公开(公告)号：US07982305B1

公开(公告)日：2011-07-19

申请号：US12254535

申请日：2008-10-20

申请人： Tarak A. Railkar ,  Steven D. Cate

发明人： Tarak A. Railkar ,  Steven D. Cate

IPC分类号： H01L23/04

CPC分类号： H01L23/3128 ,  G02B6/3608 ,  G02B6/43 ,  H01L23/49833 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/00015 ,  H01L2924/01031 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0401

摘要： An integrated circuit (IC) package is disclosed comprising a substrate including a plurality of substrate contacts; a semiconductor die including a plurality of die contacts; and a plurality of conductors for providing direct connections between substrate contacts and die contacts, respectively. By having the conductors directly route the connections between the die contacts and substrate contacts, many improvements may be realized including, but not limited to, improved package routing capabilities, reduced die and/or package size, improved package reliability, improved current handling capacity, improved speed, improved thermal performance, and lower costs.

摘要翻译： 公开了一种集成电路（IC）封装，其包括：包括多个基板触点的基板; 包括多个管芯接触件的半导体管芯; 以及多个导体，用于分别提供衬底触头和裸片触点之间的直接连接。 通过使导体直接将芯片触点和基板触点之间的连接路由，可以实现许多改进，包括但不限于改进的封装布线能力，减小的裸片和/或封装尺寸，改进的封装可靠性，改进的电流处理能力， 提高速度，改善散热性能，降低成本。

公开(公告)号：US08921995B1

公开(公告)日：2014-12-30

申请号：US13183691

申请日：2011-07-15

申请人： Tarak A. Railkar ,  Steven D. Cate

发明人： Tarak A. Railkar ,  Steven D. Cate

IPC分类号： H01L23/04

CPC分类号： H01L23/3128 ,  G02B6/3608 ,  G02B6/43 ,  H01L23/49833 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/00015 ,  H01L2924/01031 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0401

摘要： An integrated circuit (IC) package is disclosed comprising a substrate including a plurality of substrate contacts; a semiconductor die including a plurality of die contacts; and a plurality of conductors for providing direct connections between substrate contacts and die contacts, respectively. By having the conductors directly route the connections between the die contacts and substrate contacts, many improvements may be realized including, but not limited to, improved package routing capabilities, reduced die and/or package size, improved package reliability, improved current handling capacity, improved speed, improved thermal performance, and lower costs.

摘要翻译： 公开了一种集成电路（IC）封装，其包括：包括多个基板触点的基板; 包括多个管芯接触件的半导体管芯; 以及多个导体，用于分别提供衬底触头和裸片触点之间的直接连接。 通过使导体直接将芯片触点和基板触点之间的连接路由，可以实现许多改进，包括但不限于改进的封装布线能力，减小的裸片和/或封装尺寸，改进的封装可靠性，改进的电流处理能力， 提高速度，改善散热性能，降低成本。

公开(公告)号：US08097963B1

公开(公告)日：2012-01-17

申请号：US12431694

申请日：2009-04-28

申请人： Steven D. Cate ,  Ajay K. Ghai ,  Tarak A. Railkar

发明人： Steven D. Cate ,  Ajay K. Ghai ,  Tarak A. Railkar

IPC分类号： H01L29/40

CPC分类号： H01L23/49816 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48229 ,  H01L2224/49175 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An IC package including one or more z-axis interconnects for performing at least in part the fan-in/fan out interconnection for electrically coupling contacts of semiconductor die to external contacts of the package. The z-axis interconnect comprises a matrix of electrically conducting elements extending from the top to the bottom surface of the interconnect. Each conductive element is internally insulated from other conductive elements of the matrix. The semiconductor contacts may be electrically coupled to separate portions of the matrix by way of electrical connections to the top of the z-axis interconnect. Similarly, the external contacts of the package may be electrically coupled to the same separate portions of the matrix by way electrical connections to the bottom of the interconnect. The z-axis interconnect improves the miniaturization, integration, thermal and electrical performance of IC packages. The z-axis interconnect need not be limited to IC package applications, but may be used to electrically interconnect other configurations.

摘要翻译： 一种IC封装，包括一个或多个z轴互连，用于至少部分地执行扇形/扇出互连，以将半导体管芯的触点电耦合到封装的外部触点。 z轴互连包括从互连的顶部到底部表面延伸的导电元件的矩阵。 每个导电元件与基体的其它导电元件内部绝缘。 半导体触点可以通过与z轴互连的顶部的电连接而电耦合到矩阵的分离部分。 类似地，封装的外部触点可以通过电连接到互连的底部而电耦合到矩阵的相同的分开的部分。 z轴互连改善了IC封装的小型化，集成化，热和电性能。 z轴互连不限于IC封装应用，而可用于电连接其他配置。

公开(公告)号：US20120003794A1

公开(公告)日：2012-01-05

申请号：US13230208

申请日：2011-09-12

申请人： Tarak A. Railkar ,  Steven D. Cate

发明人： Tarak A. Railkar ,  Steven D. Cate

IPC分类号： H01L21/50

CPC分类号： H01L23/4334 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed are systems and methods for improving the thermal performance of integrated circuit packages. Aspects of the present invention include improved thermal package structures and methods for producing the same through the application of one or more thermal spreaders in the package. In embodiments, a thermal spreader is incorporated in a semiconductor chip package between a semiconductor die and its die pad. By including a thermal spreader in an IC package, the package can handle higher levels of power while maintaining approximately the same temperature of the package or can reduce the temperature of the package when operating at the same power level, as compared to a package without a thermal spreader.

摘要翻译： 公开了用于提高集成电路封装的热性能的系统和方法。 本发明的方面包括改进的热封装结构和通过在包装中应用一种或多种散热器来生产该热封装结构的方法。 在实施例中，散热器并入半导体芯片与其管芯焊盘之间的半导体芯片封装中。 通过在IC封装中包括散热器，封装可以处理更高水平的功率，同时保持封装的大致相同的温度，或者当与相同功率水平的封装相比时，可以降低封装的温度 散热器

公开(公告)号：US08304293B2

公开(公告)日：2012-11-06

申请号：US13230208

申请日：2011-09-12

申请人： Tarak A. Railkar ,  Steven D. Cate

发明人： Tarak A. Railkar ,  Steven D. Cate

IPC分类号： H01L21/44 ,  H01L21/48

CPC分类号： H01L23/4334 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed are systems and methods for improving the thermal performance of integrated circuit packages. Aspects of the present invention include improved thermal package structures and methods for producing the same through the application of one or more thermal spreaders in the package. In embodiments, a thermal spreader is incorporated in a semiconductor chip package between a semiconductor die and its die pad. By including a thermal spreader in an IC package, the package can handle higher levels of power while maintaining approximately the same temperature of the package or can reduce the temperature of the package when operating at the same power level, as compared to a package without a thermal spreader.

摘要翻译： 公开了用于提高集成电路封装的热性能的系统和方法。 本发明的方面包括改进的热封装结构和通过在包装中应用一种或多种散热器来生产该热封装结构的方法。 在实施例中，散热器并入半导体芯片与其管芯焊盘之间的半导体芯片封装中。 通过在IC封装中包括散热器，封装可以处理更高水平的功率，同时保持封装的大致相同的温度，或者当与相同功率水平的封装相比时，可以降低封装的温度 散热器

公开(公告)号：US08018051B2

公开(公告)日：2011-09-13

申请号：US12364452

申请日：2009-02-02

申请人： Tarak A. Railkar ,  Steven D. Cate

发明人： Tarak A. Railkar ,  Steven D. Cate

IPC分类号： H01L23/10 ,  H01L23/495

CPC分类号： H01L23/4334 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed are systems and methods for improving the thermal performance of integrated circuit packages. Aspects of the present invention include improved thermal package structures and methods for producing the same through the application of one or more thermal spreaders in the package. In embodiments, a thermal spreader is incorporated in a semiconductor chip package between a semiconductor die and its die pad. By including a thermal spreader in an IC package, the package can handle higher levels of power while maintaining approximately the same temperature of the package or can reduce the temperature of the package when operating at the same power level, as compared to a package without a thermal spreader.

摘要翻译： 公开了用于提高集成电路封装的热性能的系统和方法。 本发明的方面包括改进的热封装结构和通过在包装中应用一种或多种散热器来生产该热封装结构的方法。 在实施例中，散热器并入半导体芯片与其管芯焊盘之间的半导体芯片封装中。 通过在IC封装中包括散热器，封装可以处理更高水平的功率，同时保持封装的大致相同的温度，或者当与相同功率水平的封装相比时，可以降低封装的温度 散热器

公开(公告)号：US20100193942A1

公开(公告)日：2010-08-05

申请号：US12364452

申请日：2009-02-02

申请人： Tarak A. Railkar ,  Steven D. Cate

发明人： Tarak A. Railkar ,  Steven D. Cate

IPC分类号： H01L23/34 ,  H01L21/50

CPC分类号： H01L23/4334 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed are systems and methods for improving the thermal performance of integrated circuit packages. Aspects of the present invention include improved thermal package structures and methods for producing the same through the application of one or more thermal spreaders in the package. In embodiments, a thermal spreader is incorporated in a semiconductor chip package between a semiconductor die and its die pad. By including a thermal spreader in an IC package, the package can handle higher levels of power while maintaining approximately the same temperature of the package or can reduce the temperature of the package when operating at the same power level, as compared to a package without a thermal spreader.

摘要翻译： 公开了用于提高集成电路封装的热性能的系统和方法。 本发明的方面包括改进的热封装结构和通过在包装中应用一种或多种散热器来生产该热封装结构的方法。 在实施例中，散热器并入半导体芯片与其管芯焊盘之间的半导体芯片封装中。 通过在IC封装中包括散热器，封装可以处理更高水平的功率，同时保持封装的大致相同的温度，或者当与相同功率水平的封装相比时，可以降低封装的温度 散热器

公开(公告)号：US07851897B1

公开(公告)日：2010-12-14

申请号：US12485747

申请日：2009-06-16

申请人： Steven D. Cate ,  Ajay Kumar Ghai

发明人： Steven D. Cate ,  Ajay Kumar Ghai

IPC分类号： H01L29/76

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49517 ,  H01L23/49551 ,  H01L23/49562 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： IC package structures for high power dissipation and low RDSon. The package can be considered an inverted QFN package typically manufactured from a double etched lead frame that is then formed (stamped) to receive the electronic devices for connection and wire bonding to the lead frame leads, followed by potting and dicing. Using a split paddle allows the packaging of multiple, electrically isolated power devices. The package is particularly advantageous for packaging vertical power MOSFET devices. Various embodiments are disclosed.

摘要翻译： IC封装结构，功耗高，RDSon低。 封装可以被认为是通常由双蚀刻引线框架制造的反向QFN封装，然后形成（冲压）以接收用于连接和引线接合到引线框引线的电子器件，然后进行灌封和切割。 使用分离桨可以封装多个电气隔离的电源设备。 该封装对于封装垂直功率MOSFET器件尤其有利。 公开了各种实施例。