摘要:
The invention concerns a technique for routing an optical fiber through a bend so that it can traverse a hinge or other mechanical connector having a bend radius smaller than the minimum bend radius of the fiber. Particularly, the radius of curvature of an optical fiber traversing a bend can be maximized by routing the fiber so as to have a route component parallel to the axis about which the fiber must bend. For instance, in a hinged connection in which the optical fiber must bend around the axis of the hinge, the optical fiber may be routed over the arc around the hinge with a route component parallel to the axis of the hinge.
摘要:
An integrated circuit (IC) package is disclosed comprising a substrate including a plurality of substrate contacts; a semiconductor die including a plurality of die contacts; and a plurality of conductors for providing direct connections between substrate contacts and die contacts, respectively. By having the conductors directly route the connections between the die contacts and substrate contacts, many improvements may be realized including, but not limited to, improved package routing capabilities, reduced die and/or package size, improved package reliability, improved current handling capacity, improved speed, improved thermal performance, and lower costs.
摘要:
An interconnect element incorporates a plurality of smaller, substantially identical, interconnect modules. Multiple identical elements can in turn be combined to form larger interconnect networks. Signal paths in the elements can be implemented with optical fibers or electrical conductors.
摘要:
The invention provides an optical connector for connecting a user circuit to an optical backplane, in use the connector being adapted for mounting on a user circuit. The connector comprises an active or passive photonic interface through which optical signals may be transmitted and received between a user circuit and a said optical backplane. The connector further is comprised of a primary aligner for engagement with a corresponding aligner on a backplane to ensure alignment of the optical interface with the backplane, and a support for supporting the aligner and/or the optical interface on the connector. The support is selected to enable relative movement between a user circuit to which the connector is connected in use and the aligner and/or the optical interface. The support is preferably a flexible printed circuit board.
摘要:
An optical printed circuit board having an optical waveguide of at least one channel formed therein is provided. The optical waveguide of the at least one channel is stacked in the optical printed circuit board, and has both ends exposed on a surface of the optical printed circuit board and a predetermined length. An optical module is provided which can be optically aligned with the optical printed circuit board or another optical component through guide pins inserted into guide holes.
摘要:
A flexible optical fiber tape is formed from a substrate in the form of a strip adapted to maintain at least one optical fiber. The substrate may include an adhesive layer on at least one side for securing the tape to an external surface such as an interior floor, wall or ceiling. The tape may also have a flame-retardant characteristic. The optical fiber can run substantially longitudinally along the substrate, or can have one or more curved sections that allow for bending the tape without a substantially bending the at least one optical fiber. The tape may also include one or more network access points (NAPs) adapted to allow for optical communication between at least one external optical fiber and the at least one optical fiber maintained by the substrate. A distribution cable based on the optical-fiber-based tape is also described.
摘要:
A method for passive alignment of adapters, enabling high-precision connection between components on a rigid or flexible substrate as part of a printed circuit board (PCB) is provided. Removable alignment structures are positioned in an alignment area on a PCB, where the alignment structures are in accordance with a patterned layer. An adapter, having adapter mating pins or holes, respectively, and adapter alignment pins, is placed on the PCB in the alignment area such that the adapter is aligned with the alignment structures. The adapter alignment pins are inserted into holes in the alignment structures. A ferrule is fixed on the PCB in the alignment area, and the ferrule holes or pins, respectively, are aligned to mate with the adapter mating pins or holes, respectively. The adapter is removed from the alignment structures, and finally the alignment structures are removed.
摘要:
A fabrication method for an optical transmission channel board includes a first step of forming on a substrate a layer containing an electrically conductive material, and a second step of patterning said layer containing an electrically conductive material formed on said substrate, and thereby forming circuit patterns at least a part of which is used as an electric circuit and at least a part of which positionally regulates an optical transmission channel.
摘要:
An optical transmission board is provided. The optical transmission board includes an optical transmission channel, a retention board for retaining the optical transmission channel and circuit patterns. The circuit patterns are formed on the retention board and a part of the circuit patterns is used as an electric circuit. The optical transmission channel is positionally regulated by the part of the circuit patterns.
摘要:
A multi-layer optical circuit has a plurality of optical circuit layers. Each optical circuit layer is positioned on a corresponding one of a plurality of substrates. An optical fiber extends between at least two of the optical circuit layers and forms a portion of the at least two of the plurality of optical circuit layers.