Optical memory device and apparatus for manufacturing the same
    91.
    发明授权
    Optical memory device and apparatus for manufacturing the same 失效
    光存储装置及其制造装置

    公开(公告)号:US5077725A

    公开(公告)日:1991-12-31

    申请号:US374071

    申请日:1989-06-30

    IPC分类号: G11B7/26

    摘要: An apparatus for manufacturing an optical memory device, which comprises supplying rolls for continuously supplying a sheet-like substrate, a masking endless belt having a plurality of windows of size corresponding to the optical memory device, rolls for moving the sheet-like substrate and the masking endless belt in the same direction and at the same speed, a recording portion forming device for forming recording portions on the substrate through the masking endless belt, a guide truck providing device for providing along the substrate guide trucks for guiding a light beam, and a cutting device for cutting the substrate to a predetermined size.

    摘要翻译: 一种用于制造光学存储器件的设备,其包括供应用于连续供应片状衬底的辊,具有与光学存储器件相对应的尺寸的多个窗口的掩模环形带,用于移动片状衬底的辊和 在相同的方向和相同的速度下掩蔽环形带,用于通过掩模环形带在基板上形成记录部分的记录部分形成装置,用于沿着基板引导卡车提供用于引导光束的引导卡车提供装置,以及 用于将基板切割成预定尺寸的切割装置。

    Thermal printing head manufacturing method
    92.
    发明授权
    Thermal printing head manufacturing method 失效
    热敏打印头制造方法

    公开(公告)号:US5036897A

    公开(公告)日:1991-08-06

    申请号:US567063

    申请日:1990-08-14

    IPC分类号: B41J2/335 B41J2/345

    摘要: A method of manufacturing a thermal printing head includes forming a layer of polyimide resin precursor on a heat-resistant resin substrate on which two parallel common electrodes and a large number of lead electrodes are formed beforehand in such a manner that the lead electrodes are separated from the common electrodes by a predetermined distance and are disposed on one side of the common electrodes in a vertical direction. It further includes performing a first etching on the layer of polyimide resin precursor such that a predetermined pattern is formed. Heat treatment is then performed on the layer of polyimide resin precursor to simultaneously form, between the lead electrodes and the common electrode disposed close to the lead electrodes, a polyimide resin heat accumulating layer as a base for a heating resistor as well as a polyimide resin insulating layer capable of electrically insulating a jumper wire connecting the common electrode disposed remote from the lead electrodes to the heating resistor on the common electrode disposed close to the lead electrodes. The heating resistor is then formed on the polyimide resin heat accumulating layer. Finally, a wire connecting the heating resistor to the two common electrodes and to the plurality of lead electrodes is formed.