29/775 ,  H01L29/08 ,  B82Y10/00

Abstract: A semiconductor device and a method of manufacturing the same are disclosed. The semiconductor device includes semiconductor wires disposed over a substrate, a source/drain epitaxial layer in contact with the semiconductor wires, a gate dielectric layer disposed on and wrapping around each channel region of the semiconductor wires, a gate electrode layer disposed on the gate dielectric layer and wrapping around the each channel region, and dielectric spacers disposed in recesses formed toward the source/drain epitaxial layer.

公开(公告)号：US11004965B2

公开(公告)日：2021-05-11

申请号：US16573892

申请日：2019-09-17

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chao-Ching Cheng ,  Hung-Li Chiang ,  Chun-Chieh Lu ,  Ming-Yang Li ,  Tzu-Chiang Chen

IPC: H01L29/76 ,  H01L29/78 ,  H01L29/04 ,  H01L29/66 ,  H01L29/20 ,  H01L29/45

Abstract: A process is provided to fabricate a finFET device having a semiconductor layer of a two-dimensional “2D” semiconductor material. The semiconductor layer of the 2D semiconductor material is a thin film layer formed over a dielectric fin-shaped structure. The 2D semiconductor layer extends over at least three surfaces of the dielectric fin structure, e.g., the upper surface and two sidewall surfaces. A vertical protrusion metal structure, referred to as “metal fin structure”, is formed about an edge of the dielectric fin structure and is used as a seed to grow the 2D semiconductor material.

公开(公告)号：US10998429B2

公开(公告)日：2021-05-04

申请号：US16585278

申请日：2019-09-27

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Chao-Ching Cheng ,  Hung-Li Chiang ,  Tzu-Chiang Chen ,  I-Sheng Chen

IPC: H01L29/66 ,  H01L29/08 ,  H01L21/311 ,  H01L21/02 ,  H01L29/165 ,  H01L29/06 ,  H01L27/088 ,  H01L29/423 ,  H01L21/308 ,  H01L21/265 ,  H01L29/10

Abstract: In a method of manufacturing a semiconductor device, a fin structure, in which first semiconductor layers and second semiconductor layers are alternately stacked, is formed over a bottom fin structure. A sacrificial gate structure having sidewall spacers is formed over the fin structure. A source/drain region of the fin structure, which is not covered by the sacrificial gate structure, is removed. The second semiconductor layers are laterally recessed. Dielectric inner spacers are formed on lateral ends of the recessed second semiconductor layers. The first semiconductor layers are laterally recessed. A source/drain epitaxial layer is formed to contact lateral ends of the recessed first semiconductor layer. The second semiconductor layers are removed thereby releasing the first semiconductor layers in a channel region. A gate structure is formed around the first semiconductor layers.

公开(公告)号：US10886182B2

公开(公告)日：2021-01-05

申请号：US16427802

申请日：2019-05-31

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Chao-Ching Cheng ,  I-Sheng Chen ,  Hung-Li Chiang ,  Tzu-Chiang Chen

IPC: H01L21/8238 ,  H01L27/092 ,  H01L29/06 ,  H01L29/423 ,  H01L29/786 ,  H01L21/02 ,  H01L21/311 ,  H01L29/66

Abstract: In a method of manufacturing a semiconductor device, a fin structure, in which first semiconductor layers containing Ge and second semiconductor layers are alternately stacked, is formed over a bottom fin structure. A Ge concentration in the first semiconductor layers is increased. A sacrificial gate structure is formed over the fin structure. A source/drain epitaxial layer is formed over a source/drain region of the fin structure. The sacrificial gate structure is removed. The second semiconductor layers in a channel region are removed, thereby releasing the first semiconductor layers in which the Ge concentration is increased. A gate structure is formed around the first semiconductor layers in which the Ge concentration is increased.

公开(公告)号：US20200343446A1

公开(公告)日：2020-10-29

申请号：US16394177

申请日：2019-04-25

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hung-Li Chiang ,  Chao-Ching Cheng ,  Tzu-Chiang Chen ,  Yu-Sheng Chen

IPC: H01L45/00 ,  H01L27/24

Abstract: Various embodiments of the present disclosure are directed towards a resistive random access memory (RRAM) device including a scavenger layer. A bit line overlying a semiconductor substrate. A data storage layer around outer sidewalls and a top surface of the bit line. A word line overlying the data storage layer. A scavenger layer between the word line and the bit line such that a bottom surface of the scavenger layer is aligned with a bottom surface of the bit line. A lateral thickness of the scavenger layer is less than a vertical thickness of the scavenger layer.

公开(公告)号：US10804367B2

公开(公告)日：2020-10-13

申请号：US15719686

申请日：2017-09-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chao-Ching Cheng ,  Wei-Sheng Yun ,  I-Sheng Chen ,  Shao-Ming Yu ,  Tzu-Chiang Chen ,  Chih Chieh Yeh

IPC: H01L29/165 ,  H01L21/8236 ,  H01L27/092 ,  H01L29/51 ,  H01L29/66 ,  H01L29/10 ,  H01L27/06 ,  H01L29/06 ,  H01L21/8238 ,  H01L29/775 ,  H01L29/40

Abstract: A semiconductor device includes a substrate; an I/O device over the substrate; and a core device over the substrate. The I/O device includes a first gate structure having an interfacial layer; a first high-k dielectric stack over the interfacial layer; and a conductive layer over and in physical contact with the first high-k dielectric stack. The core device includes a second gate structure having the interfacial layer; a second high-k dielectric stack over the interfacial layer; and the conductive layer over and in physical contact with the second high-k dielectric stack. The first high-k dielectric stack includes the second high-k dielectric stack and a third dielectric layer.

公开(公告)号：US20190393357A1

公开(公告)日：2019-12-26

申请号：US16235987

申请日：2018-12-28

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： I-Sheng Chen ,  Chao-Ching Cheng ,  Tzu-Chiang Chen ,  Carlos H. Diaz

IPC: H01L29/786 ,  H01L29/423 ,  H01L29/66 ,  H01L29/06

Abstract: A nanowire FET device includes a vertical stack of nanowire strips configured as the semiconductor body. One or more of the top nanowire strips are receded and are shorter than the rest of the nanowire strips stacked lower. Inner spacers are uniformly formed adjacent to the receded nanowire strips and the rest of the nanowire strips. Source/drain structures are formed outside the inner spacers and a gate structure is formed inside the inner spacers, which wraps around the nanowire strips.