公开(公告)号：US06330907B1

公开(公告)日：2001-12-18

申请号：US09393682

申请日：1999-09-10

申请人： Tetsurou Ogushi ,  Masaaki Murakami ,  Akira Yao ,  Takeshi Okamoto ,  Hiromitsu Masumoto ,  Hisaaki Yamakage

发明人： Tetsurou Ogushi ,  Masaaki Murakami ,  Akira Yao ,  Takeshi Okamoto ,  Hiromitsu Masumoto ,  Hisaaki Yamakage

IPC分类号： F28D1500

CPC分类号： F28D15/043 ,  F28D15/046 ,  Y10S165/907

摘要： An evaporator includes a container, a wick provided in contact with an inner peripheral surface of said container and formed such that (1) if the number of pores per unit volume is fixed, the diameter of pores is varied, or (2) if the diameters of pores are formed substantially uniformly, the number of pores is varied, a sump having said wick as its inner wall surface and connected to a liquid pipe for supplying a liquid-phase working fluid, and a vapor channel formed in a contact surface of said container with respect to said wick so as to guide a gas-phase working fluid into a vapor pipe connected to an end portion of said container.

摘要翻译： 蒸发器包括：容器，设置成与所述容器的内周表面接触的芯，并且形成为：（1）如果固定每单位体积的孔数，则孔的直径变化，或（2）如果 孔的直径基本上均匀地形成，孔的数量变化，具有所述芯作为其内壁表面并且连接到用于供给液相工作流体的液体管的槽，以及形成在液相工作流体的接触表面中的蒸气通道 所述容器相对于所述芯芯，以将气相工作流体引导到连接到所述容器的端部的蒸气管中。

公开(公告)号：US06328097B1

公开(公告)日：2001-12-11

申请号：US09608820

申请日：2000-06-30

申请人： Gary L. Bookhardt ,  Shawn S. McEuen

发明人： Gary L. Bookhardt ,  Shawn S. McEuen

IPC分类号： F28D1500

CPC分类号： H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： An integrated heat dissipation apparatus includes an attachment area, a heat exchange area thermally connected to the attachment area, and an air flow generation area that is integrally formed with the attachment area and the heat exchange area. A thermally conductive member extends between the attachment area and the heat exchange area to facilitate the removal of heat from the attachment area to the heat exchange area. A generated air flow passes through the heat exchange area.

摘要翻译： 集成散热装置包括附接区域，热连接到附接区域的热交换区域和与附接区域和热交换区域一体形成的气流产生区域。 导热构件在附接区域和热交换区域之间延伸，以便于将热量从附着区域移除到热交换区域。 产生的空气流通过热交换区域。

公开(公告)号：US06302192B1

公开(公告)日：2001-10-16

申请号：US09310397

申请日：1999-05-12

申请人： Peter M. Dussinger ,  Thomas L. Myers

发明人： Peter M. Dussinger ,  Thomas L. Myers

IPC分类号： F28D1500

CPC分类号： H01L23/427 ,  F28D15/0233 ,  F28D15/046 ,  H01L2924/0002 ,  H01L2924/00

摘要： The apparatus is a heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of more highly heat conductive material for only that part of the wick in the region which contacts the heat source, so that there is superior heat conductivity in that region.

摘要翻译： 该装置是在热管和热源和散热器之间具有优异传热的热管。 热管通过安装穿过热管结构的孔而紧密地保持在热源上，但是与蒸气室密封，因为它们各自位于密封结构中，例如立柱或外壳的固体层 蒸气室。 热管的另一个特征是使用更高导热性的材料仅用于接触热源的区域中的芯的那部分，从而在该区域具有优异的导热性。

公开(公告)号：US06293332B2

公开(公告)日：2001-09-25

申请号：US09281777

申请日：1999-03-31

申请人： Jia Hao Li

发明人： Jia Hao Li

IPC分类号： F28D1500

CPC分类号： F28D15/0233 ,  F28D9/0062 ,  F28D15/046 ,  Y10T29/49353

摘要： A structure of a super-thin heat plate comprising surrounding bodies having a thin plate shape and supporting body is disclosed. Each supporting body have function of capillarity and is enclosed within the surrounding bodies. The surrounding bodies and the supporting body are connected by a plurality of welding spots, and the edges are properly sealed. The supporting body is distributed uniformly by a whole web structure. Thus, the heat plate wick structure is very stable with a preferred performance of heat transfer and can be finished easily. In mass production, the structure still has a high stability.

摘要翻译： 公开了一种包括具有薄板形状和支撑体的围绕体的超薄加热板的结构。 每个支撑体具有毛细作用的功能，并被封闭在周围的身体内。 周围的主体和支撑体通过多个焊接点连接，边缘被适当地密封。 支撑体由整个网状结构均匀分布。 因此，热板芯结构非常稳定，具有优选的传热性能，并且可以容易地完成。 在批量生产中，结构仍具有很高的稳定性。

公开(公告)号：US06269866B1

公开(公告)日：2001-08-07

申请号：US09544313

申请日：2000-04-06

申请人： Masaaki Yamamoto ,  Jun Niekawa ,  Tatuhiko Ueki ,  Masami Ikeda ,  Ken Sasaki

发明人： Masaaki Yamamoto ,  Jun Niekawa ,  Tatuhiko Ueki ,  Masami Ikeda ,  Ken Sasaki

IPC分类号： F28D1500

CPC分类号： H01L23/3733 ,  F28D15/0233 ,  F28D15/046 ,  H01L23/3672 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： The invention provides a cooling device provided with a heat pipe, which is capable of effectively radiating heat from electronic equipment such as a small-sized computer. The cooling device with the heat pipe comprises a plate-like container made of heat transferring metal for containing a working fluid, and having a heat absorbing surface larger than that of the body to be cooled, a the heat transferring metal column, and a hollow portion in which the working fluid exists. An alternating embodiment of the cooling device with the heat pipe comprises a plate-like container made of heat transferring metal, a heat absorbing wall having a large heat absorbing surface, and a plurality of protrusion portions.

摘要翻译： 本发明提供了一种具有热管的冷却装置，其能够有效地从诸如小型计算机的电子设备辐射热量。 具有热管的冷却装置包括由用于容纳工作流体的传热金属制成的板状容器，并且具有比要冷却的物体更大的吸热表面，传热金属柱和中空部 存在工作流体的部分。 具有热管的冷却装置的交替实施例包括由传热金属制成的板状容器，具有大的吸热表面的吸热壁和多个突出部分。

公开(公告)号：US06170562B2

公开(公告)日：2001-01-09

申请号：US09141310

申请日：1998-08-27

申请人： Harald Knoblauch

发明人： Harald Knoblauch

IPC分类号： F28D1500

CPC分类号： H05K7/206 ,  F24F12/001 ,  F28D9/00 ,  Y02B30/563

摘要： A device (200) for the exchange of thermal energy between an interior of a housing, more particularly for a telecommunication apparatus and an environment, in order to convey heat from the housing interior to the outside and, in this case, in order to maintain the internal temperature for the components involved within tolerated limits one heat exchanger block (11) possesses two fluid duct systems (12,16) which are separated from each other and that are in thermal energy-transmitting contact with each other, while a first fluid duct system (12) communicates with the housing interior and a second fluid duct system (16) communicates with the surroundings and each fluid duct system (12,16) has allocated to it one fluid pump (22,24) each for conveying a first working fluid (18) in the first fluid duct system (12) and a second working fluid (20) in the second fluid duct system (16).

摘要翻译： 一种用于在壳体的内部，更特别是用于电信设备和环境之间交换热能的装置（200），以便将热量从壳体内部传送到外部，并且在这种情况下为了维持 涉及在容许限度内的部件的内部温度，一个热交换器块（11）具有彼此分离并且彼此处于热能传递接触的两个流体管道系统（12,16），而第一流体 管道系统（12）与壳体内部连通，并且第二流体管道系统（16）与周围环境连通，并且每个流体管道系统（12,16）已经分配有一个流体泵（22,24），每个用于传送第一 第一流体管道系统（12）中的工作流体（18）和第二流体管道系统（16）中的第二工作流体（20）。

公开(公告)号：US06834712B2

公开(公告)日：2004-12-28

申请号：US10305662

申请日：2002-11-26

申请人： Overton L. Parish ,  Roger S. DeVilbiss

发明人： Overton L. Parish ,  Roger S. DeVilbiss

IPC分类号： F28D1500

CPC分类号： F28D15/0266 ,  F28D15/0233 ,  F28D15/0275 ,  F28D2015/0225 ,  G06F1/203 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A stacked array of low profile heat pipes each with a plurality of micro tubes extended therethrough. The stacked low profile heat pipes are placed into thermal connection with heat producing components. A heat transfer fluid is contained in the micro tubes of the low profile heat pipes and removes the heat from the heat producing components.

摘要翻译： 一组低排列的热管，每个均具有从其延伸的多个微管。 堆叠的薄型热管与发热部件热连接。 传热流体包含在低剖面热管的微管中，并从发热部件中除去热量。

公开(公告)号：US06827134B1

公开(公告)日：2004-12-07

申请号：US10137155

申请日：2002-04-30

申请人： Michael J. Rightley ,  Douglas R. Adkins ,  James J. Mulhall ,  Charles V. Robino ,  Mark Reece ,  Paul M. Smith ,  Chris P. Tigges

发明人： Michael J. Rightley ,  Douglas R. Adkins ,  James J. Mulhall ,  Charles V. Robino ,  Mark Reece ,  Paul M. Smith ,  Chris P. Tigges

IPC分类号： F28D1500

CPC分类号： F28D15/04 ,  F28D15/0233 ,  G06F1/203 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A parallel-plate heat pipe is disclosed that utilizes a plurality of evaporator regions at locations where heat sources (e.g. semiconductor chips) are to be provided. A plurality of curvilinear capillary grooves are formed on one or both major inner surfaces of the heat pipe to provide an independent flow of a liquid working fluid to the evaporator regions to optimize heat removal from different-size heat sources and to mitigate the possibility of heat-source shadowing. The parallel-plate heat pipe has applications for heat removal from high-density microelectronics and laptop computers.

摘要翻译： 公开了一种在要提供热源（例如半导体芯片）的位置处利用多个蒸发器区域的平行板式热管。 在热管的一个或两个主要内表面上形成多个曲线毛细管槽，以提供液体工作流体到蒸发器区域的独立流动，以优化来自不同尺寸的热源的散热并减轻热量的可能性 源代码阴影。 平板式热管适用于从高密度微电子和笔记本电脑散热。

公开(公告)号：US06796373B1

公开(公告)日：2004-09-28

申请号：US10648335

申请日：2003-08-27

申请人： Chin-Yuan Li

发明人： Chin-Yuan Li

IPC分类号： F28D1500

CPC分类号： H01L23/427 ,  F28D15/0275 ,  F28D15/04 ,  F28D2021/0029 ,  F28F13/00 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention is to provide a heat sink module comprising a base; a first heat conduction block located on the middle of a first side of the base a second heat conduction block located on the middle of a second side of the base corresponding to the first heat conduction block; at least one heat conduction tube installed in the base between the first and second heat conduction blocks, the at least one heat conduction tube each having two distal ends curved in one direction and respectively inserted into the first and second heat conduction blocks; and a plurality of radiation fins located on two sides of the base and connected between the first and second heat conduction blocks, the radiation fins each having two ends respectively extended to two sides of the base for enabling the base to be installed in a heat source.

摘要翻译： 本发明提供一种散热器模块，其包括基座; 位于所述底座第一侧中间的第一导热块，位于所述基座的与所述第一导热块相对应的第二侧的中间的第二导热块; 所述至少一个导热管安装在所述第一和第二导热块之间的所述底座中，所述至少一个导热管具有两个远端，所述两个远端在一个方向上弯曲并分别插入到所述第一和第二导热块中; 以及位于所述基座的两侧并连接在所述第一和第二导热块之间的多个辐射翅片，每个所述辐射翅片各自具有分别延伸到所述基座的两侧的辐射翅片，以使所述基座能够安装在热源 。

公开(公告)号：US06782942B1

公开(公告)日：2004-08-31

申请号：US10426846

申请日：2003-05-01

申请人： Chin-Wen Wang ,  Ching Chung Wang ,  Pei-Choa Wang

发明人： Chin-Wen Wang ,  Ching Chung Wang ,  Pei-Choa Wang

IPC分类号： F28D1500

CPC分类号： H01L23/427 ,  F28D15/0233 ,  F28D15/04 ,  H01L2924/0002 ,  H01L2924/00

摘要： A tabular heat pipe structure with support bodies has a housing, working fluid received in the housing and support bodies. The top and bottom faces of the support bodies are zigzag faces having a plurality of contact points. The support bodies use these contact points to adhere to the housing by means of welding. The tabular heat pipe structure is uniform and intact, has a high rigidity, will not cave in and deform due to back pressure in the heat pipe, and will not let the housing separate from the support bodies because of expansion at high temperatures. Therefore, the tabular heat pipe structure has the advantages like a better heat-conducting characteristic, a smaller contact heat resistance, a simple processing procedure, a quick manufacturing speed, a lower cost, and a simple and stable operation of flat adhesion.

摘要翻译： 具有支撑体的平板状热管结构具有壳体，容纳在壳体和支撑体中的工作流体。 支撑体的顶面和底面是具有多个接触点的曲折面。 支撑体使用这些接触点通过焊接附着到壳体上。 平板式热管结构是均匀且完整的，具有高刚性，不会由于热管中的背压而陷入和变形，并且由于高温膨胀而不能使壳体与支撑体分离。 因此，平板状的热管结构具有导热性能好，接触耐热性差，加工工序简单，制造速度快，成本低，平面粘接简单稳定的优点。