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    Sealed Button for an Electronic Device
    104.
    发明申请
    Sealed Button for an Electronic Device 审中-公开
    电子设备的密封按钮

    公开(公告)号：US20160225551A1

    公开(公告)日：2016-08-04

    申请号：US14917552

    申请日：2013-09-10

    Applicant: APPLE INC.

    Inventor： Anna-Katrina Shedletsky

    IPC: H01H13/06

    CPC classification number: H01H13/06 ,  H01H2215/004 ,  H03K17/9625 ,  H03K17/965

    Abstract: One embodiment of the disclosure includes an electronic device including an enclosure (214), a button (106), and a processing element (not shown). The button is connected to the enclosure and includes a button cap (234) defining a user input surface, a flexible member (238) having an interior surface (270) and exterior surface. The flexible member is aligned with the button cap and is connected thereto. The button further includes a strain sensor (244) connected to the interior surface of the flexible member, the strain sensor is in communication with the processing element. When a force is exerted on the button cap, the flexible member bends and the strain sensor detects a user input corresponding to the force and provides a signal to the processing element corresponding to the user input. In some embodiments, the button may be substantially or completely waterproof.

    Abstract translation: 本公开的一个实施例包括包括外壳（214），按钮（106）和处理元件（未示出）的电子设备。 按钮连接到外壳并且包括限定用户输入表面的按钮帽（234），具有内表面（270）和外表面的柔性构件（238）。 柔性构件与按钮盖对准并与其连接。 按钮还包括连接到柔性构件的内表面的应变传感器（244），应变传感器与处理元件连通。 当力量施加在按钮帽上时，柔性构件弯曲并且应变传感器检测到与力相对应的用户输入，并向对应于用户输入的处理元件提供信号。 在一些实施例中，按钮可以是基本上或完全防水的。

    REDUCING OR ELIMINATING BOARD-TO-BOARD CONNECTORS
    107.
    发明申请
    REDUCING OR ELIMINATING BOARD-TO-BOARD CONNECTORS 审中-公开
    减少或消除板对板连接器

    公开(公告)号：US20160029503A1

    公开(公告)日：2016-01-28

    申请号：US14641321

    申请日：2015-03-07

    Applicant: Apple Inc.

    Inventor： Anna-Katrina Shedletsky ,  Fletcher R. Rothkopf ,  Samuel B. Weiss

    IPC: H05K7/02

    CPC classification number: H05K1/189 ,  H05K1/147 ,  H05K2201/055

    Abstract: Embodiments of the present disclosure provide a circuit board in which the need for board-to-board connectors is substantially reduced or eliminated. Specifically embodiments disclosed herein describe a flexible substrate for use with a computing device. A first module is surface mounted on a first side of the flexible substrate and a second module is surface mounted on a second side of the flexible substrate. A rigid circuit board is coupled to either the first side of the flexible substrate or the second side of the flexible substrate. Further, the flexible substrate is bendable such that at least one of the first module and the second module are positionable with respect to the rigid circuit board and with respect to the other of the first module and the second module.

    Abstract translation: 本公开的实施例提供了一种电路板，其中基本上减少或消除了对板对板连接器的需要。 本文公开的具体实施例描述了一种用于计算设备的柔性基板。 第一模块表面安装在柔性基板的第一侧上，第二模块表面安装在柔性基板的第二侧上。 刚性电路板耦合到柔性基板的第一侧或柔性基板的第二侧。 此外，柔性基板是可弯曲的，使得第一模块和第二模块中的至少一个可相对于刚性电路板和相对于第一模块和第二模块中的另一个定位。

    Electronic device signal routing structures with conductive adhesive
    108.
    发明授权
    Electronic device signal routing structures with conductive adhesive 有权
    电子设备信号路由结构与导电胶

    公开(公告)号：US09223424B2

    公开(公告)日：2015-12-29

    申请号：US13858746

    申请日：2013-04-08

    Applicant: Apple Inc.

    Inventor： Erik G. de Jong ,  Anna-Katrina Shedletsky ,  Fletcher R. Rothkopf

    IPC: G06F3/041 ,  G02F1/1345 ,  G02F1/1335 ,  G02F1/1333

    CPC classification number: G06F3/041 ,  G02F1/133308 ,  G02F1/13338 ,  G02F1/133608 ,  G02F1/13452 ,  G06F2203/04103

    Abstract: An electronic device may have structures that are coupled together using conductive adhesive such as anisotropic conductive film and other adhesives. The structures that are coupled together may include a touch sensor structure formed from electrodes on the inner surface of a display cover layer, a display module having display layers such as a thin-film transistor layer, and circuitry mounted on substrates such as printed circuits. Conductive signal path structures may be used in routing signals within the electronic device. The conductive signal path structures may be formed from pins that are embedded within injection molded plastic, from metal traces such as laser-deposited metal traces that are formed on the surface of a plastic member or other dielectric, from metal structures that run within channels in a plastic, printed circuit traces, and other signal path structures.

    Abstract translation: 电子设备可以具有使用诸如各向异性导电膜和其它粘合剂的导电粘合剂耦合在一起的结构。 耦合在一起的结构可以包括由显示覆盖层的内表面上的电极形成的触摸传感器结构，具有诸如薄膜晶体管层的显示层的显示模块以及安装在诸如印刷电路的基板上的电路。 导电信号路径结构可用于电子设备内的路由信号。 导电信号路径结构可以由嵌入在注射成型塑料中的销钉形成，从金属轨迹（例如形成在塑料构件或其它电介质的表面上的激光沉积金属迹线）与在金属结构内运行的金属结构形成 塑料，印刷电路迹线和其他信号路径结构。

    Wireless Electronic Device With Magnetic Shielding Layer
    109.
    发明申请
    Wireless Electronic Device With Magnetic Shielding Layer 有权
    带有屏蔽层的无线电子设备

    公开(公告)号：US20150351292A1

    公开(公告)日：2015-12-03

    申请号：US14503024

    申请日：2014-09-30

    Applicant: Apple Inc.

    Inventor： Alvin T. Chang ,  Anna-Katrina Shedletsky ,  Peter Kardassakis ,  Katherine E. Tong

    IPC: H05K9/00 ,  H05K7/02 ,  H05K5/00 ,  H01Q7/00

    CPC classification number: H01Q7/06 ,  H01Q1/243 ,  H01Q1/526 ,  H01Q7/00 ,  H05K5/0017 ,  H05K7/02 ,  H05K9/0075

    Abstract: An electronic device may have a housing, electrical components, and other electronic device structures. A display may be mounted in the housing. The display may have a transparent display cover layer and a display layer such as an organic light-emitting diode display layer that is mounted to the underside of the transparent display cover layer. A flexible printed circuit with metal traces may be mounted under the organic light-emitting diode display layer. The metal traces may form coils for a near-field communications inductive loop antenna. A magnetic shielding layer may be interposed between the housing and the flexible printed circuit. The magnetic shielding layer may include a polymer magnetic shielding layer having magnetic material particles embedded in a polymer matrix. The magnetic shielding layer may also have a polymer-binder-free magnetic shielding layer.

    Abstract translation: 电子设备可以具有壳体，电气部件和其他电子设备结构。 显示器可以安装在外壳中。 显示器可以具有透明显示覆盖层和安装在透明显示覆盖层的下侧的诸如有机发光二极管显示层的显示层。 具有金属迹线的柔性印刷电路可以安装在有机发光二极管显示层下面。 金属迹线可以形成用于近场通信感应环形天线的线圈。 磁屏蔽层可以插入在外壳和柔性印刷电路之间。 磁屏蔽层可以包括具有嵌入聚合物基质中的磁性材料颗粒的聚合物磁屏蔽层。 磁屏蔽层也可以具有不含聚合物 - 粘合剂的磁屏蔽层。

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