公开(公告)号：US10274307B2

公开(公告)日：2019-04-30

申请号：US15558016

申请日：2016-02-17

申请人： TORAY ENGINEERING CO., LTD.

发明人： Katsuichi Kitagawa ,  Masafumi Otsuki

IPC分类号： G01B11/06

摘要： A film thickness measurement device includes a light source, an imaging component, and a controller. The controller estimates unknown variables I1(j), I20(j), k(j), and t(i) based on the Formula (1), where i represents an observation point number of an interference image captured by the imaging component, j represents a number for a type of wavelength of monochromatic light, λ(j) represents wavelength of the monochromatic light, n represents a refractive index of a semi-transparent film, g(i,j) represents a brightness value observed at an observation point, I1(j) represents an intensity of reflected light from a front face of the semi-transparent film, I20(j) represents an intensity of reflected light from a rear face of the semi-transparent film when there is no absorption of light in the semi-transparent film, k(j) represents an absorption coefficient of the semi-transparent film, and t(i) represents a film thickness of the semi-transparent film.

公开(公告)号：US10199349B2

公开(公告)日：2019-02-05

申请号：US15546553

申请日：2016-02-02

申请人： TORAY ENGINEERING CO., LTD.

发明人： Katsumi Terada

IPC分类号： H01L23/00 ,  H01L21/683 ,  H01L25/065 ,  H01L25/00

摘要： A mounting device includes a thermocompression bonding head, a pressure reduction mechanism, and a resin sheet feed mechanism. The thermocompression bonding head is configured to heat a semiconductor chip while holding the semiconductor chip and to bond the semiconductor chip to a joined piece by compression. The thermocompression bonding head has a suction hole in a face that holds the semiconductor chip. The pressure reduction mechanism communicates with the suction hole and is configured to reduce pressure inside the suction hole. The resin sheet feed mechanism is configured to supply a resin sheet between the thermocompression bonding head and the semiconductor chip. An electrode that protrudes from a top face of the semiconductor chip is bonded by thermocompression after being embedded in the resin sheet.

公开(公告)号：US08875651B2

公开(公告)日：2014-11-04

申请号：US13381322

申请日：2010-06-25

申请人： Atsushi Watanabe

发明人： Atsushi Watanabe

IPC分类号： B05C3/12 ,  B05C13/02 ,  H01M4/04 ,  B05C9/04 ,  B65H23/022 ,  B65H23/032 ,  B65H23/038 ,  H01M4/88 ,  B05C5/02

CPC分类号： H01M4/0404 ,  B05C5/0254 ,  B05C9/04 ,  B05D2252/02 ,  B05D2252/10 ,  B65H23/022 ,  B65H23/0324 ,  B65H23/038 ,  H01M4/8828 ,  Y02E60/50

摘要： A double-sided coated substrate transport device (1) is described. A die head for front face coating (3) and a die head for back face coating (4) coat a coating liquid onto a substrate 1. A drying oven (5) dries the coating liquid applied to the substrate (1), to form coating films on the front and back faces of the substrate (1). A first and second rotating body unit (20A, 20B) are respectively furnished independently at widthwise edge sections of the substrate (1). Each of the first and second rotating body units has a free roller (21) and a drive roller (22) constituting a pair of rotating bodies, and a rotating body swivel section (23). The free roller (21) and the drive roller (22) grip the widthwise edge sections of the substrate (1) from the front and back sides. The rotating body swivel section (23) allows the orientation of the free roller (21) and the drive roller (22), respectively, to be modified separately for the first rotating body unit (20A) and the second rotating body unit (20B), so that the rotation axis of the free roller (21) and the drive roller (22) is inclined towards the downstream side in the substrate transport direction as seen from the outside in the substrate widthwise direction, with respect to a line perpendicular to the substrate transport direction.

摘要翻译： 对双面涂布基板输送装置（1）进行说明。 用于前面涂层的模头（3）和用于背面涂层的模头（4）将涂布液涂覆到基材1上。干燥箱（5）将施加到基材（1）上的涂布液干燥，形成 在基板（1）的前表面和背面上涂覆膜。 第一和第二旋转体单元（20A，20B）分别独立地设置在基板（1）的宽度方向的边缘部分。 第一和第二旋转体单元中的每一个具有构成一对旋转体的自由辊（21）和驱动辊（22），以及旋转体旋转部（23）。 自由辊（21）和驱动辊（22）从前侧和后侧夹紧基板（1）的宽度方向的边缘部分。 旋转体旋转部（23）能够分别对第一旋转体单元（20A）和第二旋转体单元（20B）分别改变自由辊（21）和驱动辊（22）的取向， 使得自由辊（21）和驱动辊（22）的旋转轴线在从基板宽度方向的外侧观察到的基板输送方向上的下游侧相对于垂直于基板横向的线倾斜 基材输送方向。

公开(公告)号：US20120267809A1

公开(公告)日：2012-10-25

申请号：US13393598

申请日：2010-08-24

申请人： Yoshitaka Shimizu ,  Yuichiro Satoh ,  Yasuhiko Mibe ,  Masakazu Kuroda ,  Yuichiro Tsuda

发明人： Yoshitaka Shimizu ,  Yuichiro Satoh ,  Yasuhiko Mibe ,  Masakazu Kuroda ,  Yuichiro Tsuda

IPC分类号： B01J13/02 ,  B01J13/20

CPC分类号： B01J13/04 ,  A61K9/1277

摘要： Disclosed are: an apparatus which enables the easy production of liposomes having uniform particle diameters; and others. Specifically disclosed is a liposome production apparatus comprising: a microtube having a flow path through which a lipid-dissolved solution comprising at least one lipid, water and a water-miscible organic solvent can pass; a housing section in which the microtube is accommodated; and a cooling means for cooling the dissolved solution contained in the microtube in the housing section to a temperature at which liposomes can be produced. The apparatus enables the production of liposomes having uniform particle diameters.

摘要翻译： 公开了一种能够容易地生产具有均匀粒径的脂质体的装置; 和别的。 具体公开了一种脂质体生产装置，其包括：具有流路的微管，通过该流路使含有至少一种脂质，水和水混溶性有机溶剂的脂质溶解溶液能通过; 容纳微管的容纳部; 以及冷却装置，用于将包含在壳体部分中的微管中的溶解溶液冷却至可以生产脂质体的温度。 该装置能够生产具有均匀粒径的脂质体。

公开(公告)号：US07930940B2

公开(公告)日：2011-04-26

申请号：US12007767

申请日：2008-01-15

申请人： Akira Onodera ,  Yasunori Aoyama

发明人： Akira Onodera ,  Yasunori Aoyama

IPC分类号： G01N29/00

CPC分类号： G01N29/28 ,  G01N29/043 ,  G01N29/223 ,  G01N29/34 ,  G01N2291/044 ,  G01N2291/101

摘要： An ultrasonic transducer incorporated into an ultrasonic inspection apparatus for examining existence of defect in a sample dipped in water comprises a transducer main part having an oscillator which projects an ultrasonic wave to the sample, receives the reflected wave from the sample and outputs the received reflected wave as an echo signal, a transmitter substrate producing a drive pulse for emitting the ultrasonic wave to the oscillator, a receiver substrate for amplifying the echo signal, a housing for containing therein both substrates electrically connected, and connecting member for electrically connecting between a signal input/output terminal and the side of the oscillator in the transducer main part, wherein, when a maximum operational frequency of the ultrasonic wave emitted from the oscillator is referred to as fmax [MHz], the connecting member is set at a length of 100/fmax [cm] or less. Even if the sample to be examined is small, a desirable defect inspection can be achieved at an excellent examination accuracy.

摘要翻译： 包含在超声波检查装置中的用于检查浸入水中的样品中存在缺陷的超声波换能器包括具有将超声波投射到样品的振荡器的换能器主体，从样品接收反射波并输出接收到的反射波 作为回波信号，产生用于向振荡器发射超声波的驱动脉冲的发射器基板，用于放大回波信号的接收器基板，用于容纳其中两个基板电连接的壳体和用于电连接信号输入 /输出端子和振荡器主体中的振荡器侧，其中当从振荡器发射的超声波的最大工作频率被称为fmax [MHz]时，连接构件被设置为100 / fmax [cm]以下。 即使被检查样本小，也可以以良好的检查精度实现期望的缺陷检查。

公开(公告)号：US07591293B2

公开(公告)日：2009-09-22

申请号：US10528690

申请日：2003-09-22

申请人： Tadatomo Suga ,  Toshihiro Ito ,  Akira Yamauchi

发明人： Tadatomo Suga ,  Toshihiro Ito ,  Akira Yamauchi

IPC分类号： G05G15/00 ,  B23K1/14 ,  B23K26/00

CPC分类号： H01L24/81 ,  H01L2224/13144 ,  H01L2224/75 ,  H01L2224/7501 ,  H01L2224/751 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/49144 ,  Y10T29/49908 ,  Y10T29/49924 ,  Y10T29/5313 ,  Y10T29/53174 ,  H01L2224/0401

摘要： A device and method for bonding objects to be bonded each having a metal bonding portion on a substrate, comprising cleaning means for exposing the metal bonding portions to a plasma having an energy enough to etch the surfaces of the metal bonding portions at a depth of 1.6 nm or more over the entire surfaces of the metal bonding portions under a reduced pressure and bonding means for bonding the metal bonding portions of the objects taken out of the cleaning means in an atmospheric air. By using a specific scheme, metal bonding portions after the plasma cleaning can be bonded in the atmospheric air, thereby significantly simplifying the bonding process and the whole device and lowering the cost.

摘要翻译： 一种用于将每个具有金属接合部分的要被接合的物体接合在基板上的装置和方法，包括用于将金属接合部分暴露于等离子体的清洁装置，该等离子体具有足以在深度1.6刻蚀金属接合部分的表面的能量 在减压下的金属接合部的整个表面上的nm以上的粘合装置和用于将从清洁装置中取出的物体的金属接合部分接合在大气中的接合装置。 通过使用具体的方案，等离子体清洗后的金属接合部分可以粘结在大气中，从而大大简化了接合工艺和整个器件，降低了成本。

公开(公告)号：US07267926B2

公开(公告)日：2007-09-11

申请号：US10204308

申请日：2001-02-20

申请人： Hiroaki Tsuruta ,  Minoru Nakamura ,  Masanori Akita ,  Koji Ito ,  Toshihiro Mori

发明人： Hiroaki Tsuruta ,  Minoru Nakamura ,  Masanori Akita ,  Koji Ito ,  Toshihiro Mori

IPC分类号： G03F7/26

CPC分类号： G06K19/0775 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07783 ,  H05K1/095 ,  Y10T428/24835

摘要： There are disclosed; an active energy beam curing type conductive paste, containing a conductive substance, and an active energy beam polymerizable compound, wherein a cured matter, obtained when a composition of the paste excluding the conductive substance is cured with an electron beam having an acceleration voltage of 150 kV and an irradiated dose of 40 kGy, has an internal stress of 5 to 50 Mpa; a production method and a device for a conductor circuit substrate using the active energy beam curing type conductive paste; and a non-contact ID using the active energy beam curing type conductive paste and a production method for the ID.

摘要翻译： 有披露; 含有导电物质的活性能量束固化型导电膏和活性能量束聚合性化合物，其中当除了导电物质之外的糊料的组合物用加速电压为150的电子束固化时获得的固化物 kV，照射剂量为40kGy，内应力为5〜50Mpa; 使用活性能量束固化型导电浆料的导体电路基板的制造方法和装置; 以及使用活性能量束固化型导电糊的非接触ID和ID的制造方法。

公开(公告)号：US20060054283A1

公开(公告)日：2006-03-16

申请号：US10528837

申请日：2003-09-25

申请人： Akira Yamauchi

发明人： Akira Yamauchi

IPC分类号： B32B37/00

CPC分类号： H01L24/81 ,  H01L24/75 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/751 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/7565 ,  H01L2224/75753 ,  H01L2224/81009 ,  H01L2224/81013 ,  H01L2224/81054 ,  H01L2224/81121 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/00014 ,  H01L2924/00

摘要： A bonding apparatus comprising a cleaning chamber; cleaning means for irradiating energy waves to bonding surfaces in the cleaning chamber under a reduced pressure condition; bonding means for bonding metal bonding portions of objects to be bonded in an atmospheric air which have been taken out from the cleaning chamber; and carrying means for, with respect to at least one member of the objects to be bonded, carrying a foregoing object and an ensuing object substantially simultaneously in at least the carrying-in direction to the cleaning chamber and the carrying-out direction from the cleaning chamber. At the time of taking out the objects after cleaning into an atmospheric air and bonding them to each other, the carrying in, carrying out and delivery of objects to be bonded especially around the cleaning chamber can be performed smoothly within a short period of time, and mass production of desired bonded products can be realized at high throughput. As a result, it becomes possible to shorten the tact time through the entire bonding process and to reduce the cost required for the bonding process.

摘要翻译： 一种粘合装置，包括清洁室; 用于在减压条件下将能量波照射到清洁室中的粘合表面的清洁装置; 用于将已经从清洗室中取出的大气中的待接合物体的金属接合部分接合的接合装置; 以及用于相对于待粘合物体的至少一个构件承载上述物体和随后的物体的承载装置，所述物体和随后的物体至少沿着清洁室的携带方向和从清洁器的排出方向 房间。 在清洁成大气并将它们彼此接合之后取出物体时，可以在短时间内平稳地执行特别是在清洁室周围的进入，输送和输送物体， 并且可以以高产量实现期望的粘合产品的大量生产。 结果，可以通过整个接合处理来缩短节拍时间并且降低接合处理所需的成本。

公开(公告)号：US06961994B2

公开(公告)日：2005-11-08

申请号：US10221142

申请日：2001-03-08

申请人： Katsumi Terada ,  Akira Yamauchi

发明人： Katsumi Terada ,  Akira Yamauchi

IPC分类号： H01L21/52 ,  H05K13/04 ,  H05K13/08 ,  H05K3/30

CPC分类号： H05K13/08 ,  H05K13/0413 ,  H05K13/089 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/53087 ,  Y10T29/53174 ,  Y10T29/53178

摘要： A mounting device including a plurality of heads, each holding a chip, arranged on a circle, is used to realize accurate and high-speed mounting. A mounting device comprises a plurality of heads with calibration marks, first recognition mechanism fixed in a chip mounting position, and second recognition mechanism fixed in another position. Prior to mounting operation, the first recognition mechanism and the second recognition mechanism recognize and store the positions of the calibration marks of the heads. In mounting operation, the first recognition mechanism recognizes the positions of a substrate and the calibration marks of the heads, whereas the second recognition mechanism recognizes the positions of chips attracted on the heads. The heads are moved vertically to adjust plane to be recognized. The chip and the substrate are aligned according to the position information obtained by the recognition mechanisms, and the chips are mounted.

摘要翻译： 使用包括设置在圆周上的多个头部的安装装置来实现准确和高速的安装。 安装装置包括具有校准标记的多个头部，固定在芯片安装位置的第一识别机构和固定在另一位置的第二识别机构。 在安装操作之前，第一识别机构和第二识别机构识别和存储头部的校准标记的位置。 在安装操作中，第一识别机构识别基板的位置和头的校准标记，而第二识别机构识别吸头头部的位置。 头垂直移动以调整平面以被识别。 芯片和基板根据识别机构获得的位置信息进行对准，并安装芯片。

公开(公告)号：US5839265A

公开(公告)日：1998-11-24

申请号：US865099

申请日：1997-05-29

申请人： Jun Takagi ,  Misao Kashiwagi ,  Nobuhiro Koizumi

发明人： Jun Takagi ,  Misao Kashiwagi ,  Nobuhiro Koizumi

IPC分类号： D02G1/02 ,  D02J13/00 ,  D01H7/46

CPC分类号： D02J13/00 ,  D02G1/0266

摘要： A cooling device for a false twisting machine having a fixed wall member 16 and movable wall members 18a and 18b which have faced side surfaces between which yarn treatment passageways 19a and 19b are formed. The facing side surfaces are formed with yarn contacting portions 16a1 and 16b1 and 18a-1 and 18b-1, which are spaced along the direction of the running of the yarn in the yarn treatment passageways. The arrangement of the yarn contacting portions are such that contact with the yarn occurs alternately between the fixed wall member 16 and movable wall members 18a and 18b. A sucking duct 14 is opened to the yarn treatment passageways 19a and 19b to generate flows of fluid transverse to the running direction of the yarn in the passageways 19a and 19b.

摘要翻译： 一种用于假捻机的冷却装置，其具有固定壁构件16和可动壁构件18a和18b，所述固定壁构件16和可动壁构件18a和18b面对着形成有纱线处理通道19a和19b的侧面。 相对的侧面形成有纱线接触部分16a1和16b1和18a-1和18b-1，其沿着纱线处理通道中纱线的行进方向间隔开。 纱线接触部分的布置使得与纱线的接触交替地在固定壁构件16和可动壁构件18a和18b之间发生。 吸管14向纱线处理通道19a和19b打开，以产生横向于通道19a和19b中纱线行进方向的流体流动。