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    LOW RISE CAMERA MODULE
    101.
    发明申请
    LOW RISE CAMERA MODULE 有权
    低照度摄像机模块

    公开(公告)号：US20120276951A1

    公开(公告)日：2012-11-01

    申请号：US13096659

    申请日：2011-04-28

    Applicant: Steven Webster ,  Thomas B. Templeton

    Inventor： Steven Webster ,  Thomas B. Templeton

    IPC: H04N5/225 ,  H05K3/30 ,  H04M1/00

    CPC classification number: H05K1/021 ,  H01L2224/48091 ,  H04M1/0264 ,  H04N5/2257 ,  H05K2201/10121 ,  Y10T29/4913 ,  H01L2924/00014

    Abstract: A printed circuit carrier has an opening therein against which a back plate is attached to thereby form a cavity. An image sensor device is attached to the back plate inside the cavity. The height of the image sensor device is about equal to or less than the height of the cavity. Electrical signal connections are formed between the image sensor device and the printed circuit carrier. A cap is attached directly to the carrier by a flowable adhesive layer, to seal off the cavity. Other embodiments are also described and claimed.

    Abstract translation: 印刷电路载体具有开口，背板附接到开口，从而形成空腔。 图像传感器装置安装在腔内的背板上。 图像传感器装置的高度大约等于或小于空腔的高度。 在图像传感器装置和印刷电路载体之间形成电信号连接。 帽通过可流动的粘合剂层直接附接到载体上，以密封空腔。 还描述和要求保护其他实施例。

    Image sensor chip package
    103.
    发明授权
    Image sensor chip package 失效
    图像传感器芯片封装

    公开(公告)号：US07554184B2

    公开(公告)日：2009-06-30

    申请号：US11448570

    申请日：2006-06-07

    Applicant: Steven Webster ,  Ying-Cheng Wu

    Inventor： Steven Webster ,  Ying-Cheng Wu

    IPC: H01L23/02 ,  H01L23/48

    CPC classification number: H01L27/14618 ,  H01L27/14683 ,  H01L31/0203 ,  H01L2224/32014 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/16195 ,  H01L2924/00014

    Abstract: A chip package (200) includes a carrier (20), a chip (22), a second conductive means (26) and a transparent cover (28). The carrier (20) includes a base (24). The chip is mounted on the base and has an active area (222). The second conductive means electronically connects the chip with the conductive means. The first adhesive means is applied around the active area of the chip. The transparent cover is mounted to the base of the carrier. The cover is adhered with the first adhesive means so as to define a sealing space (32) for sealing the active area of the chip therein. It can be seen that the active area of the chip is sufficiently protected from pollution by the small volume of the sealing space.

    Abstract translation: 芯片封装（200）包括载体（20），芯片（22），第二导电装置（26）和透明盖（28）。 载体（20）包括基座（24）。 芯片安装在基座上并具有有源区域（222）。 第二导电装置将芯片与导电装置电连接。 第一粘合装置被施加在芯片的有效区域周围。 透明盖安装在托架的底座上。 该盖用第一粘合装置粘合以便限定用于密封芯片的有效区域的密封空间（32）。 可以看出，芯片的有效面积被充分保护，免受小体积密封空间的污染。

    Digital camera module with improved image quality
    104.
    发明授权
    Digital camera module with improved image quality 有权
    具有改善图像质量的数码相机模块

    公开(公告)号：US07460317B2

    公开(公告)日：2008-12-02

    申请号：US11450649

    申请日：2006-06-09

    Applicant: Steven Webster ,  Ying-Cheng Wu ,  Ching-Lung Jao

    Inventor： Steven Webster ,  Ying-Cheng Wu ,  Ching-Lung Jao

    IPC: G02B7/02

    CPC classification number: G02B7/02

    Abstract: A digital camera module (100) includes a lens barrel (20), a lens holder (22), an image pick-up module (26), and a protective member. The lens barrel defines a central hollow, and has at least one lens (202) received therein. The lens holder defines a central hollow. The lens barrel is movably received in the lens holder along an axis of the lens holder. The image pick-up module is arranged to receive light from the lenses. The protective member is configured for preventing dust and/or particle contamination associated with a relative movement of the lens barrel and the lens holder falling onto the image pick-up module.

    Abstract translation: 数码相机模块（100）包括镜筒（20），透镜保持架（22），图像拾取模块（26）和保护构件。 透镜筒限定中心空腔，并且其中容纳有至少一个透镜（202）。 透镜架定义中心空心。 透镜镜筒沿透镜保持器的轴线可移动地容纳在透镜保持器中。 图像拾取模块被布置成接收来自透镜的光。 保护构件被配置为防止与透镜镜筒和透镜保持器落在图像拾取模块上的相对运动相关联的灰尘和/或颗粒污染。

    LENS MODULE AND DIGITAL CAMERA MODULE USING SAME
    105.
    发明申请
    LENS MODULE AND DIGITAL CAMERA MODULE USING SAME 有权
    镜头模块和数码相机模块

    公开(公告)号：US20080100934A1

    公开(公告)日：2008-05-01

    申请号：US11682275

    申请日：2007-03-05

    Applicant: STEVEN WEBSTER ,  YING-CHENG WU ,  CHUN-HUNG LIN

    Inventor： STEVEN WEBSTER ,  YING-CHENG WU ,  CHUN-HUNG LIN

    IPC: G02B7/02

    CPC classification number: G02B7/021 ,  G02B7/023 ,  G02B7/025 ,  H04N5/2257

    Abstract: A digital camera module (100) includes a lens module (20) and a chip package (50) mounted in a light path of the lens module. The lens module includes a first lens assembly (21) and a second lens assembly (23). The first lens assembly includes a first fixture (211) having a through hole (212) defined therein and at least one lens (218) received in the through hole. The second assembly includes a second fixture (23) having a through hole (232) defined therein and at least one lens (238) attached therein. One of the first fixture and the second fixture has a slotted annular ring (213) protruding therefrom with an annular slot (214) defined therein. The other has a male annular ring (235) extending therefrom, and the slotted annular ring and the male annular ring matingly engage with each other to fix the first lens assembly and second assembly together.

    Abstract translation: 数字照相机模块（100）包括安装在透镜模块的光路中的透镜模块（20）和芯片封装（50）。 透镜模块包括第一透镜组件（21）和第二透镜组件（23）。 第一透镜组件包括其中限定有通孔（212）的第一固定件（211）和容纳在通孔中的至少一个透镜（218）。 第二组件包括具有限定在其中的通孔（232）的第二固定件（23）和附接在其中的至少一个透镜（238）。 第一固定装置和第二固定装置之一具有从其中突出的开槽环形圈（213），其中限定有环形槽（214）。 另一个具有从其延伸的阳环形环（235），并且开槽的环形环和阳环形环彼此配合地接合以将第一透镜组件和第二组件固定在一起。

    Image sensor chip packaging method
    106.
    发明申请
    Image sensor chip packaging method 有权
    图像传感器芯片封装方法

    公开(公告)号：US20070126916A1

    公开(公告)日：2007-06-07

    申请号：US11595331

    申请日：2006-11-10

    Applicant: Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

    Inventor： Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

    IPC: H04N5/225

    CPC classification number: H04N5/2254 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2924/01079 ,  H01L2924/16195 ,  H04N5/2253 ,  H01L2924/00014

    Abstract: An image sensor chip packaging method includes: first, providing a carrier (20). The carrier includes a base (21) and a lead frame (23). The base has a chamber (214) defined therein. The lead frame has a plurality of conduction pieces (233). The conduction pieces of the lead frame are embedded in the base and are spaced from each other. An image sensor chip (30) is then mounted in the chamber. The image sensor has a photosensitive area (301) and a plurality of chip pads (302). A plurality of bonding wires (40) is then provided. Each wire electrically connects a corresponding chip pad of the image sensor chip and one of the exposed ends of a corresponding conduction piece of the carrier. A holder (50) having a holding cavity (54) is then provided. Finally, the carrier is then mounted in the holding cavity of the holder.

    Abstract translation: 图像传感器芯片封装方法包括：首先提供载体（20）。 载体包括基座（21）和引线框架（23）。 底座具有限定在其中的腔室（214）。 引线框架具有多个导电件（233）。 引线框架的导电片嵌入基座并彼此间隔开。 然后将图像传感器芯片（30）安装在腔室中。 图像传感器具有感光区域（301）和多个芯片焊盘（302）。 然后提供多个接合线（40）。 每根线将图像传感器芯片的相应的芯片焊盘和载体的相应导电片的暴露端之一电连接。 然后提供具有保持腔（54）的保持器（50）。 最后，将载体安装在支架的保持腔中。

    Digital camera module with improved image quality
    107.
    发明申请
    Digital camera module with improved image quality 有权
    具有改善图像质量的数码相机模块

    公开(公告)号：US20070008631A1

    公开(公告)日：2007-01-11

    申请号：US11450649

    申请日：2006-06-09

    Applicant: Steven Webster ,  Ying-Cheng Wu ,  Ching-Lung Jao

    Inventor： Steven Webster ,  Ying-Cheng Wu ,  Ching-Lung Jao

    IPC: G02B7/02

    CPC classification number: G02B7/02

    Abstract: A digital camera module (100) includes a lens barrel (20), a lens holder (22), an image pick-up module (26), and a protective member. The lens barrel defines a central hollow, and has at least one lens (202) received therein. The lens holder defines a central hollow. The lens barrel is movably received in the lens holder along an axis of the lens holder. The image pick-up module is arranged to receive light from the lenses. The protective member is configured for preventing dust and/or particle contamination associated with a relative movement of the lens barrel and the lens holder falling onto the image pick-up module.

    Abstract translation: 数码相机模块（100）包括镜筒（20），透镜保持架（22），图像拾取模块（26）和保护构件。 透镜筒限定中心空腔，并且其中容纳有至少一个透镜（202）。 透镜架定义中心空心。 透镜镜筒沿透镜保持器的轴线可移动地容纳在透镜保持器中。 图像拾取模块被布置成接收来自透镜的光。 保护构件被配置为防止与透镜镜筒和透镜保持器落在图像拾取模块上的相对运动相关联的灰尘和/或颗粒污染。

    Method, system and program for the transmission of modbus messages between networks
    109.
    发明授权
    Method, system and program for the transmission of modbus messages between networks 有权
    在网络之间传输modbus消息的方法，系统和程序

    公开(公告)号：US07051143B2

    公开(公告)日：2006-05-23

    申请号：US09888158

    申请日：2001-06-25

    Applicant: William A. White, III ,  Steven Webster ,  Randy Dircks ,  Ken Wester

    Inventor： William A. White, III ,  Steven Webster ,  Randy Dircks ,  Ken Wester

    IPC: G06F13/14

    CPC classification number: G05B19/4185 ,  G05B2219/31121 ,  G05B2219/31122 ,  G05B2219/31369 ,  H04L12/4625 ,  H04L29/12849 ,  H04L49/90 ,  H04L61/6027 ,  H04L2012/40228 ,  H04L2012/4026 ,  Y02P90/18

    Abstract: The present invention is directed to facilitating communication within an automation system having a plurality of networks and network protocols. Specifically, a Modbus network is operably connected to a network. A fieldbus coupler operably connected to both networks having a program facilitates communication within the automation system wherein devices connected to the network can be accessed for monitoring and/or controlling via Modbus commands. The fieldbus coupler (FBC) program accepts a Modbus function code containing one or more embedded message of varying types. The FBC program using additional information contained in the Modbus function code and the message type reads or writes only the required information to and from the field devices. This specific read or write request of the information and the embedding of more than one message type reduces overhead and bandwidth usage, thus improving bus response time and efficiency.

    Abstract translation: 本发明旨在促进具有多个网络和网络协议的自动化系统内的通信。 具体来说，Modbus网络可操作地连接到网络。 可操作地连接到具有程序的两个网络的现场总线耦合器有助于自动化系统内的通信，其中连接到网络的设备可被访问以通过Modbus命令进行监视和/或控制。 现场总线耦合器（FBC）程序接受包含一个或多个不同类型的嵌入式消息的Modbus功能代码。 使用Modbus功能代码中包含的附加信息的FBC程序和消息类型只读取或写入现场设备所需的信息。 该信息的特定读或写请求和多个消息类型的嵌入减少了开销和带宽使用，从而提高了总线响应时间和效率。

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