公开(公告)号：US20040033759A1

公开(公告)日：2004-02-19

申请号：US10642313

申请日：2003-08-14

Inventor： Stephen C. Schultz ,  John D. Herb ,  Dave Marquardt

IPC: B24B049/00 ,  B24B051/00 ,  B24B001/00

CPC classification number: B24B37/205 ,  B24B49/12

Abstract: In a chemical mechanical wafer processing apparatus, a platen for supporting a polishing pad, a manifold for delivering a chemical to the platen, a workpiece substantially in contact with a polishing pad supported by the platen, a light transmission medium for transmitting and receiving light to and from the workpiece, one end of the medium being substantially flush with the top of the polishing pad, the other end of the transmission medium having a hollow portion for receiving a light transmitting and receiving probe, thereby providing a light transmitting and receiving probe in close proximity to the workpiece. The platen and manifold of the apparatus are substantially of non-metallic material and may be joined by spaced clamps and latches.

Abstract translation: 在化学机械晶片处理装置中，用于支撑抛光垫的压板，用于将化学品输送到压板的歧管，与由压板支撑的抛光垫基本上接触的工件，用于发射和接收光的光传输介质 并且从工件开始，介质的一端与抛光垫的顶部基本齐平，传输介质的另一端具有用于接收光发射和接收探头的中空部分，由此提供光传输和接收探头 靠近工件。 设备的压板和歧管基本上是非金属材料，并且可以通过间隔开的夹子和闩锁连接。

公开(公告)号：US20040002289A1

公开(公告)日：2004-01-01

申请号：US10180740

申请日：2002-06-26

Inventor： Karl E. Mautz

IPC: B24B049/00 ,  B24B051/00 ,  B24B001/00

CPC classification number: B24B37/005 ,  B24B37/042 ,  B24B49/12

Abstract: A method for monitoring a polishing condition of a surface of a wafer in a polishing process is provided, the method comprising the steps of providing a wafer (16) to be polished, the wafer (16) having at least one optically distinguishable feature (20) below a transparent or translucent layer (22) to be polished; selecting one or more of said features (20) for monitoring; measuring an optical contrast profile (62; 72; 82; 92) across one or more of said selected features (20); determining the polishing condition of the surface of the wafer (16) on the basis of the measured contrast profile (62; 72; 82; 92); and repeating the steps of measuring the optical contrast profile (62; 72; 82; 92) and determining the polishing condition until a predetermined polishing condition is reached. The invention also provides a method for polishing wafers by a CMP polishing tool and apparatus for monitoring a polishing condition of a surface of a wafer (16) in a polishing process.

Abstract translation: 提供了一种用于在抛光过程中监测晶片表面的抛光状况的方法，所述方法包括以下步骤：提供待抛光的晶片（16），所述晶片（16）具有至少一个光学可区分特征（20 ）在待抛光的透明或半透明层（22）下面; 选择一个或多个所述特征（20）用于监视; 测量穿过所述选定特征（20）中的一个或多个的光学对比度轮廓（62; 72; 82; 92）; 基于测量的对比度轮廓（62; 72; 82; 92）确定晶片（16）的表面的抛光状态; 并重复测量光学对比度轮廓（62; 72; 82; 92）并确定抛光状态直到达到预定的抛光条件的步骤。 本发明还提供了一种通过CMP抛光工具抛光晶片的方法和用于在抛光过程中监测晶片（16）的表面的抛光状态的装置。

公开(公告)号：US20030220049A1

公开(公告)日：2003-11-27

申请号：US10152470

申请日：2002-05-21

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Ming Chang

IPC: B24B049/00 ,  B24B051/00

CPC classification number: B24B53/017

Abstract: A conditioning disk actuating system for raising and lowering a conditioning disk inside a conditioning head for the conditioning of semiconductor wafer polishing pads. The system includes a fluid-actuated cylinder which is coupled to a travel hub vertically slidably mounted in a travel housing provided inside the conditioning head. The conditioning disk is mounted on the bottom end of a disk shaft carried by the travel hub. The fluid-actuated cylinder is operated to selectively lower and raise the travel hub and conditioning disk to press the disk against the polishing pad and remove the disk from the polishing pad, respectively. A position sensing mechanism may be provided in the conditioning head for revealing the nullupnull or nulldownnull position of the conditioning disk.

Abstract translation: 调节盘驱动系统，用于升高和降低用于调节半导体晶片抛光垫的调节头内的调节盘。 该系统包括流体致动缸，其联接到行星轮毂，该行星轮毂可垂直地可滑动地安装在设置在调节头内部的行进箱体中。 调节盘安装在由旅行集线器承载的盘轴的底端。 操作流体驱动的气缸以选择性地降低和升高行进轮毂和调节盘，以将盘压在抛光垫上并分别从抛光垫移除盘。 可以在调节头中设置位置检测机构，用于露出调节盘的“向上”或“向下”位置。

公开(公告)号：US20030216106A1

公开(公告)日：2003-11-20

申请号：US10460560

申请日：2003-06-12

Applicant: Fujitsu Limited

Inventor： Shunsuke Sone ,  Yoshiaki Yanagida ,  Teruaki Nishioka ,  Koji Suto

IPC: B24B049/00 ,  B24B051/00 ,  B24B001/00 ,  B24B007/30

CPC classification number: B24B51/00 ,  B24B37/048 ,  B24B49/04 ,  Y10T29/49048 ,  Y10T29/4905

Abstract: Disclosed herein is a method of polishing a workpiece having a plurality of resistance elements by operating a plurality of bend mechanisms to push/pull the workpiece with respect to a polishing surface. This method includes the steps of measuring a shape of the workpiece, calculating an operational amount of each bend mechanism according to the shape measured, pressing the workpiece on the polishing surface with the bend mechanisms according to the operational amount calculated, and updating the operational amount according to a working amount of the workpiece. According to this method, magnetic heads included in the workpiece can be stably polished.

Abstract translation: 本文公开了一种通过操作多个弯曲机构来相对于抛光表面推/拉工件来抛光具有多个电阻元件的工件的方法。 该方法包括以下步骤：测量工件的形状，根据测量的形状来计算每个弯曲机构的操作量，根据所计算的操作量按照弯曲机构在抛光表面上按压工件，并更新操作量 根据工件的工作量。 根据这种方法，可以稳定地抛光包含在工件中的磁头。

公开(公告)号：US20030190868A1

公开(公告)日：2003-10-09

申请号：US10115538

申请日：2002-04-03

Applicant: 3M Innovative Properties Company

Inventor： Gary M. Palmgren

IPC: B24B049/00 ,  B24B051/00 ,  B24B001/00

CPC classification number: B24D11/00

Abstract: The invention provides an abrasive article, and methods for the use and the manufacture of the article. The abrasive article comprises an abrasive surface; and a performance index associated with the abrasive article, the index indicating an aspect of the abrasive performance of the article. In abrasive applications, the performance index is used to determine initial process conditions under which the abrasive article will abrade a workpiece. A process for making the abrasive article comprises (a) providing an abrasive article having an abrasive surface; (b) providing a workpiece having an abradable surface thereon; (c) abrading the abradable surface by applying the abrasive surface against the abradable surface at a known applied pressure and velocity and relatively moving the abrasive article and the abradable surface during a predetermined period of time; (d) devising a performance index based on the abrasive performance of the abrasive article during the abrading step (c); and (e) associating the performance index with the abrasive article.

Abstract translation: 本发明提供了一种磨料制品，以及制品的使用和制造方法。 磨料制品包括研磨表面; 以及与磨料制品相关联的性能指标，该指标表示制品的研磨性能的一个方面。 在磨料应用中，性能指标用于确定磨料制品将磨损工件的初始工艺条件。 制造磨料制品的方法包括（a）提供具有研磨表面的磨料制品; （b）提供其上具有可磨损表面的工件; （c）通过以已知的施加压力和速度将研磨表面施加到可磨损表面上并在预定时间段内相对移动磨料制品和可磨损表面来研磨可磨损表面; （d）在研磨步骤（c）期间基于磨料制品的研磨性能设计性能指标; 和（e）将性能指标与磨料制品相关联。

公开(公告)号：US20030181134A1

公开(公告)日：2003-09-25

申请号：US10437967

申请日：2003-05-15

Inventor： Tomoaki Nakasuji ,  Masahiko Hasegawa ,  Yoshinori Hirai

IPC: B24B049/00 ,  B24B051/00 ,  B24B001/00

CPC classification number: G05B19/186 ,  B23Q17/22 ,  B24B5/06 ,  B24B19/14 ,  B24B27/0084 ,  G05B19/184 ,  G05B19/404 ,  G05B2219/41344 ,  G05B2219/49172

Abstract: A rotation axis of a work spindle and a rotation axis of a spindle primary-axis portion are rotated relative to each other and feeding of a work-piece to a tool is accordingly adjusted, whereby warpage of the tool in accordance with a change in machining condition is corrected. A revolution volume of the relative rotation is compared and calculated in process based on data entered in advance, a result of measurement by a displacement sensor and information such as a machining position, and controlled in real time until the end of machining. The relative rotation is driven by an actuator such as a piezoelectric element, at a resolution even as fine as in seconds. The data entered in advance can be sequentially updated in accordance with monitoring of a processed product.

公开(公告)号：US20030181133A1

公开(公告)日：2003-09-25

申请号：US10420023

申请日：2003-04-21

Applicant: NCRx Optical Solutions, Inc.

Inventor： Larry K. Siders ,  Donald F. Baechtel

IPC: B24B049/00 ,  B24B051/00 ,  B24B001/00

CPC classification number: B24B13/04 ,  B24B1/00 ,  B24B9/14 ,  B24B9/146 ,  B24B9/148 ,  B24B13/0031 ,  B24B13/005 ,  B24B13/0055 ,  B24B13/01 ,  B24B13/02 ,  B24B13/06 ,  B24B27/0076 ,  B24B51/00

Abstract: A method and system for the manufacture of ophthalmic lenses comprising a computer (102) and a CNC machining platform (104) in operative connection with the computer. The CNC machining platform includes a mounting stage (110), a block (106) in releasable connection with the mounting stage, and a machining tool (112). When an unfinished lens blank (108) is properly mounted on the block, the computer is operative to direct the CNC machining platform to perform both back surface generation and patternless edging of the lens blank in one machining cycle. The computer is further operative to direct the CNC machining platform to machine a lap tool for each lens and machine a block for receiving each lens. The block is machined by the platform to include scribe lines for facilitating proper alignment of lens blank.

公开(公告)号：US20030129925A1

公开(公告)日：2003-07-10

申请号：US10339250

申请日：2003-01-09

Inventor： Yoshiaki Toyoshima ,  Hideo Toriumi ,  Shin-ichiro Taguchi

IPC: B24B049/00 ,  B24B051/00

CPC classification number: B24B49/00 ,  B24B13/005 ,  B24B13/0052 ,  B24B13/01 ,  B24B13/012 ,  B24B13/02

Abstract: A polishing apparatus includes a polishing jig. The polishing jig includes an elastic balloon member, a fixture, and a fluid supply portion. The fixture airtightly closes the rear opening portion of the balloon member. The fluid supply portion supplies a fluid into a space formed by the fixture and balloon member. The balloon member has a cup shape constructed by a dome portion and a cylinder portion extending backward from the outer periphery of the dome portion. The fixture fixes the opening portion of the cylinder portion of the balloon member.

公开(公告)号：US20030104761A1

公开(公告)日：2003-06-05

申请号：US10342653

申请日：2003-01-14

Applicant: Applied Materials, Inc., a Delaware corporation

Inventor： Andreas Norbert Wiswesser ,  Walter Schoenleber ,  Boguslaw Swedek

IPC: B24B049/00 ,  B24B051/00

CPC classification number: G01B11/06 ,  B24B37/04 ,  B24B49/12 ,  B24D7/12 ,  G01B9/02021 ,  G01B9/02027

Abstract: The thickness of a layer on a substrate is measured in-situ during chemical mechanical polishing. A light beam is divided through a window in a polishing pad, and the motion of the polishing pad relative to the substrate causes the light beam to move in a path across the substrate surface. An interference signal produced by the light beam reflecting off the substrate is monitored, and a plurality of intensity measurements are extracted from the interference signal. Each intensity measurement corresponds to a sampling zone in the path across the substrate surface. A radial position is determined for each sampling zone, and the intensity measurements are divided into a plurality of radial ranges according to the radial positions. The layer thickness is computed for each radial range from the intensity measurements associated with that radial range.

公开(公告)号：US20030096559A1

公开(公告)日：2003-05-22

申请号：US10334424

申请日：2002-12-31

Inventor： Brian Marshall

IPC: B24B049/00 ,  B24B051/00 ,  B24B001/00

CPC classification number: B24B37/20 ,  B24B37/04 ,  B24B37/11 ,  B24B49/10 ,  B24B49/16 ,  B24B57/02

Abstract: Methods and apparatuses for analyzing and controlling performance parameters in planarization of microelectronic substrates. In one embodiment, a planarizing machine for mechanical or chemical-mechanical planarization includes a table, a planarizing pad on the table, a carrier assembly, and an array of force sensors embedded in at least one of the planarizing pad, a sub-pad under the planarizing pad, or the table. The force sensor array can include shear and/or normal force sensors, and can be configured in a grid pattern, concentric pattern, radial pattern, or a combination thereof. Analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates includes removing material from the microelectronic substrate by pressing the substrate against a planarizing surface, determining a force distribution exerted against the substrate by sensing a plurality of forces at a plurality of discrete nodes as the substrate rubs against the planarizing surface, and controlling a planarizing parameter of a planarizing cycle according to the determined force distribution. A planarizing pad or sub-pad for mechanical or chemical-mechanical planarization in accordance with an embodiment of the invention can include a body having a plurality of raised portions and a plurality of low regions between the raised portions, and a plurality of force sensors embedded in the body at locations relative to the raised portions. Positioning the sensors relative to the raised portion can isolate shear and/or normal forces exerted against the pad by the microelectronic substrate during planarization.

Abstract translation: 用于分析和控制微电子基板平面化性能参数的方法和装置。 在一个实施例中，用于机械或化学机械平面化的平面化机器包括工作台，工作台上的平面化焊盘，载体组件和嵌入在平坦化焊盘中的至少一个中的力传感器阵列， 平坦化垫或桌子。 力传感器阵列可以包括剪切和/或法向力传感器，并且可以被配置成格栅图案，同心图案，径向图案或其组合。 分析和控制微电子衬底的机械和化学机械平面化中的性能参数包括通过将衬底压靠在平坦化表面上来从微电子衬底移除材料，通过感测多个离散的多个力来确定施加于衬底上的力分布 作为基板的节点与平坦化表面摩擦，并且根据确定的力分布来控制平坦化循环的平坦化参数。 根据本发明的实施例的用于机械或化学机械平面化的平坦化焊盘或子焊盘可以包括具有多个凸起部分和在凸起部分之间的多个低区域的主体，以及嵌入的多个力传感器 在相对于凸起部分的位置处的主体。 相对于凸起部分定位传感器可以隔离在平坦化期间由微电子衬底施加在衬垫上的剪切力和/或法向力。