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410 条记录 (耗时 0.032 秒)

    Photo-curable resin composition, patterning process, and substrate protecting film
    94.
    发明申请
    Photo-curable resin composition, patterning process, and substrate protecting film 有权
    光固化树脂组合物，图案化工艺和基材保护膜

    公开(公告)号：US20030113662A1

    公开(公告)日：2003-06-19

    申请号：US10266566

    申请日：2002-10-09

    发明人： Hideto Kato ,  Kazumi Noda ,  Toshihiko Fujii ,  Kazuhiro Arai ,  Satoshi Asai

    IPC分类号： G03F007/038 ,  C08F002/46 ,  C08J003/28 ,  C08J007/04

    CPC分类号： G03F7/0757 ,  C09D183/14 ,  G03F7/0382 ,  Y10S430/128 ,  C08L2666/14

    摘要： A photo-curable resin composition comprising (A) an organosiloxane-bearing polymer comprising recurring units of formula (1): 1 wherein R1 to R4 are monovalent C1-C8 hydrocarbon, n is an integer of 1-1,000, and X is 2 and having a Mw of 500-200,000, (B) a formalin-modified or formalin-alcohol-modified amino condensate, a phenol compound having on the average at least two methylol or alkoxymethylol radicals, or an epoxy compound having on the average at least two epoxy radicals, (C) a photoacid generator, and (D) a silicon compound of the formula: (R11)mSi(OR12)4nullm wherein R11 is monovalent C1-C9 hydrocarbon, R12 is C1-C4 alkyl, m is 0-2, forms cured pattern films having dry etch resistance and improved adhesion to substrates.

    摘要翻译： 一种光固化树脂组合物，其包含（A）含有机硅氧烷的聚合物，其包含式（1）的重复单元：其中R 1至R 4为单价C 1 -C 8烃，n为1-1000的整数，X为且具有 Mw为500-200,000，（B）福尔马林改性或福尔马林醇改性氨基缩合物，平均具有至少两个羟甲基或烷氧基羟甲基自由基的酚化合物或平均具有至少两个环氧基的环氧化合物 ，（C）光致酸产生剂和（D）下式的硅化合物：（R11）mSi（OR12）4-m其中R11是一价C1-C9烃，R12是C1-C4烷基，m是0-2 形成具有耐干蚀刻性和改善的与基底的粘附性的固化图案膜。

    Chemical amplification type positive resist composition
    95.
    发明申请
    Chemical amplification type positive resist composition 有权
    化学放大型正光刻胶组合物

    公开(公告)号：US20030113661A1

    公开(公告)日：2003-06-19

    申请号：US10239896

    申请日：2002-09-26

    发明人： Yasunori Uetani ,  Takakiyo Terakawa ,  Kaoru Araki

    IPC分类号： G03F007/038

    CPC分类号： G03F7/0397 ,  C08F220/28 ,  Y10S430/106 ,  Y10S430/111

    摘要： A chemical amplification type positive resist composition is provided, comprising a resin which has at least one polymerization unit selected from a polymerization unit of 3-hydroxy-1-adamantyl acrylate and a polymerization unit of 3,5-dihydroxy-1-adamantyl (meth)acrylate, a polymerization unit of hydroxystyrene and a polymerization unit having a group uhstable to an acid, is itself insoluble or poorly soluble in an alkali but becomes alkali-soluble after said group unstable to an acid is dissociated by the action of an acid; and an acid generator, the composition being excellent in various abilities such as sensitivity, resolution, heat resistance, film retention ratio, applicability, exposure clearance, dry etching resistance and the like, particularly having further improved resolution and exposure clearance.

    摘要翻译： 提供化学放大型正性抗蚀剂组合物，其包含具有至少一个选自丙烯酸3-羟基-1-金刚烷基酯的聚合单元的聚合单元和3,5-二羟基-1-金刚烷基（甲基）丙烯酸酯的聚合单元的树脂， ）丙烯酸酯，羟基苯乙烯的聚合单元和具有与酸成反应的基团的聚合单元本身在碱中不溶或难溶，但在酸不稳定的所述基团被酸的作用解离后，其变成碱溶性; 和酸发生剂，特别是具有进一步提高分辨率和曝光间隙的各种能力，例如灵敏度，分辨率，耐热性，保膜率，适用性，曝光间隙，耐干蚀刻性等优异的组合物。

    Active components and photosensitive resin composition containing the same
    98.
    发明申请
    Active components and photosensitive resin composition containing the same 失效
    活性成分和含有相同的感光性树脂组合物

    公开(公告)号：US20030064320A1

    公开(公告)日：2003-04-03

    申请号：US10203032

    申请日：2002-08-05

    发明人： Makoto Hanabata ,  Masahiro Sato ,  Junko Katayama ,  Satsuki Kitajima

    IPC分类号： G03F007/038 ,  G03F007/38

    CPC分类号： G03F7/0757 ,  G03F7/0382 ,  G03F7/0392

    摘要： A photosensitive resin composition for using in combination with a photosensitizer comprises an active component selected from an active metal alkoxide represented by the formula (1) or a polycondensate thereof and a particle represented by the formula (2), (X)mnulln-Mm-null(U1)p-(U2-Z)tnullnnullnull(1) Pnullnull(Y)s-null(U1)p-(U2-Z)tnullnullknullnull(2) wherein, X shows a hydrogen, a halogen, an alkoxy group or an alkoxycarbonyl group, M shows a metal atom whose valence m is not less than 2, U1 shows a first connecting unit, U2 shows a second connecting unit and Z shows a group causing a difference insolubility by light exposure, P shows a fine particle carrier, Y shows a coupling residue, n shows an integer of not less than 1 and m>n, p shows 0 or 1, t shows 1 or 2, k shows an integer of not less than 1, and s shows 0 or 1). The unit (U1)p-(U2-Z)t is represented by the following formula: null(R1)qnull(B)rnullpnullnullnull(R2)unull(Ar)vnull-Znullt (wherein, R1 and R2 show an alkylene or alkenylene group; and B shows an ester bond, an amide bond, a urea bond, a urethane bond, an imino group, a sulfur atom or a nitrogen atom; Ar represents an arylene or cycloalkylene group; each of the factors, q, r, u and v, shows 0 or 1, and qnullrnullunullvnull1; and Z, p and t have the same meanings defined above).

    摘要翻译： 与光敏剂组合使用的感光性树脂组合物包含选自由式（1）表示的活性金属醇盐或其缩聚物和式（2），（X）mn-Mm- [（U1）p-（U2-Z）t] n（1）P - [（Y）s - {（U1）p-（U2-Z）t}] k（2）其中，X表示氢， 卤素，烷氧基或烷氧基羰基，M表示价数m不小于2的金属原子，U1表示第一连接单元，U2表示第二连接单元，Z表示通过曝光引起差分不溶性的基团 ，P表示微粒子载体，Y表示偶联残基，n表示1以上的整数，m> n，p表示0或1，t表示1或2，k表示1以上的整数， s表示0或1）。 单元（U1）对（U2-Z）t由下式表示：[（R1）q-（B）r] p - [{（R2）u-（Ar）v} -Z] 其中，R1和R2表示亚烷基或亚烯基; B表示酯键，酰胺键，脲键，氨基甲酸酯键，亚氨基，硫原子或氮原子; Ar表示亚芳基或亚环烷基 ; q，r，u和v中的每一个表示0或1，q + r + u + v> = 1; Z，p和t具有与上述相同的含义）。

    Negative-working thermal imaging member and methods of imaging and printing
    99.
    发明申请
    Negative-working thermal imaging member and methods of imaging and printing 失效
    负面工作的热成像构件和成像和打印方法

    公开(公告)号：US20030064317A1

    公开(公告)日：2003-04-03

    申请号：US09864570

    申请日：2001-05-24

    申请人： Eastman Kodak Company

    发明人： David B. Bailey ,  Charles W. Lander

    IPC分类号： G03F007/038

    CPC分类号： B41C1/1008 ,  B41C2210/04 ,  B41C2210/08 ,  B41C2210/22 ,  B41C2210/24 ,  Y10S430/145 ,  Y10S430/146 ,  Y10S430/165

    摘要： A negative-working imaging member can be used as a lithographic printing plate without ablation. The imaging member comprises a support and an imaging layer that includes a dispersion of at least 0.05 g/m2 of a cyanoacrylate polymer that is thermally degradable below 200null C., a photothermal conversion material that is present in an amount to provide a dry weight ratio to the cyanoacrylate polymer of from about 0.02:1 to about 0.8:1, and a hydrophilic binder to provide a dry weight ratio of a hydrophilic binder to the cyanoacrylate polymer of up to 1:1. Thermal imaging energy causes the exposed areas of the imaging layer to adhere to the support while unexposed areas can be readily washed off and/or simultaneously inked for press runs.

    摘要翻译： 负性成像构件可以用作平版印刷版而不进行消融。 成像构件包括载体和成像层，该成像层包括至少0.05g / m 2的在200℃以下可热降解的氰基丙烯酸酯聚合物的分散体，光热转化材料以提供干重的量存在 与氰基丙烯酸酯聚合物的比例为约0.02:1至约0.8:1，以及亲水性粘合剂，以提供高达1:1的亲水性粘合剂与氰基丙烯酸酯聚合物的干重比。 热成像能量使得成像层的暴露区域粘附到支撑件上，而未曝光的区域可以容易地被冲洗和/或同时着墨以进行印刷。

    Photosensitive resin composition and printed wiring board
    100.
    发明申请
    Photosensitive resin composition and printed wiring board 审中-公开
    感光树脂组合物和印刷线路板

    公开(公告)号：US20030064304A1

    公开(公告)日：2003-04-03

    申请号：US10244959

    申请日：2002-09-17

    发明人： Takao Ono ,  Ichiro Miura ,  Yasuyuki Hasegawa

    IPC分类号： G03F007/038

    CPC分类号： G03F7/038 ,  G03F7/032 ,  G03F7/033

    摘要： Disclosed is a photosensitive resin composition for use as a solder resist, which is free from anti-tackiness and excellent in flexibility, adhesiveness and heat resistance without other film properties being sacrificed, and can be easily designed so as to obtain properties in conformity with the end use thereof. This photosensitive resin composition comprises (A) an active energy ray-curable resin having at least two ethylenic unsaturated linkages per molecule, (B) a photopolymerization initiator, (C) a reactive diluent, and (D) a thermosetting compound; wherein the component (A) is constituted by a polybasic acid-modified unsaturated monocarboxylic acid-modified composite epoxy resin which is obtained by a process wherein a mixture comprising triglycidyl isocyanurate and a bisphenol type epoxy resin is allowed to react with a radically polymerizable unsaturated monocarboxylic acid to produce a compound having hydroxyl group with which a saturated or unsaturated polybasic acid or a saturated or unsaturated polybasic acid anhydride is reacted. There is also disclosed a printed wiring board formed using the aforementioned photosensitive resin composition.

    摘要翻译： 公开了一种用作阻焊剂的感光性树脂组合物，其没有抗粘着性，并且柔软性，粘合性和耐热性优异，而没有其它膜性能被牺牲，并且可以容易地设计以获得符合 最终用途。 该光敏树脂组合物包含（A）每分子具有至少两个烯键式不饱和键的活性能量射线固化树脂，（B）光聚合引发剂，（C）反应性稀释剂和（D）热固性化合物; 其中组分（A）由多元酸改性的不饱和单羧酸改性复合环氧树脂构成，其通过使含有三缩水甘油基异氰脲酸酯和双酚型环氧树脂的混合物与自由基聚合的不饱和一元羧酸 酸以产生具有羟基的化合物，使饱和或不饱和多元酸或饱和或不饱和多元酸酐反应。 还公开了使用上述感光性树脂组合物形成的印刷线路板。