Integrated bound-mode spectral/angular sensors

    公开(公告)号:US10408673B2

    公开(公告)日:2019-09-10

    申请号:US15706440

    申请日:2017-09-15

    Applicant: STC.UNM

    Abstract: A 2-D sensor array includes a semiconductor substrate and a plurality of pixels disposed on the semiconductor substrate. Each pixel includes a coupling region and a junction region, and a slab waveguide structure disposed on the semiconductor substrate and extending from the coupling region to the region. The slab waveguide includes a confinement layer disposed between a first cladding layer and a second cladding layer. The first cladding and the second cladding each have a refractive index that is lower than a refractive index of the confinement layer. Each pixel also includes a coupling structure disposed in the coupling region and within the slab waveguide. The coupling structure includes two materials having different indices of refraction arranged as a grating defined by a grating period. The junction region comprises a p-n junction in communication with electrical contacts for biasing and collection of carriers resulting from absorption of incident radiation.

    Reliability enhancement methods for physically unclonable function bitstring generation

    公开(公告)号:US10366253B2

    公开(公告)日:2019-07-30

    申请号:US15534116

    申请日:2015-12-15

    Applicant: STC.UNM

    Abstract: A Hardware-Embedded Delay Physical Unclonable Function (“HELP PUF”) leverages entropy by monitoring path stability and measuring path delays from core logic macros. Reliability and security enhancing techniques for the HELP PUF reduce bit flip errors during regeneration of the bitstring across environmental variations and improve cryptographic strength along with the corresponding difficulty of carrying out model building attacks. A voltage-based enrollment process screens unstable paths on normally synthesized (glitchy) functional units and reduces bit flip errors by carrying out enrollment at multiple supply voltages controlled using on-chip voltage regulators.

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