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17 条记录 (耗时 0.017 秒)

    Clamping heat sinks to circuit boards over processors
    1.
    发明授权
    Clamping heat sinks to circuit boards over processors 有权

    公开(公告)号：US06362965B1

    公开(公告)日：2002-03-26

    申请号：US09736987

    申请日：2000-12-14

    申请人： Gary L. Bookhardt ,  Shawn S. McEuen

    发明人： Gary L. Bookhardt ,  Shawn S. McEuen

    IPC分类号： H05K720

    摘要： A heat sink may be spring strapped onto a socketed processor using clips that engage the spring strap and that are pre-positioned on the circuit board. The clips may be C-shaped and may include an upper spring arm portion, a vertical portion, and a base which may be surface mounted to the circuit board. The upper spring arm of the C-shaped clip then releasably engages the spring strap to clamp the heat sink firmly onto the socketed processor.

    Integrated heat dissipation apparatus
    3.
    发明授权
    Integrated heat dissipation apparatus 有权
    集成散热装置

    公开(公告)号：US06328097B1

    公开(公告)日：2001-12-11

    申请号：US09608820

    申请日：2000-06-30

    申请人： Gary L. Bookhardt ,  Shawn S. McEuen

    发明人： Gary L. Bookhardt ,  Shawn S. McEuen

    IPC分类号： F28D1500

    CPC分类号： H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An integrated heat dissipation apparatus includes an attachment area, a heat exchange area thermally connected to the attachment area, and an air flow generation area that is integrally formed with the attachment area and the heat exchange area. A thermally conductive member extends between the attachment area and the heat exchange area to facilitate the removal of heat from the attachment area to the heat exchange area. A generated air flow passes through the heat exchange area.

    摘要翻译： 集成散热装置包括附接区域，热连接到附接区域的热交换区域和与附接区域和热交换区域一体形成的气流产生区域。 导热构件在附接区域和热交换区域之间延伸，以便于将热量从附着区域移除到热交换区域。 产生的空气流通过热交换区域。

    Clamping heat sinks to circuit boards over processors
    4.
    发明授权
    Clamping heat sinks to circuit boards over processors 有权
    将散热片夹在处理器上的电路板上

    公开(公告)号：US06222734B1

    公开(公告)日：2001-04-24

    申请号：US09450080

    申请日：1999-11-29

    申请人： Gary L. Bookhardt ,  Shawn S. McEuen

    发明人： Gary L. Bookhardt ,  Shawn S. McEuen

    IPC分类号： H05K720

    CPC分类号： H05K3/301 ,  H01L23/4093 ,  H01L2924/0002 ,  H05K3/305 ,  Y10T24/44026 ,  Y10T29/4913 ,  H01L2924/00

    摘要： A heat sink may be spring strapped onto a socketed processor using clips that engage the spring strap and that are pre-positioned on the circuit board. The clips may be C-shaped and may include an upper spring arm portion, a vertical portion, and a base which may be surface mounted to the circuit board. The upper spring arm of the C-shaped clip then releasably engages the spring strap to clamp the heat sink firmly onto the socketed processor.

    摘要翻译： 可以使用与弹簧带接合并且预定位于电路板上的夹子将散热器弹簧捆扎在带有插座的处理器上。 夹子可以是C形的，并且可以包括上弹簧臂部分，垂直部分和可以表面安装到电路板的基部。 C形夹子的上弹簧臂然后可释放地接合弹簧带，将散热片牢固地夹在插座处理器上。

    Protective cover and packaging for multi-chip memory modules
    6.
    发明授权
    Protective cover and packaging for multi-chip memory modules 有权
    多芯片内存模块的保护盖和封装

    公开(公告)号：US06188576B1

    公开(公告)日：2001-02-13

    申请号：US09311658

    申请日：1999-05-13

    申请人： Ihab A. Ali ,  Shawn S. McEuen

    发明人： Ihab A. Ali ,  Shawn S. McEuen

    IPC分类号： H05K770

    CPC分类号： G11C5/143 ,  G06K19/077

    摘要： A memory module having a packaging cover to encapsulate a board having multiple separate chips, which dynamically generate varying amounts heat. The packaging cover provides localized heat dissipation among the multiple separate memory chips. The separate chips are interconnected to the board via a set of solder balls. The packaging cover further provides a rigid encapsulation of the board and chips. In one embodiment, the memory module includes a thermally conductive substance displaced within the packaging cover to conduct heat from the separate chips to the packaging cover. In one embodiment, the packaging consist of a two separate metal covers. In one embodiment, a first cover of the packaging cover includes a first set of finger wraps and a second cover of the packaging cover includes a second set of finger wraps that interlace with the first set of finger wraps to secure a coupling between the first cover and a second cover of the packaging cover. In an alternative embodiment, a top cover and bottom cover of the packaging are assembled with rivets coupling the top and bottom covers.

    摘要翻译： 一种存储器模块，具有用于封装具有多个分离芯片的板的封装盖，其动态地产生变化量的热量。 包装盖在多个分离的存储器芯片之间提供局部散热。 单独的芯片通过一组焊球与板相互连接。 包装盖还提供了板和芯片的刚性封装。 在一个实施例中，存储器模块包括在封装盖内移动的导热物质，以将热量从分离的芯片传导到包装盖。 在一个实施例中，包装由两个单独的金属盖组成。 在一个实施例中，包装盖的第一盖包括第一组手指包，并且包装盖的第二盖包括与第一组手指套交织的第二组手指套，以固定第一盖 以及包装盖的第二盖。 在替代实施例中，包装的顶盖和底盖组装有联接顶盖和底盖的铆钉。

    Tablet air cooling dock
    9.
    发明授权
    Tablet air cooling dock 有权
    平板电脑散热底座

    公开(公告)号：US06837058B1

    公开(公告)日：2005-01-04

    申请号：US10611203

    申请日：2003-06-30

    申请人： Shawn S. McEuen ,  Brian Wilk ,  Himanshu Pokharna

    发明人： Shawn S. McEuen ,  Brian Wilk ,  Himanshu Pokharna

    IPC分类号： F25D15/00 ,  G06F1/16 ,  G06F1/20 ,  F25B21/02 ,  F25D23/12 ,  H05K5/00

    CPC分类号： G06F1/20 ,  F25D15/00 ,  G06F1/1626 ,  G06F1/1632 ,  G06F1/203

    摘要： A tablet air cooling dock. In one embodiment, the dock includes a cooling unit a tablet cradle to receive and support a tablet computer. The cradle includes a passageway to receive air from the cooling unit and to provide the air to a vent of the tablet computer. In one embodiment, the tablet cradle is pivotally mounted to provide multiple viewing positions of the tablet computer.

    摘要翻译： 平板电脑空冷基座。 在一个实施例中，坞站包括用于接收和支持平板计算机的平板支架的冷却单元。 支架包括用于从冷却单元接收空气并将空气提供给平板计算机的通风口的通道。 在一个实施例中，平板支架枢转地安装以提供平板计算机的多个观看位置。

    Protective cover and packaging for multi-chip memory modules
    10.
    发明授权
    Protective cover and packaging for multi-chip memory modules 有权
    多芯片内存模块的保护盖和封装

    公开(公告)号：US06353538B1

    公开(公告)日：2002-03-05

    申请号：US09311783

    申请日：1999-05-13

    申请人： Ihab A. Ali ,  Shawn S. McEuen

    发明人： Ihab A. Ali ,  Shawn S. McEuen

    IPC分类号： H05K700

    CPC分类号： H01L23/3675 ,  H01L25/0655 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A memory module having a packaging cover to encapsulate a board having multiple separate chips, which dynamically generating varying amounts heat. The packaging cover provides localized heat dissipation among the multiple separate memory chips. The separate chips are interconnected to the board via a set of solder balls. The packaging cover further provides a rigid encapsulation of the board and chips. In one embodiment, the memory module includes a thermally conductive substance displaced within the packaging cover to conduct heat from the separate chips to the packaging cover. In one embodiment, the packaging cover consists of a plastic material having a sheet of metal coupled to an interior surface of the packaging cover. In one embodiment, the packaging cover includes two separate covers, with a first cover having an insert pin, and a second cover having an insert receptacle to receive the insert pin. In an alternative embodiment, the first cover of the packaging cover includes a set of clip snaps to secure a coupling between the first cover and a second cover of the packaging cover.

    摘要翻译： 一种存储器模块，其具有封装封装封装封装的板，该板具有多个单独的芯片，其动态地产生变化量的热量。 包装盖在多个分离的存储器芯片之间提供局部散热。 单独的芯片通过一组焊球与板相互连接。 包装盖还提供了板和芯片的刚性封装。 在一个实施例中，存储器模块包括在封装盖内移动的导热物质，以将热量从分离的芯片传导到包装盖。 在一个实施例中，包装盖由具有耦合到包装盖的内表面的金属片的塑料材料组成。 在一个实施例中，包装盖包括两个单独的盖，第一盖具有插入销，第二盖具有用于接收插入销的插入件插座。 在替代实施例中，包装盖的第一盖包括一组夹扣，以固定第一盖和包装盖的第二盖之间的联接。