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    ELECTRICALLY CONDUCTIVE ADHESIVES COMPRISING SILVER-COATED PARTICLES
    2.
    发明申请
    ELECTRICALLY CONDUCTIVE ADHESIVES COMPRISING SILVER-COATED PARTICLES 有权
    包含银涂层颗粒的导电粘合剂

    公开(公告)号：US20140178671A1

    公开(公告)日：2014-06-26

    申请号：US14190762

    申请日：2014-02-26

    申请人： HENKEL AG & CO. KGAA

    发明人： Gunther Dreezen ,  Liesbeth Theunissen ,  Anja Henckens

    IPC分类号： C09J9/02 ,  B32B7/12

    CPC分类号： B32B7/12 ,  C08G59/184 ,  C08K3/08 ,  C08K9/02 ,  C08L63/00 ,  C09J9/02 ,  C09J163/00 ,  H01R4/04 ,  Y10T428/25

    摘要： The present invention relates to adhesives that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, passive components, solar cells, solar modules, and/or light emitting diodes. The adhesive of the present invention comprises one or more epoxy resins, silver-coated particles having a silver content of 2 to 30 wt.-%, based on the total amount of the silver-coated particles, and one or more amine-epoxy adducts, comprising one or more functional groups, each derived from an alkyl-substituted nitrogen-containing heterocycle.

    摘要翻译： 本发明涉及适用于制造电子器件，集成电路，半导体器件，无源元件，太阳能电池，太阳能模块和/或发光二极管中的导电材料的粘合剂。 本发明的粘合剂包含一种或多种环氧树脂，基于银涂覆颗粒的总量，银含量为2-30重量％的银涂覆颗粒，以及一种或多种胺 - 环氧加合物 ，其包含一个或多个官能团，各自衍生自烷基取代的含氮杂环。

    CURING A HEAT-CURABLE MATERIAL IN AN EMBEDDED CURING ZONE
    5.
    发明申请
    CURING A HEAT-CURABLE MATERIAL IN AN EMBEDDED CURING ZONE 审中-公开
    在嵌入式固化区内固化热固性材料

    公开(公告)号：US20150367560A1

    公开(公告)日：2015-12-24

    申请号：US14650084

    申请日：2013-12-17

    申请人： NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO ,  HENKEL AG & CO. KGAA

    发明人： Jeroen van den Brand ,  Ashok Sridhar ,  Anja Henckens ,  Gunther Dreezen

    IPC分类号： B29C65/14 ,  H05B3/00 ,  B29C65/48 ,  B29C65/22 ,  B29C65/24

    摘要： The present disclosure relates to a method for curing a heat-curable material (1) in an embedded curing zone (2) and an assembly resulting from such method. The method comprises providing a heat-conducting strip (3) partially arranged between a component (9) and a substrate (10) that form the embedded curing zone (2) therein between. The heat-conducting strip (3) extends from the embedded curing zone (2) to a radiation-accessible zone (7) that is distanced from the embedded curing zone (2) and at least partially free of the component (9) and the substrate (10). The method further comprises irradiating the heat-conducting strip (3) in the radiation-accessible zone (7) by means of electromagnetic radiation (6). Heat (4a) generated by absorption of the electromagnetic radiation (6) in the heat-conducting strip (3) is conducted from the radiation-accessible zone (7) along a length of the heat-conducting strip (3) to the embedded curing zone (2) to cure the heat-curable material (1) by conducted heat (4b) emanating from the heat-conducting strip (3) into the embedded curing zone (2).

    摘要翻译： 本公开涉及一种用于固化嵌入固化区（2）中的可热固化材料（1）的方法和由该方法得到的组合物。 该方法包括提供部分地布置在组件（9）和衬底（10）之间的导热条（3），所述基底（10）在其间形成嵌入的固化区（2）。 导热条（3）从嵌入的固化区（2）延伸到远离嵌入的固化区（2）并且至少部分地不含组分（9）的辐射可接近区（7）和 基板（10）。 该方法还包括通过电磁辐射（6）照射辐射可接近区域（7）中的导热条带（3）。 通过吸收导热带（3）中的电磁辐射（6）产生的热（4a）从辐射可接近区（7）沿导热带（3）的长度传导到嵌入固化 （2）通过从导热带（3）发射到嵌入的固化区（2）中的传热（4b）来固化可热固化材料（1）。

    Curing a heat-curable material in an embedded curing zone
    7.
    发明授权
    Curing a heat-curable material in an embedded curing zone 有权

    公开(公告)号：US10717236B2

    公开(公告)日：2020-07-21

    申请号：US14650084

    申请日：2013-12-17

    申请人： Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO ,  Henkel AG & Co. KGaA

    发明人： Jeroen van den Brand ,  Ashok Sridhar ,  Anja Henckens ,  Gunther Dreezen

    IPC分类号： B29C65/14 ,  H01L23/00 ,  B29C65/22 ,  B29C65/24 ,  B29C65/48 ,  H05B3/00 ,  B29K101/10 ,  B29L9/00

    摘要： The present disclosure relates to a method for curing a heat-curable material (1) in an embedded curing zone (2) and an assembly resulting from such method. The method comprises providing a heat-conducting strip (3) partially arranged between a component (9) and a substrate (10) that form the embedded curing zone (2) therein between. The heat-conducting strip (3) extends from the embedded curing zone (2) to a radiation-accessible zone (7) that is distanced from the embedded curing zone (2) and at least partially free of the component (9) and the substrate (10). The method further comprises irradiating the heat-conducting strip (3) in the radiation-accessible zone (7) by means of electromagnetic radiation (6). Heat (4a) generated by absorption of the electromagnetic radiation (6) in the heat-conducting strip (3) is conducted from the radiation-accessible zone (7) along a length of the heat-conducting strip (3) to the embedded curing zone (2) to cure the heat-curable material (1) by conducted heat (4b) emanating from the heat-conducting strip (3) into the embedded curing zone (2).

    SUBMICRON SILVER PARTICLE INK COMPOSITIONS, PROCESS AND APPLICATIONS
    9.
    发明申请
    SUBMICRON SILVER PARTICLE INK COMPOSITIONS, PROCESS AND APPLICATIONS 审中-公开
    亚硫酸盐颗粒墨水组合物，工艺和应用

    公开(公告)号：US20160160067A1

    公开(公告)日：2016-06-09

    申请号：US15044250

    申请日：2016-02-16

    申请人： Henkel IP & Holding GmbH ,  Henkel AG & Co. KGaA

    发明人： Bo Xia ,  Rudolf W. Oldenzijl ,  Jianping Chen ,  Gunther Dreezen

    IPC分类号： C09D11/52 ,  C22C5/06 ,  H01B1/02 ,  G06F3/041

    CPC分类号： C09D11/52 ,  C09D5/24 ,  C09D11/10 ,  C22C5/06 ,  G06F3/0412 ,  G06F2203/04103 ,  H01B1/02 ,  H01B1/22 ,  H05K1/095 ,  H05K1/097 ,  H05K2201/0108 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/10128

    摘要： Provided herein are conductive ink compositions having a good balance between adhesion to substrate, stability of submicron-sized particles, the ability to be sintered at relatively low temperatures, and good electrical conductivity. In one aspect, there are provided conductive networks prepared from compositions according to the present invention. In certain aspects, such conductive networks are suitable for use in touch panel displays. In certain aspects, the invention relates to methods for adhering submicron silver particles to a non-metallic substrate. In certain aspects, the invention relates to methods for improving the adhesion of a submicron silver-filled composition to a non-metallic substrate.

    摘要翻译： 本文提供的导电油墨组合物在与基材的粘附性，亚微米尺寸颗粒的稳定性，在相对低的温度下烧结的能力和良好的导电性之间具有良好的平衡。 在一个方面，提供了由根据本发明的组合物制备的导电网络。 在某些方面，这种导电网络适用于触摸面板显示器。 在某些方面，本发明涉及将亚微米银颗粒粘附到非金属基底上的方法。 在某些方面，本发明涉及用于改善亚微米填充银的组合物与非金属基底的粘附性的方法。