公开(公告)号：US11122691B2

公开(公告)日：2021-09-14

申请号：US16289984

申请日：2019-03-01

申请人： Ford Motor Company

发明人： Galen Keith Thomas

IPC分类号： H05K3/12 ,  H05K3/32 ,  H05K1/05

摘要： A system for forming a conductive tape trace on a substrate includes a segment feeder arm configured to feed segments of conductive tape to the substrate and a segment placement armature configured to grasp and position the conductive tape segments in a predetermined pattern on the substrate. The conductive tape segments include a plurality of conductive tape bend segments and at least one conductive tape branch segment. The segment placement armature is configured to position and overlap the plurality of conductive tape bend segments on the substrate to form a conductive tape bend and position the at least one conductive tape branch segment in contact with and extending from the conductive tape bend. A roller can be included and be configured to apply a force onto the conductive tape segments positioned on the substrate. A welder that welds the conductive tape segments together can also be included.

公开(公告)号：US11121332B2

公开(公告)日：2021-09-14

申请号：US16410271

申请日：2019-05-13

申请人： KunShan Go-Visionox Opto-Electronics Co., Ltd.

发明人： Gang Wang ,  Lu Zhang ,  Zhenzhen Han ,  Siming Hu ,  Hui Zhu

IPC分类号： H01L51/00 ,  H01L27/32 ,  H05K1/02 ,  H05K1/11 ,  H05K3/32 ,  G09F9/33 ,  G09F9/30 ,  H01L27/12

摘要： The present application provides a foldable array substrate, a preparation method thereof and a display device. The foldable array substrate includes a base substrate, a gate metal layer disposed on one side of the base substrate, a source-drain metal layer disposed on the side of the gate metal layer opposite to the base substrate, and an insulating layer disposed between the gate metal layer and the source-drain metal layer. A plurality of holes are disposed on the foldable array substrate, and the holes are disposed between adjacent pixel units of a plurality of pixel units, and extend from the side of the insulating layer opposite to the base substrate toward the base substrate.

公开(公告)号：US20210282273A1

公开(公告)日：2021-09-09

申请号：US17030521

申请日：2020-09-24

申请人： HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. ,  Avary Holding (Shenzhen) Co., Limited.

发明人： YANG LI ,  YAN-LU LI

IPC分类号： H05K3/34 ,  H05K3/32 ,  H05K3/02 ,  H05K3/00

摘要： A composite circuit board includes a composite circuit board unit, a first solder mask formed on a first metal protection layer of the composite circuit board unit, and a second solder mask formed on a second metal protection layer of the composite circuit board unit. Two ends of a first outer conductive circuit are bent back toward each other and spaced apart a predetermined distance to form a first window. Two ends of a second outer conductive circuit are bent back toward each other and spaced apart a predetermined distance to form a second window.

公开(公告)号：US11114774B2

公开(公告)日：2021-09-07

申请号：US16689240

申请日：2019-11-20

申请人： SAMSUNG DISPLAY CO., LTD.

发明人： Dae Hyuk Im ,  Byoung Yong Kim

IPC分类号： H01R4/04 ,  H05K1/18 ,  H01R43/00 ,  H05K3/32

摘要： A display device includes a display panel. A flexible printed circuit board is electrically connected to the display panel. A first pad is disposed on the display panel. A second pad is disposed on the flexible printed circuit board and overlaps the first pad. A first anisotropic conductive film is disposed between the first pad and the second pad. The first anisotropic conductive film is configured to bond the first pad to the second pad. The first anisotropic conductive film includes a conductive polymer. The first anisotropic conductive film includes at least one first conductive region that electrically connects the first pad and the second pad and at least one first insulating region.

公开(公告)号：US20210263367A1

公开(公告)日：2021-08-26

申请号：US17161953

申请日：2021-01-29

申请人： Samsung Display Co., LTD.

发明人： JINGWAN JANG ,  HO SUP CHOI ,  SUNGWOO LEE ,  KYUNG-HWA LIM

IPC分类号： G02F1/1345 ,  H05K1/18 ,  G02F1/1362 ,  H05K3/32

摘要： A display device includes a first substrate, a second substrate facing the first substrate, and a sealing layer respectively including first, second and third side surfaces coplanar with each other; a first recess defined recessed from each of the first side surface, the second side surface and the third side surface; a first conductive pattern in the first recess; and a first driver facing each of the first side surface, the second side surface and the third side surface. At the first recess: the first conductive pattern is exposed to outside the first substrate, the second substrate and the sealing layer, and the first driver is electrically connected to the first conductive pattern.

公开(公告)号：US20210251084A1

公开(公告)日：2021-08-12

申请号：US16973529

申请日：2019-06-12

申请人： Linxens Holding

发明人： Christophe MATHIEU

IPC分类号： H05K3/32

摘要： The invention relates to a process for manufacturing a roll of flexible carrier bearing electronic components. This process includes a step consisting in adding, to this flexible carrier, electronic components, themselves manufactured from a roll of flexible initial substrate. For example, the electronic components may be manufactured on an initial substrate having a width allowing advantage to be taken of densification of the manufacture of the components on this initial substrate. Subsequently, the singulated electronic components are added to the flexible carrier, allowing, for example, packaging that is more suitable, than possible with the initial substrate, to a use of the electronic components, notably when the latter must be integrated into a chip-card. Thus, for example, the flexible carrier may be, or include, an adhesive, which may or may not be conductive, and which is used to fasten, and optionally connect, each electronic component to a chip-card.

公开(公告)号：US20210249190A1

公开(公告)日：2021-08-12

申请号：US17143253

申请日：2021-01-07

申请人： Murata Manufacturing Co., Ltd.

发明人： Yasuhiro NISHISAKA

IPC分类号： H01G4/232 ,  H01G4/30 ,  H05K3/32

摘要： An electronic component includes a body, an inner electrode within the body, and an outer electrode outside of the body, wherein the outer electrode includes an outermost layer that includes metal particles but is not electrically connected to the inner electrode.

公开(公告)号：US11075309B2

公开(公告)日：2021-07-27

申请号：US15896418

申请日：2018-02-14

申请人： HENKEL AG & CO. KGAA

发明人： Chao Zhang ,  Qili Wu ,  Anja Henckens ,  Rudolf Oldenzijl ,  Liesbeth Theunissen ,  Gunther Dreezen ,  Bart Van Remoortere ,  Jing Yang

IPC分类号： H01L31/0224 ,  H01B1/22 ,  H01L31/02 ,  H01L31/18 ,  H05K3/32 ,  H01L31/072

摘要： The present invention relates to a conductive paste composition for solar photovoltaic cells comprising metal particles dispersed in a suitable carrier therefor, wherein said carrier comprises a solvent and a resin, and wherein at least a portion of said metal particles are characterized by having a ψ value, as defined by X-ray diffraction

公开(公告)号：US11057992B2

公开(公告)日：2021-07-06

申请号：US16720242

申请日：2019-12-19

申请人： Mikuni Electron Corporation

发明人： Sakae Tanaka

IPC分类号： H05K1/00 ,  H05K1/02 ,  H05K1/09 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H01L21/00 ,  H01L21/02 ,  H01L21/50 ,  H01L21/56 ,  H01L21/60 ,  H01L23/48 ,  H01L23/485 ,  H01L23/498 ,  H05K1/03 ,  H05K3/10

摘要： A method for manufacturing connection structure, the method includes arranging conductive particles and a first composite on a first electrode located on a first surface of a first member, arranging a second composite on a region other than the first electrode of the first surface, arranging the first surface and a second surface of a second member where a second electrode is located, so that the first electrode and the second electrode are opposed to each other, pressing the first member and the second member; and curing the first composite and the second composite.

公开(公告)号：US11049842B2

公开(公告)日：2021-06-29

申请号：US16247957

申请日：2019-01-15

申请人： DEXERIALS CORPORATION

发明人： Yasushi Akutsu

IPC分类号： H01L23/00 ,  C09J9/02 ,  H05K1/02 ,  H05K3/32 ,  H01L23/544 ,  C09D163/00 ,  G02F1/1345 ,  C09J7/10 ,  G02F1/1333 ,  C09J171/12 ,  G02F1/133 ,  G02F1/1339 ,  G02F1/1343

摘要： An alignment mark at a position that overlaps an area in which an anisotropic conductive film is pasted, and to accurately perform alignment using an image captured by a camera. An alignment method in which an electronic component is mounted on the obverse surface of a transparent substrate with a conductive adhesive agent interposed therebetween, a substrate-side alignment mark and a component-side alignment mark are adjusted from the captured image, and the position at which the electronic component is mounted on the transparent substrate is aligned, wherein in the conductive adhesive agent, conductive particles are in a regular arrangement as viewed from a planar perspective, and in the captured image, the outside edges of the alignment marks exposed between the conductive particles are intermittently visible as line segments (S) along the imaginary line segments of the outside edges of the alignment mark.